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Product / Package Information
Environmental Compliance Information
Package
Body Size/Pitch
LeadCount
Option
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
TSOT - COL
5
NiPdAu
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Thermosets
Others
Other inorganic materials
Subtotal
Substance
Silica
Phenol Resin
Epoxy Resin 1
Epoxy Resin 2
Others
Carbon Black
CAS#
60676-86-0
Proprietary
Proprietary
Proprietary
Proprietary
1333-86-4
Component Level
Weight (g)
5.20 E-03
2.68 E-04
1.79 E-04
1.79 E-04
1.19 E-04
1.19 E-05
5.96 E-03
Percentage (%)
PPM
Percentage (%)
87.3
4.5
3.0
3.0
2.0
0.2
100.0
873000
45000
30000
30000
20000
2000
1000000
44.93
2.32
1.54
1.54
1.03
0.10
51
PPM
449317
23161
15440
15440
10294
1029
514681
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
4.43 E-03
1.07 E-04
5.45 E-06
1.36 E-06
4.54 E-03
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100
975000
23500
1200
300
1000000
38.24
0.92
0.05
0.01
39
PPM
382407
9217
471
118
392212
Internal/External Leadframe Plating
Homogeneous Material Level
Description
Nickel & its alloys
Precious metals
Precious metals
Subtotal
Substance
Nickel
Palladium
Gold
CAS#
7440-02-0
7440-05-3
7440-57-5
Component Level
Weight (g)
5.29 E-05
4.60 E-06
6.90 E-07
5.82 E-05
Percentage (%)
PPM
Percentage (%)
90.91
7.91
1.19
100.00
909091
79051
11858
1000000
0.46
0.04
0.01
0.50
PPM
4568
397
60
5025
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
G ld
Gold
CAS#
7440-57-5
7440 57 5
Component Level
Weight (g)
1 50 E
1.50
E-04
04
Percentage (%)
PPM
Percentage (%)
99 99
99.99
1000000
1.30
1 30
PPM
12952
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
8.00 E-04
Percentage (%)
PPM
Percentage (%)
100
1000000
6.91
PPM
69085
Die Attach
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Other organic materials
Thermoset
Others
Subtotal
Package Totals
Substance
Aluminum oxide
Diethylene glycol monoethyl ether acetate
Epoxy Resin
Amine
CAS#
1344-28-1
112-15-1
Proprietary
Proprietary
Weight (g)
2.45 E-05
2.45 E-05
1.75 E-05
3.50 E-06
7.00 E-05
Weight (g)
1.16 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
35
35
25
5
100
350000
350000
250000
50000
1000000
0.21
0.21
0.15
0.03
0.60
Percentage (%)
100
PPM
2116
2116
1511
302
6045
PPM
1000000
Product / Package Information
Environmental Compliance Information
Package
Body Size/Pitch
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
JIG Material Content Compliant
REACH SVHC Compliant
TSOT
5
100 Sn
Yes
Yes
Yes
Level A & B Compliant
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Thermosets
Thermosets
Others
Other inorganic materials
Subtotal
Silica
Phenol Resin
Epoxy Resin 1
Epoxy Resin 2
Others
Carbon Black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
Proprietary
1333-86-4
5.20 E-03
2.68 E-04
1.79 E-04
1.79 E-04
1.19 E-04
1.19 E-05
5.96 E-03
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
87.3
4.5
3.0
3.0
2.0
0.2
100.0
873000
45000
30000
30000
20000
2000
1000000
42.76
2.20
1.47
1.47
0.98
0.10
49
PPM
427646
22044
14696
14696
9797
980
489858
Leadframe
Component Level
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-66-6
7723-14-0
4.44 E-03
1.07 E-04
5.46 E-06
1.37 E-06
4.55 E-03
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100
975000
23500
1200
300
1000000
36.49
0.88
0.04
0.01
37
PPM
364940
8796
449
112
374297
Internal Leadframe Plating
Homogeneous Material Level
Substance
Description
Precious metals
Silver
CAS#
7440-22-4
Component Level
Weight (g)
4.60 E-05
Percentage (%)
PPM
Percentage (%)
100
1000000
0.38
PPM
3781
External Leadframe Plating
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin
CAS#
7440-31-5
Component Level
Weight (g)
5.87 E-04
Percentage (%)
PPM
Percentage (%)
100
1000000
4.82
PPM
48231
Bond Wires
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Weight (g)
1.50 E-04
Percentage (%)
PPM
Percentage (%)
99.99
1000000
1.23
PPM
12327
Chip
Homogeneous Material Level
Substance
Description
Other inorganic materials
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
8.00 E-04
Percentage (%)
PPM
Percentage (%)
100
1000000
6.58
PPM
65753
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Other organic materials
Other organic materials
Others
Other organic materials
Subtotal
Package Totals
Substance
Silver
Carbocyclic Acrylates
Bismaleimide resin
2-preponoic acid, 2-methyl
Additive
Dicumyl peroxide
CAS#
7440-22-4
Proprietary
Proprietary
68586-19-6
Proprietary
80-43-3
Component Level
Weight (g)
5.64 E-05
7.00 E-06
2.10 E-06
2.10 E-06
2.10 E-06
3.50 E-07
7.00 E-05
Weight (g)
1.22 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
80.50
10.00
3.00
3.0
3.0
0.5
100.00
805000
100000
30000
30000
30000
5000
1000000
0.46
0.06
0.02
0.02
0.02
0.00
0.58
Percentage (%)
100
PPM
4631
575
173
173
173
29
5753
PPM
1000000