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Product / Package Information
Environmental Compliance Information
Package
Body Size/Pitch
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
JIG Material Content Compliant
MSOP
8
100 Sn
Yes
Yes
Yes
Level A & B
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Thermosets
Others
Other inorganic materials
Subtotal
Substance
Silica
Phenol Resin
Epoxy Resin 1
Epoxy Resin 2
Others
Carbon Black
CAS#
60676-86-0
Proprietary
Proprietary
Proprietary
Proprietary
1333-86-4
Component Level
Weight (g)
1.11 E-02
5.72 E-04
3.81 E-04
3.81 E-04
2.54 E-04
2.54 E-05
1.27 E-02
Percentage (%)
PPM
Percentage (%)
87.3
4.5
3.0
3.0
2.0
0.2
100.0
873000
45000
30000
30000
20000
2000
1000000
44.09
2.27
1.52
1.52
1.01
0.10
51
PPM
440923
22728
15152
15152
10101
1010
505067
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
9.75 E-03
2.35 E-04
1.20 E-05
3.00 E-06
1.00 E-02
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100
975000
23500
1200
300
1000000
38.77
0.93
0.05
0.01
40
PPM
387709
9345
477
119
397650
Internal Leadframe Plating
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Component Level
Weight (g)
1.01 E-04
Percentage (%)
PPM
Percentage (%)
100
1000000
0.40
PPM
4017
External Leadframe Plating
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Component Level
Weight (g)
6.55 E-04
Percentage (%)
PPM
Percentage (%)
100
1000000
2.61
PPM
26057
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Component Level
Weight (g)
3.10 E-04
Percentage (%)
PPM
Percentage (%)
99.99
1000000
1.23
PPM
12328
Chip
Homogeneous Material Level
Substance
Description
Other inorganic materials
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
1.00 E-03
Percentage (%)
PPM
Percentage (%)
100
1000000
3.98
PPM
39769
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Other organic materials
Other organic materials
Others
Other organic materials
Subtotal
Package Totals
Substance
Silver
Carbocyclic Acrylates
Bismaleimide resin
2-preponoic acid, 2-methyl
Additive
Dicumyl peroxide
CAS#
7440-22-4
Proprietary
Proprietary
68586-19-6
Proprietary
80-43-3
Component Level
Weight (g)
3.06 E-04
3.80 E-05
1.14 E-05
1.14 E-05
1.14 E-05
1.90 E-06
3.80 E-04
Weight (g)
2.51 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
80.50
10.00
3.00
3.0
3.0
0.5
100.00
805000
100000
30000
30000
30000
5000
1000000
1.22
0.15
0.05
0.05
0.05
0.008
1.51
Percentage (%)
100
PPM
12165
1511
453
453
453
76
15112
PPM
1000000
Product / Package Information
Environmental Information
Package
Body Size/Pitch
LeadCount
Option
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
JIG Material Content Compliance
MSOP - COL
8
NiPdAu
Yes
Yes
Yes
Level A Compliant
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy Resin
Phenol Resin
Epoxy Cresol Novolac
Carbon Black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
29690-82-2
1333-86-3
1.11 E-02
6.35 E-04
6.35 E-04
2.54 E-04
3.81 E-05
1.27 E-02
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
87.7
5.0
5.0
2.0
0.3
100.0
877000
50000
50000
20000
3000
1000000
45.48
2.59
2.59
1.04
0.16
52
PPM
454800
25929
25929
10372
1556
518587
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-66-6
7723-14-0
9.72 E-03
2.34 E-04
1.20 E-05
2.99 E-06
9.97 E-03
Component Level
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100
975000
23500
1200
300
1000000
39.70
0.96
0.05
0.01
41
PPM
397009
9569
489
122
407189
Internal/External Leadframe Plating
Homogeneous Material Level
Description
Nickel & its alloys
Precious metals
Precious metals
