pdf

Materials Declaration
Package
Body Size
LeadCount
Option
SSOP
5.3 mm
24
Pb Free
Molding Compound
% of Compound
Weight (g)
10
1.15 E-02
85
9.78 E-02
3
3.45 E-03
1.5
1.73 E-03
0.5
5.75 E-04
PPM
61968
526724
18590
9295
3098
Cu
Fe
P
Zn
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
Weight (g)
5.51 E-02
1.33 E-03
1.69 E-05
6.78 E-05
PPM
296605
7149
91
365
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
9.00 E-04
100
PPM
4848
External Leadframe Plating
Weight (g)
% of Plating
100
3.10 E-03
PPM
16699
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Item
Item
Sn
Au
Bond Wires
% of Wire
99.99
Weight (g)
6.20 E-04
PPM
3340
Si
Chip
% of Chip
100
Weight (g)
9.20 E-03
PPM
49558
Die Attach
% of Die Attach
25
75
Weight (g)
7.75 E-05
2.33 E-04
PPM
Item
Resin
Ag Filler
Item
Pb
Cd
Hg
Cr+6
Molding Compound
Method
PPM
<2
US EPA method #3052 & 6010B
Not Detected BS EN 1122:2001 ICP AES
<2
US EPA method #3052 & 7471A
<2
US EPA method #3060A & 6010B
Die Attach Paste
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<5
<5
<5
<5
Not Detected
Not Detected
Method
ICP AES
ICP AES
ICP AES
ICP AES
417
1252
Package Totals
Weight (g)
PPM
1000000
1.86 E-01
AMK-RS-E
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
6/21/04
Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Item
Cu
Fe
P
Zn
SSOP
5.3 mm
24
Sn/Pb
Molding Compound
% of Compound
Weight (g)
10
1.15 E-02
85
9.78 E-02
3
3.45 E-03
1.5
1.73 E-03
0.5
5.75 E-04
PPM
61968
526724
18590
9295
3098
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
PPM
296605
7149
91
365
Weight (g)
5.51 E-02
1.33 E-03
1.69 E-05
6.78 E-05
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
9.00 E-04
100
Sn
Pb
External Leadframe Plating
Weight (g)
% of Plating
85
2.64 E-03
15
4.65 E-04
Item
Molding Compound
PPM
Method
US EPA method #3052 & 6010B
BS EN 1122:2001 ICP AES
US EPA method #3052 & 7471A
US EPA method #3060A & 6010B
Die Attach Paste
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<5
<5
<5
<5
Not Detected
Not Detected
Method
ICP AES
ICP AES
ICP AES
ICP AES
PPM
14194
2505
Bond Wires
% of Wire
99.99
Weight (g)
6.20 E-04
PPM
Si
Chip
% of Chip
100
Weight (g)
9.20 E-03
PPM
49558
Die Attach
% of Die Attach
25
75
Weight (g)
7.75 E-05
2.33 E-04
PPM
Item
PPM
<2
Not Detected
<2
<2
4848
Au
Resin
Ag Filler
Item
Pb
Cd
Hg
Cr+6
3340
417
1252
Package Totals
Weight (g)
PPM
1000000
1.86 E-01
AMK-RS-A
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
6/21/04