Product / Package Information Environmental Compliance Information Package Body Size/Pitch LeadCount Option RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant TSOT - COL 5 NiPdAu Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Thermosets Others Other inorganic materials Subtotal Substance Silica Phenol Resin Epoxy Resin 1 Epoxy Resin 2 Others Carbon Black CAS# 60676-86-0 Proprietary Proprietary Proprietary Proprietary 1333-86-4 Component Level Weight (g) 5.20 E-03 2.68 E-04 1.79 E-04 1.79 E-04 1.19 E-04 1.19 E-05 5.96 E-03 Percentage (%) PPM Percentage (%) 87.3 4.5 3.0 3.0 2.0 0.2 100.0 873000 45000 30000 30000 20000 2000 1000000 44.93 2.32 1.54 1.54 1.03 0.10 51 PPM 449317 23161 15440 15440 10294 1029 514681 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 4.43 E-03 1.07 E-04 5.45 E-06 1.36 E-06 4.54 E-03 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 38.24 0.92 0.05 0.01 39 PPM 382407 9217 471 118 392212 Internal/External Leadframe Plating Homogeneous Material Level Description Nickel & its alloys Precious metals Precious metals Subtotal Substance Nickel Palladium Gold CAS# 7440-02-0 7440-05-3 7440-57-5 Component Level Weight (g) 5.29 E-05 4.60 E-06 6.90 E-07 5.82 E-05 Percentage (%) PPM Percentage (%) 90.91 7.91 1.19 100.00 909091 79051 11858 1000000 0.46 0.04 0.01 0.50 PPM 4568 397 60 5025 Bond Wires Homogeneous Material Level Description Precious metals Substance G ld Gold CAS# 7440-57-5 7440 57 5 Component Level Weight (g) 1 50 E 1.50 E-04 04 Percentage (%) PPM Percentage (%) 99 99 99.99 1000000 1.30 1 30 PPM 12952 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 8.00 E-04 Percentage (%) PPM Percentage (%) 100 1000000 6.91 PPM 69085 Die Attach Component Level Homogeneous Material Level Description Other inorganic materials Other organic materials Thermoset Others Subtotal Package Totals Substance Aluminum oxide Diethylene glycol monoethyl ether acetate Epoxy Resin Amine CAS# 1344-28-1 112-15-1 Proprietary Proprietary Weight (g) 2.45 E-05 2.45 E-05 1.75 E-05 3.50 E-06 7.00 E-05 Weight (g) 1.16 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 35 35 25 5 100 350000 350000 250000 50000 1000000 0.21 0.21 0.15 0.03 0.60 Percentage (%) 100 PPM 2116 2116 1511 302 6045 PPM 1000000 Product / Package Information Environmental Compliance Information Package Body Size/Pitch Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant JIG Material Content Compliant REACH SVHC Compliant TSOT 5 100 Sn Yes Yes Yes Level A & B Compliant Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Thermosets Others Other inorganic materials Subtotal Silica Phenol Resin Epoxy Resin 1 Epoxy Resin 2 Others Carbon Black CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary Proprietary 1333-86-4 5.20 E-03 2.68 E-04 1.79 E-04 1.79 E-04 1.19 E-04 1.19 E-05 5.96 E-03 CAS# Weight (g) Percentage (%) PPM Percentage (%) 87.3 4.5 3.0 3.0 2.0 0.2 100.0 873000 45000 30000 30000 20000 2000 1000000 42.76 2.20 1.47 1.47 0.98 0.10 49 PPM 427646 22044 14696 14696 9797 980 489858 Leadframe Component Level Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 4.44 E-03 1.07 E-04 5.46 E-06 1.37 E-06 4.55 E-03 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 36.49 0.88 0.04 0.01 37 PPM 364940 8796 449 112 374297 Internal Leadframe Plating Homogeneous Material Level Substance Description Precious metals Silver CAS# 7440-22-4 Component Level Weight (g) 4.60 E-05 Percentage (%) PPM Percentage (%) 100 1000000 0.38 PPM 3781 External Leadframe Plating Homogeneous Material Level Substance Description Tin & its alloys Tin CAS# 7440-31-5 Component Level Weight (g) 5.87 E-04 Percentage (%) PPM Percentage (%) 100 1000000 4.82 PPM 48231 Bond Wires Component Level Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Weight (g) 1.50 E-04 Percentage (%) PPM Percentage (%) 99.99 1000000 1.23 PPM 12327 Chip Homogeneous Material Level Substance Description Other inorganic materials Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 8.00 E-04 Percentage (%) PPM Percentage (%) 100 1000000 6.58 PPM 65753 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Others Other organic materials Subtotal Package Totals Substance Silver Carbocyclic Acrylates Bismaleimide resin 2-preponoic acid, 2-methyl Additive Dicumyl peroxide CAS# 7440-22-4 Proprietary Proprietary 68586-19-6 Proprietary 80-43-3 Component Level Weight (g) 5.64 E-05 7.00 E-06 2.10 E-06 2.10 E-06 2.10 E-06 3.50 E-07 7.00 E-05 Weight (g) 1.22 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 80.50 10.00 3.00 3.0 3.0 0.5 100.00 805000 100000 30000 30000 30000 5000 1000000 0.46 0.06 0.02 0.02 0.02 0.00 0.58 Percentage (%) 100 PPM 4631 575 173 173 173 29 5753 PPM 1000000