Subtotal
Substance
Nickel
Palladium
Gold
CAS#
Component Level
Weight (g)
7440-02-0
7440-05-3
7440-57-5
1.16 E-04
1.01 E-05
1.52 E-06
1.28 E-04
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
90.91
7.91
1.19
100.00
909091
79051
11858
1000000
0.47
0.04
0.01
0.52
PPM
4743
412
62
5217
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
7440-57-5
3.10 E-04
Component Level
Percentage (%)
PPM
Percentage (%)
99.99
1000000
1.27
PPM
12657
Chip
Homogeneous Material Level
Substance
Description
Other inorganic materials
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
1.00 E-03
Percentage (%)
PPM
Percentage (%)
100
1000000
4.08
PPM
40834
Die Attach
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Other organic materials
Thermoset
Others
Subtotal
Package Totals
Substance
Aluminum oxide
Diethylene glycol monoethyl ether acetate
Epoxy Resin
Amine
CAS#
Proprietary
Proprietary
Proprietary
Proprietary
Weight (g)
1.33 E-04
1.33 E-04
9.50 E-05
1.90 E-05
3.80 E-04
Weight (g)
2.45 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
35
35
25
5
100
350000
350000
250000
50000
1000000
0.54
0.54
0.39
0.08
1.55
Percentage (%)
100
PPM
5431
5431
3879
776
15517
PPM
1000000
Product / Package Information
Environmental Information
Package
Body Size
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
JIG Material Content Compliance
MSOP
8
SnPb
No
No
No
No
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol Novolac
Antimony Trioxide
Brominated Resin
Carbon Black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
9003-35-4
1309-64-4
40039-93-8
1333-86-4
1.09 E-02
9.53 E-04
5.08 E-04
1.91 E-04
6.35 E-05
3.81 E-05
1.27 E-02
Percentage (%)
PPM
Percentage (%)
86.20
7.50
4.00
1.50
0.50
0.30
100
862000
75000
40000
15000
5000
3000
1000000
43.46
3.78
2.02
0.76
0.25
0.15
50.42
PPM
434602
37813
20167
7563
2521
1513
504179
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
CAS#
Component Level
Weight (g)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
9.76 E-03
2.28 E-04
1.26 E-05
2.42 E-06
1.00 E-02
Percentage (%)
PPM
Percentage (%)
97.57
2.28
0.13
0.02
100.00
975706
22789
1263
242
1000000
38.73
0.90
0.05
0.01
39.69
PPM
387289
9046
501
96
396932
Internal Leadframe Plating
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
Component Level
Weight (g)
1.01 E-04
7440-22-4
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.40
PPM
4010
External Leadframe Plating
Homogeneous Material Level
Description
Tin & its alloys
Tin & its alloys
Subtotal
Substance
Tin
Lead
CAS#
Component Level
Weight (g)
5.95 E-04
1.05 E-04
7.00 E-04
7440-31-5
7439-92-1
Percentage (%)
PPM
Percentage (%)
85.0
15.0
100.0
850000
150000
1000000
2.36
0.42
2.78
PPM
23621
4168
27789
Bond Wires
Homogeneous Material Level
Description
P i
Precious
metals
t l
Substance
CAS#
3 10 E
04
3.10
E-04
7440-57-5
7440 57 5
Gold
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
99.99
99 99
1000000
1.23
1 23
PPM
12306
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
Component Level
Weight (g)
7440-21-3
1.00 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
3.97
PPM
39699
Die Attach
Homogeneous Material Level
Description
Precious metals
Thermosets
Others
Subtotal
Substance
Silver
Epoxy Resin
Curing agent & hardener
CAS#
Component Level
Weight (g)
3.04 E-04
5.70 E-05
1.90 E-05
3.80 E-04
7440-22-4
Proprietary
Proprietary
Weight (g)
2.52 E-02
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
80
15
5
100
800000
150000
50000
1000000
1.21
0.23
0.08
1.51
Percentage (%)
100.00
PPM
12069
2263
754
15086
PPM
1000000