Product / Package Information Environmental Compliance Information Package Body Size/Pitch Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant TSOT 6 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Thermosets Others Other inorganic materials Subtotal Silica Phenol Resin Epoxy Resin 1 Epoxy Resin 2 Others Carbon Black CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary Proprietary 1333-86-4 5.19 E-03 2.67 E-04 1.78 E-04 1.78 E-04 1.19 E-04 1.19 E-05 5.94 E-03 CAS# Weight (g) Percentage (%) PPM Percentage (%) 87.3 4.5 3.0 3.0 2.0 0.2 100.0 873000 45000 30000 30000 20000 2000 1000000 42.24 2.18 1.45 1.45 0.97 0.10 48 PPM 422427 21775 14516 14516 9678 968 483880 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 4.54 E-03 1.09 E-04 5.58 E-06 1.40 E-06 4.65 E-03 Component Level Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 36.96 0.89 0.05 0.01 38 PPM 369564 8907 455 114 379040 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Component Level Weight (g) 4.70 E-05 Percentage (%) PPM Percentage (%) 100 1000000 0.38 PPM 3829 External Leadframe Plating Component Level Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Weight (g) 5.96 E-04 Percentage (%) PPM Percentage (%) 100 1000000 4.85 PPM 48532 Bond Wires Component Level Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Weight (g) 1.70 E-04 Percentage (%) PPM Percentage (%) 99.99 1000000 1.38 PPM 13848 Chip Homogeneous Material Level Substance Description Other inorganic materials Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 8.00 E-04 Percentage (%) PPM Percentage (%) 100 1000000 6.52 PPM 65169 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Others Other organic materials Subtotal Package Totals Substance Silver Carbocyclic Acrylates Bismaleimide resin 2-preponoic acid, 2-methyl Additive Dicumyl peroxide CAS# 7440-22-4 Proprietary Proprietary 68586-19-6 Proprietary 80-43-3 Component Level Weight (g) 5.64 E-05 7.00 E-06 2.10 E-06 2.10 E-06 2.10 E-06 3.50 E-07 7.00 E-05 Weight (g) 1.23 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 80.50 10.00 3.00 3.0 3.0 0.5 100.00 805000 100000 30000 30000 30000 5000 1000000 0.46 0.06 0.02 0.02 0.02 0.00 0.57 Percentage (%) 100 PPM 4590 570 171 171 171 29 5702 PPM 1000000 Product / Package Information Environmental Compliance Information Package Body Size/Pitch LeadCount Option RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant TSOT - COL 6 NiPdAu Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Thermosets Others Other inorganic materials Subtotal Silica Phenol Resin Epoxy Resin 1 Epoxy Resin 2 Others Carbon Black CAS# 60676-86-0 Proprietary Proprietary Proprietary Proprietary 1333-86-4 Component Level Weight (g) 5.19 E-03 2.67 E-04 1.78 E-04 1.78 E-04 1.19 E-04 1.19 E-05 5.94 E-03 Percentage (%) PPM Percentage (%) 87.3 4.5 3.0 3.0 2.0 0.2 100.0 873000 45000 30000 30000 20000 2000 1000000 44.40 2.29 1.53 1.53 1.02 0.10 51 PPM 443974 22885 15257 15257 10171 1017 508562 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Copper Iron Zinc Phosphorus Component Level Weight (g) 4.52 E-03 1.09 E-04 5.57 E-06 1.39 E-06 4.64 E-03 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 38.74 0.93 0.05 0.01 40 PPM 387374 9337 477 119 397307 Internal/External Leadframe Plating Homogeneous Material Level Substance Description Nickel & its alloys Precious metals Precious metals Subtotal Nickel Palladium Gold CAS# 7440-02-0 7440-05-3 7440-57-5 Component Level Weight (g) 5.41 E-05 4.70 E-06 7.05 E-07 5.95 E-05 Percentage (%) PPM Percentage (%) 90.91 7.91 1.19 100.00 909091 79051 11858 1000000 0.46 0.04 0.01 0.51 PPM 4628 402 60 5090 Bond Wires Homogeneous Material Level Substance Description Precious metals Gold CAS# 7440-57-5 Component Level Weight (g) 1.70 E-04 Percentage (%) PPM Percentage (%) 99.99 1000000 1.46 PPM 14555 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 8.00 E-04 Percentage (%) PPM Percentage (%) 100 1000000 6.85 PPM 68493 Die Attach Homogeneous Material Level Description Thermoset Other inorganic materials Other inorganic materials Other inorganic materials Others Subtotal Package Totals Substance Epoxy Resin Metal Oxide Glycol Ethers Silica Curing agent & hardener CAS# Proprietary Proprietary Proprietary Proprietary Proprietary Component Level Weight (g) 2.17 E-05 2.17 E-05 1.54 E-05 5.60 E-06 5.60 E-06 7.00 E-05 Weight (g) 1.17 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 31 31 22 8 8 100 310000 310000 220000 80000 80000 1000000 0.19 0.19 0.13 0.05 0.05 0.60 Percentage (%) 100 PPM 1858 1858 1318 479 479 5993 PPM 1000000