Materials Declaration Package Body Size/Pitch LeadCount Option QSOP 150 mils 20 Pb-Free Molding Compound % of Compound 10 85 3 1.5 0.5 Weight (g) 6.09 E-03 5.18 E-02 1.83 E-03 9.14 E-04 3.05 E-04 PPM 50678 430760 15203 7602 2534 Cu Fe P Zn Leadframe % of Leadframe 97.5 2.35 0.03 0.12 Weight (g) 4.91 E-02 1.18 E-03 1.51 E-05 6.05 E-05 PPM 408477 9845 126 503 Ag Internal Leadframe Plating Weight (g) % of Plating 5.56 E-04 100 PPM 4625 External Leadframe Plating % of Plating Weight (g) 2.69 E-03 100 PPM 22382 Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Item Sn Au Bond Wires % of Wire 99.99 Weight (g) 5.25 E-04 PPM 4365 100 Weight (g) 4.85 E-03 PPM 40293 Die Attach % of Die Attach 25 75 Weight (g) 7.84 E-05 2.35 E-04 PPM Chip % of Chip Si Item Resin Ag Filler Item Pb Cd Hg Cr+6 Molding Compound Method PPM <2 US EPA method #3052 & 6010B Not Detected BS EN 1122:2001 ICP AES <2 US EPA method #3052 & 7471A <2 US EPA method #3060A & 6010B Die Attach Paste Item Pb Cd Hg Cr+6 PBB PBDE PPM <5 <5 <5 <5 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES 652 1956 Package Totals PPM Weight (g) 1000000 1.20 E-01 AMK-RQ-B Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 08/06/04 Materials Declaration Package Body Size/Pitch LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Fe P Zn QSOP 150 mils 20 Sn/Pb Molding Compound % of Compound Weight (g) 10 6.09 E-03 85 5.18 E-02 3 1.83 E-03 1.5 9.14 E-04 0.5 3.05 E-04 PPM 50678 430760 15203 7602 2534 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 PPM 408477 9845 126 503 Weight (g) 4.91 E-02 1.18 E-03 1.51 E-05 6.05 E-05 Ag Internal Leadframe Plating Weight (g) % of Plating 5.56 E-04 100 Sn Pb External Leadframe Plating % of Plating Weight (g) 2.29 E-03 85 4.04 E-04 15 Item Au Bond Wires % of Wire 99.99 PPM Item Pb Cd Hg Cr+6 Molding Compound Method PPM <2 US EPA method #3052 & 6010B Not Detected BS EN 1122:2001 ICP AES <2 US EPA method #3052 & 7471A <2 US EPA method #3060A & 6010B Die Attach Paste Item Pb Cd Hg Cr+6 PBB PBDE PPM <5 <5 <5 <5 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES 4625 PPM 19025 3357 Weight (g) 5.25 E-04 PPM 100 Weight (g) 4.85 E-03 PPM 40293 Die Attach % of Die Attach 25 75 Weight (g) 7.84 E-05 2.35 E-04 PPM 4365 Chip % of Chip Si Item Resin Ag Filler 652 1956 Package Totals PPM Weight (g) 1000000 1.20 E-01 AMK-RQ-A Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 08/06/04