Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish MS Number RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Punched 3 X 2 X 0.85 (1.74 X 0.45 EP) 8 100 Sn MS010624B Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 25.52 3.75 0.09 29.36 3.36E-03 4.95E-04 1.20E-05 3.87 E-03 PPM 255210 37528 910 293649 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) Percentage (%) PPM Percentage (%) 96.40 2.50 0.60 0.50 100.00 963989 25006 6004 5001 1000000 60.64 1.57 0.38 0.31 62.90 7.99 E-03 2.07 E-04 4.98 E-05 4.15 E-05 8.29 E-03 PPM 606379 15729 3776 3146 629031 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.79 2.36 E-04 PPM 17907 External Leadframe Plating Component Level Homogeneous Material Level Substance Description Tin & its alloys Tin CAS# 7440-31-5 Weight (g) 2.47 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 1.87 PPM 18742 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) 4.50 E-05 Percentage (%) PPM Percentage (%) 100.0 1000000 0.34 PPM 3415 Chip Component Level Homogeneous Material Level Substance Description Other inorganic materials Gallium Arsenide CAS# 1303-00-0 Weight (g) 3.80 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 2.88 PPM 28834 Die Attach Component Level Homogeneous Material Level Description Precious metals Thermoset Subtotal Package Totals Substance Silver Epoxy Resin CAS# 7440-22-4 54208-63-8 / 2425-790-8 Weight (g) 8.66 E-05 2.44 E-05 1.11 E-04 Weight (g) 1.32 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 78.00 22.00 100.0 780000 220000 1000000 0.66 0.19 0.84 Percentage (%) 100 PPM 6570 1853 8422 PPM 1000000 Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish MS Number RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 3 X 2 X 0.55 (1.74 X 0.45 EP) 8 NiPdAu-Ag MS011321A Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Other inorganic materials Subtotal Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) 3.27E-03 4.81E-04 1.17E-05 3.77E-03 Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 25.40 3.74 0.09 29.23 PPM 254019 37353 906 292278 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 8.08 E-03 1.95 E-04 9.94 E-06 2.49 E-06 8.29 E-03 Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 62.71 1.51 0.08 0.02 64.32 PPM 627072 15114 772 193 643151 Internal / External Leadframe Plating Component Level Homogeneous Material Level Substance Description Nickel & its alloys Precious metals Precious metals Subtotal Nickel Palladium Gold-Silver CAS# 7440-02-0 7440-05-3 7440-57-5 / 7440-22-4 Weight (g) 1.56 E-04 4.00 E-06 2.00 E-06 1.62 E-04 Percentage (%) PPM Percentage (%) 96.3 2.5 1.2 100.00 962963 24691 12346 1000000 1.21 0.03 0.02 1.26 PPM 12107 310 155 12573 Bond Wires Component Level Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Weight (g) 7.80 E-05 Percentage (%) PPM Percentage (%) 100.0 1000000 0.61 PPM 6054 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Weight (g) 3.71 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 2.88 PPM 28793 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Package Totals Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 Component Level Weight (g) 1.72 E-04 6.87 E-06 6.87 E-06 6.87 E-06 6.87 E-06 6.87 E-06 6.87 E-06 6.87 E-06 1.15 E-06 2.21 E-04 Weight (g) 1.29 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100.0 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 1.33 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.01 1.72 Percentage (%) 100.00 PPM 13329 533 533 533 533 533 533 533 89 17152 PPM 1000000 Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish MS Number RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Punched 3 X 2 X 0.85 (1.74 X 0.45 EP) 8 85Sn/15Pb MS011310A No No Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 25.61 3.77 0.09 29.47 3.34E-03 4.91E-04 1.19E-05 3.84 E-03 PPM 256128 37663 914 294705 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) Percentage (%) PPM Percentage (%) 96.40 2.50 0.60 0.50 100.00 963989 25006 6004 5001 1000000 61.33 1.59 0.38 0.32 63.62 7.99 E-03 2.07 E-04 4.98 E-05 4.15 E-05 8.29 E-03 PPM 613313 15909 3820 3182 636224 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.84 2.40 E-04 PPM 18419 External Leadframe Plating Component Level Homogeneous Material Level Substance Description Tin & its alloys Tin & its alloys Subtotal Tin Lead CAS# 7440-31-5 7439-92-1 Weight (g) 2.13 E-04 3.75 E-05 2.50 E-04 Percentage (%) PPM Percentage (%) 85.0 15.0 100.0 850000 150000 1000000 1.63 0.29 1.92 PPM 16309 2878 19186 Bond Wires Homogeneous Material Level Substance Description Precious metals Gold CAS# 7440-57-5 Component Level Weight (g) 4.00 E-05 Percentage (%) PPM Percentage (%) 100.0 1000000 0.31 PPM 3070 Chip Homogeneous Material Level Substance Description Other inorganic materials Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 2.10 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 1.61 PPM 16117 Die Attach Component Level Homogeneous Material Level Substance Description Precious metals Thermoset Subtotal Package Totals Silver Epoxy Resin CAS# 7440-22-4 54208-63-8 / 2425-790-8 Weight (g) 1.25 E-04 3.52 E-05 1.60 E-04 Weight (g) 1.30 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 78.00 22.00 100.0 780000 220000 1000000 0.96 0.27 1.23 Percentage (%) 100 PPM 9578 2701 12279 PPM 1000000