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Materials Declaration
Package
Body Size/Pitch
LeadCount
Option
QSOP
150 mils
20
Pb-Free
Molding Compound
% of Compound
10
85
3
1.5
0.5
Weight (g)
6.09 E-03
5.18 E-02
1.83 E-03
9.14 E-04
3.05 E-04
PPM
50678
430760
15203
7602
2534
Cu
Fe
P
Zn
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
Weight (g)
4.91 E-02
1.18 E-03
1.51 E-05
6.05 E-05
PPM
408477
9845
126
503
Ag
Internal Leadframe Plating
Weight (g)
% of Plating
5.56 E-04
100
PPM
4625
External Leadframe Plating
% of Plating
Weight (g)
2.69 E-03
100
PPM
22382
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Item
Item
Sn
Au
Bond Wires
% of Wire
99.99
Weight (g)
5.25 E-04
PPM
4365
100
Weight (g)
4.85 E-03
PPM
40293
Die Attach
% of Die Attach
25
75
Weight (g)
7.84 E-05
2.35 E-04
PPM
Chip
% of Chip
Si
Item
Resin
Ag Filler
Item
Pb
Cd
Hg
Cr+6
Molding Compound
Method
PPM
<2
US EPA method #3052 & 6010B
Not Detected BS EN 1122:2001 ICP AES
<2
US EPA method #3052 & 7471A
<2
US EPA method #3060A & 6010B
Die Attach Paste
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<5
<5
<5
<5
Not Detected
Not Detected
Method
ICP AES
ICP AES
ICP AES
ICP AES
652
1956
Package Totals
PPM
Weight (g)
1000000
1.20 E-01
AMK-RQ-B
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
08/06/04
Materials Declaration
Package
Body Size/Pitch
LeadCount
Option
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Item
Cu
Fe
P
Zn
QSOP
150 mils
20
Sn/Pb
Molding Compound
% of Compound
Weight (g)
10
6.09 E-03
85
5.18 E-02
3
1.83 E-03
1.5
9.14 E-04
0.5
3.05 E-04
PPM
50678
430760
15203
7602
2534
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
PPM
408477
9845
126
503
Weight (g)
4.91 E-02
1.18 E-03
1.51 E-05
6.05 E-05
Ag
Internal Leadframe Plating
Weight (g)
% of Plating
5.56 E-04
100
Sn
Pb
External Leadframe Plating
% of Plating
Weight (g)
2.29 E-03
85
4.04 E-04
15
Item
Au
Bond Wires
% of Wire
99.99
PPM
Item
Pb
Cd
Hg
Cr+6
Molding Compound
Method
PPM
<2
US EPA method #3052 & 6010B
Not Detected BS EN 1122:2001 ICP AES
<2
US EPA method #3052 & 7471A
<2
US EPA method #3060A & 6010B
Die Attach Paste
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<5
<5
<5
<5
Not Detected
Not Detected
Method
ICP AES
ICP AES
ICP AES
ICP AES
4625
PPM
19025
3357
Weight (g)
5.25 E-04
PPM
100
Weight (g)
4.85 E-03
PPM
40293
Die Attach
% of Die Attach
25
75
Weight (g)
7.84 E-05
2.35 E-04
PPM
4365
Chip
% of Chip
Si
Item
Resin
Ag Filler
652
1956
Package Totals
PPM
Weight (g)
1000000
1.20 E-01
AMK-RQ-A
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
08/06/04