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Product / Package Information
Environmental Compliance Information
Package
Body Size/Pitch
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
TSOT
6
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Thermosets
Thermosets
Others
Other inorganic materials
Subtotal
Silica
Phenol Resin
Epoxy Resin 1
Epoxy Resin 2
Others
Carbon Black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
Proprietary
1333-86-4
5.19 E-03
2.67 E-04
1.78 E-04
1.78 E-04
1.19 E-04
1.19 E-05
5.94 E-03
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
87.3
4.5
3.0
3.0
2.0
0.2
100.0
873000
45000
30000
30000
20000
2000
1000000
42.24
2.18
1.45
1.45
0.97
0.10
48
PPM
422427
21775
14516
14516
9678
968
483880
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-66-6
7723-14-0
4.54 E-03
1.09 E-04
5.58 E-06
1.40 E-06
4.65 E-03
Component Level
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100
975000
23500
1200
300
1000000
36.96
0.89
0.05
0.01
38
PPM
369564
8907
455
114
379040
Internal Leadframe Plating
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Component Level
Weight (g)
4.70 E-05
Percentage (%)
PPM
Percentage (%)
100
1000000
0.38
PPM
3829
External Leadframe Plating
Component Level
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Weight (g)
5.96 E-04
Percentage (%)
PPM
Percentage (%)
100
1000000
4.85
PPM
48532
Bond Wires
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Weight (g)
1.70 E-04
Percentage (%)
PPM
Percentage (%)
99.99
1000000
1.38
PPM
13848
Chip
Homogeneous Material Level
Substance
Description
Other inorganic materials
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
8.00 E-04
Percentage (%)
PPM
Percentage (%)
100
1000000
6.52
PPM
65169
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Other organic materials
Other organic materials
Others
Other organic materials
Subtotal
Package Totals
Substance
Silver
Carbocyclic Acrylates
Bismaleimide resin
2-preponoic acid, 2-methyl
Additive
Dicumyl peroxide
CAS#
7440-22-4
Proprietary
Proprietary
68586-19-6
Proprietary
80-43-3
Component Level
Weight (g)
5.64 E-05
7.00 E-06
2.10 E-06
2.10 E-06
2.10 E-06
3.50 E-07
7.00 E-05
Weight (g)
1.23 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
80.50
10.00
3.00
3.0
3.0
0.5
100.00
805000
100000
30000
30000
30000
5000
1000000
0.46
0.06
0.02
0.02
0.02
0.00
0.57
Percentage (%)
100
PPM
4590
570
171
171
171
29
5702
PPM
1000000
Product / Package Information
Environmental Compliance Information
Package
Body Size/Pitch
LeadCount
Option
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
TSOT - COL
6
NiPdAu
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Thermosets
Thermosets
Others
Other inorganic materials
Subtotal
Silica
Phenol Resin
Epoxy Resin 1
Epoxy Resin 2
Others
Carbon Black
CAS#
60676-86-0
Proprietary
Proprietary
Proprietary
Proprietary
1333-86-4
Component Level
Weight (g)
5.19 E-03
2.67 E-04
1.78 E-04
1.78 E-04
1.19 E-04
1.19 E-05
5.94 E-03
Percentage (%)
PPM
Percentage (%)
87.3
4.5
3.0
3.0
2.0
0.2
100.0
873000
45000
30000
30000
20000
2000
1000000
44.40
2.29
1.53
1.53
1.02
0.10
51
PPM
443974
22885
15257
15257
10171
1017
508562
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Copper
Iron
Zinc
Phosphorus
Component Level
Weight (g)
4.52 E-03
1.09 E-04
5.57 E-06
1.39 E-06
4.64 E-03
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100
975000
23500
1200
300
1000000
38.74
0.93
0.05
0.01
40
PPM
387374
9337
477
119
397307
Internal/External Leadframe Plating
Homogeneous Material Level
Substance
Description
Nickel & its alloys
Precious metals
Precious metals
Subtotal
Nickel
Palladium
Gold
CAS#
7440-02-0
7440-05-3
7440-57-5
Component Level
Weight (g)
5.41 E-05
4.70 E-06
7.05 E-07
5.95 E-05
Percentage (%)
PPM
Percentage (%)
90.91
7.91
1.19
100.00
909091
79051
11858
1000000
0.46
0.04
0.01
0.51
PPM
4628
402
60
5090
Bond Wires
Homogeneous Material Level
Substance
Description
Precious metals
Gold
CAS#
7440-57-5
Component Level
Weight (g)
1.70 E-04
Percentage (%)
PPM
Percentage (%)
99.99
1000000
1.46
PPM
14555
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
8.00 E-04
Percentage (%)
PPM
Percentage (%)
100
1000000
6.85
PPM
68493
Die Attach
Homogeneous Material Level
Description
Thermoset
Other inorganic materials
Other inorganic materials
Other inorganic materials
Others
Subtotal
Package Totals
Substance
Epoxy Resin
Metal Oxide
Glycol Ethers
Silica
Curing agent & hardener
CAS#
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Component Level
Weight (g)
2.17 E-05
2.17 E-05
1.54 E-05
5.60 E-06
5.60 E-06
7.00 E-05
Weight (g)
1.17 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
31
31
22
8
8
100
310000
310000
220000
80000
80000
1000000
0.19
0.19
0.13
0.05
0.05
0.60
Percentage (%)
100
PPM
1858
1858
1318
479
479
5993
PPM
1000000