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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
MS Number
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP
5X5
32
NiPdAu
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
2.93E-02
2.04E-03
2.04E-03
5.10E-04
1.02E-04
3.40E-02
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
86.20
6.00
6.00
1.50
0.30
100.00
862000
60000
60000
15000
3000
1000000
48.76
3.39
3.39
0.85
0.17
56.57
PPM
487600
33940
33940
8485
1697
565661
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
38.89
0.94
0.05
0.01
39.89
2.34 E-02
5.63 E-04
2.88 E-05
7.19 E-06
2.40 E-02
PPM
388942
9375
479
120
398915
Internal / External Leadframe Plating
Component Level
Homogeneous Material Level
Substance
Description
Nickel & its alloys
Precious metals
Precious metals
Subtotal
Nickel
Palladium
Gold
CAS#
7440-02-0
7440-05-3
7440-57-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
97.3
2.2
0.5
100.00
973000
22000
5000
1000000
0.96
0.02
0.005
0.99
5.79 E-04
1.31 E-05
2.97 E-06
5.95 E-04
PPM
9626
218
49
9893
Bond Wires
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.21
1.28 E-04
PPM
2128
Chip
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.76
1.05 E-03
PPM
17552
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Other organic materials
Other organic materials
Others
Other organic materials
Subtotal
Package Totals
Substance
Silver
Carbocyclic Acrylates
Bismaleimide resin
2-preponoic acid, 2-methyl
Additive
Dicumyl peroxide
CAS#
7440-22-4
Proprietary
Proprietary
68586-19-6
Proprietary
80-43-3
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
80.50
10.00
3.00
3.00
3.00
0.50
100.0
805000
100000
30000
30000
30000
5000
1000000
0.47
0.06
0.02
0.02
0.02
0.00
0.59
2.83 E-04
3.52 E-05
1.05 E-05
1.05 E-05
1.05 E-05
1.76 E-06
3.52 E-04
Weight (g)
6.01 E-02
Percentage (%)
100.00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
PPM
4710
585
176
176
176
29
5851
PPM
1000000