Product / Package Information Environmental Compliance Information Package Body Size/Pitch Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant JIG Material Content Compliant MSOP 8 100 Sn Yes Yes Yes Level A & B Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Thermosets Others Other inorganic materials Subtotal Substance Silica Phenol Resin Epoxy Resin 1 Epoxy Resin 2 Others Carbon Black CAS# 60676-86-0 Proprietary Proprietary Proprietary Proprietary 1333-86-4 Component Level Weight (g) 1.11 E-02 5.72 E-04 3.81 E-04 3.81 E-04 2.54 E-04 2.54 E-05 1.27 E-02 Percentage (%) PPM Percentage (%) 87.3 4.5 3.0 3.0 2.0 0.2 100.0 873000 45000 30000 30000 20000 2000 1000000 44.09 2.27 1.52 1.52 1.01 0.10 51 PPM 440923 22728 15152 15152 10101 1010 505067 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 9.75 E-03 2.35 E-04 1.20 E-05 3.00 E-06 1.00 E-02 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 38.77 0.93 0.05 0.01 40 PPM 387709 9345 477 119 397650 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Component Level Weight (g) 1.01 E-04 Percentage (%) PPM Percentage (%) 100 1000000 0.40 PPM 4017 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) 6.55 E-04 Percentage (%) PPM Percentage (%) 100 1000000 2.61 PPM 26057 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) 3.10 E-04 Percentage (%) PPM Percentage (%) 99.99 1000000 1.23 PPM 12328 Chip Homogeneous Material Level Substance Description Other inorganic materials Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 1.00 E-03 Percentage (%) PPM Percentage (%) 100 1000000 3.98 PPM 39769 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Others Other organic materials Subtotal Package Totals Substance Silver Carbocyclic Acrylates Bismaleimide resin 2-preponoic acid, 2-methyl Additive Dicumyl peroxide CAS# 7440-22-4 Proprietary Proprietary 68586-19-6 Proprietary 80-43-3 Component Level Weight (g) 3.06 E-04 3.80 E-05 1.14 E-05 1.14 E-05 1.14 E-05 1.90 E-06 3.80 E-04 Weight (g) 2.51 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 80.50 10.00 3.00 3.0 3.0 0.5 100.00 805000 100000 30000 30000 30000 5000 1000000 1.22 0.15 0.05 0.05 0.05 0.008 1.51 Percentage (%) 100 PPM 12165 1511 453 453 453 76 15112 PPM 1000000 Product / Package Information Environmental Information Package Body Size/Pitch LeadCount Option RoHS Compliant High Temperature Compliant Halogen Free Compliant JIG Material Content Compliance MSOP - COL 8 NiPdAu Yes Yes Yes Level A Compliant Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Thermosets Other inorganic materials Subtotal Substance Silica Epoxy Resin Phenol Resin Epoxy Cresol Novolac Carbon Black CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary 29690-82-2 1333-86-3 1.11 E-02 6.35 E-04 6.35 E-04 2.54 E-04 3.81 E-05 1.27 E-02 CAS# Weight (g) Percentage (%) PPM Percentage (%) 87.7 5.0 5.0 2.0 0.3 100.0 877000 50000 50000 20000 3000 1000000 45.48 2.59 2.59 1.04 0.16 52 PPM 454800 25929 25929 10372 1556 518587 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 9.72 E-03 2.34 E-04 1.20 E-05 2.99 E-06 9.97 E-03 Component Level Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 39.70 0.96 0.05 0.01 41 PPM 397009 9569 489 122 407189 Internal/External Leadframe Plating Homogeneous Material Level Description Nickel & its alloys Precious metals Precious metals Subtotal Substance Nickel Palladium Gold CAS# Component Level Weight (g) 7440-02-0 7440-05-3 7440-57-5 1.16 E-04 1.01 E-05 1.52 E-06 1.28 E-04 CAS# Weight (g) Percentage (%) PPM Percentage (%) 90.91 7.91 1.19 100.00 909091 79051 11858 1000000 0.47 0.04 0.01 0.52 PPM 4743 412 62 5217 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold 7440-57-5 3.10 E-04 Component Level Percentage (%) PPM Percentage (%) 99.99 1000000 1.27 PPM 12657 Chip Homogeneous Material Level Substance Description Other inorganic materials Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 1.00 E-03 Percentage (%) PPM Percentage (%) 100 1000000 4.08 PPM 40834 Die Attach Component Level Homogeneous Material Level Description Other inorganic materials Other organic materials Thermoset Others Subtotal Package Totals Substance Aluminum oxide Diethylene glycol monoethyl ether acetate Epoxy Resin Amine CAS# Proprietary Proprietary Proprietary Proprietary Weight (g) 1.33 E-04 1.33 E-04 9.50 E-05 1.90 E-05 3.80 E-04 Weight (g) 2.45 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 35 35 25 5 100 350000 350000 250000 50000 1000000 0.54 0.54 0.39 0.08 1.55 Percentage (%) 100 PPM 5431 5431 3879 776 15517 PPM 1000000 Product / Package Information Environmental Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant JIG Material Content Compliance MSOP 8 SnPb No No No No Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Novolac Antimony Trioxide Brominated Resin Carbon Black CAS# Component Level Weight (g) 60676-86-0 Proprietary 9003-35-4 1309-64-4 40039-93-8 1333-86-4 1.09 E-02 9.53 E-04 5.08 E-04 1.91 E-04 6.35 E-05 3.81 E-05 1.27 E-02 Percentage (%) PPM Percentage (%) 86.20 7.50 4.00 1.50 0.50 0.30 100 862000 75000 40000 15000 5000 3000 1000000 43.46 3.78 2.02 0.76 0.25 0.15 50.42 PPM 434602 37813 20167 7563 2521 1513 504179 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# Component Level Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 9.76 E-03 2.28 E-04 1.26 E-05 2.42 E-06 1.00 E-02 Percentage (%) PPM Percentage (%) 97.57 2.28 0.13 0.02 100.00 975706 22789 1263 242 1000000 38.73 0.90 0.05 0.01 39.69 PPM 387289 9046 501 96 396932 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver CAS# Component Level Weight (g) 1.01 E-04 7440-22-4 Percentage (%) PPM Percentage (%) 100.0 1000000 0.40 PPM 4010 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Tin & its alloys Subtotal Substance Tin Lead CAS# Component Level Weight (g) 5.95 E-04 1.05 E-04 7.00 E-04 7440-31-5 7439-92-1 Percentage (%) PPM Percentage (%) 85.0 15.0 100.0 850000 150000 1000000 2.36 0.42 2.78 PPM 23621 4168 27789 Bond Wires Homogeneous Material Level Description P i Precious metals t l Substance CAS# 3 10 E 04 3.10 E-04 7440-57-5 7440 57 5 Gold Component Level Weight (g) Percentage (%) PPM Percentage (%) 99.99 99 99 1000000 1.23 1 23 PPM 12306 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# Component Level Weight (g) 7440-21-3 1.00 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 3.97 PPM 39699 Die Attach Homogeneous Material Level Description Precious metals Thermosets Others Subtotal Substance Silver Epoxy Resin Curing agent & hardener CAS# Component Level Weight (g) 3.04 E-04 5.70 E-05 1.90 E-05 3.80 E-04 7440-22-4 Proprietary Proprietary Weight (g) 2.52 E-02 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 80 15 5 100 800000 150000 50000 1000000 1.21 0.23 0.08 1.51 Percentage (%) 100.00 PPM 12069 2263 754 15086 PPM 1000000