Product / Package Information Environmental Compliance Information Package Body Size Lead Count Terminal Finish MS Number RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant SOT23 5 100 Sn MS010611B Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Thermosets Others Other inorganic materials Subtotal Substance Silica Phenol Resin Epoxy Resin 1 Epoxy Resin 2 Others Carbon Black CAS# 60676-86-0 Proprietary Proprietary Proprietary Proprietary 1333-86-4 Component Level Weight (g) 7.01 E-03 3.61 E-04 2.41 E-04 2.41 E-04 1.61 E-04 1.61 E-05 8.03 E-03 Percentage (%) PPM Percentage (%) 87.30 4.50 3.00 3.00 2.00 0.20 100.0 873000 45000 30000 30000 20000 2000 1000000 41.80 2.15 1.44 1.44 0.96 0.10 47.88 PPM 417950 21544 14363 14363 9575 958 478752 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 6.95 E-03 1.68 E-04 8.55 E-06 2.14 E-06 7.13 E-03 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 41.43 1.00 0.05 0.01 42.50 PPM 414350 9987 510 127 424974 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Component Level Weight (g) 7.20 E-05 Percentage (%) PPM Percentage (%) 100 1000000 0.43 PPM 4293 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) 3.23 E-04 Percentage (%) PPM Percentage (%) 100 1000000 1.92 PPM 19246 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) 1.50 E-04 Percentage (%) PPM Percentage (%) 99.99 1000000 0.89 PPM 8942 Chip Homogeneous Material Level Substance Description Other inorganic materials Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 1.00 E-03 Percentage (%) PPM Percentage (%) 100 1000000 5.96 PPM 59620 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Others Other organic materials Subtotal Package Totals Substance Silver Carbocyclic Acrylates Bismaleimide resin 2-preponoic acid, 2-methyl Additive Dicumyl peroxide CAS# 7440-22-4 Proprietary Proprietary 68586-19-6 Proprietary 80-43-3 Component Level Weight (g) 5.64 E-05 7.00 E-06 2.10 E-06 2.10 E-06 2.10 E-06 3.50 E-07 7.00 E-05 Weight (g) 1.68 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 80.50 10.00 3.00 3.00 3.00 0.50 100.00 805000 100000 30000 30000 30000 5000 1000000 0.34 0.04 0.01 0.01 0.01 0.002 0.42 Percentage (%) 100 PPM 3360 417 125 125 125 21 4173 PPM 1000000 Product / Package Information Environmental Information Package Body Size Lead Count Terminal Finish MS Number RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant SOT23 5 SnPb MS011616A No No Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Thermosets Others Other inorganic materials Subtotal Substance Silica Phenol Resin Epoxy Resin 1 Epoxy Resin 2 Others Carbon Black CAS# 60676-86-0 Proprietary Proprietary Proprietary Proprietary 1333-86-4 Component Level Weight (g) 7.01 E-03 3.61 E-04 2.41 E-04 2.41 E-04 1.61 E-04 1.61 E-05 8.03 E-03 Percentage (%) PPM Percentage (%) 87.3 4.5 3.0 3.0 2.0 0.2 100.0 873000 45000 30000 30000 20000 2000 1000000 41.79 2.15 1.44 1.44 0.96 0.10 48 PPM 417949 21544 14363 14363 9575 958 478750 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 6.95 E-03 1.68 E-04 8.55 E-06 2.14 E-06 7.13 E-03 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 41.43 1.00 0.05 0.01 42 PPM 414348 9987 510 127 424973 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Component Level Weight (g) 7.20 E-05 Percentage (%) PPM Percentage (%) 100 1000000 0.43 PPM 4293 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Tin & its alloys Subtotal Substance Tin Lead CAS# 7440-31-5 7439-92-1 Component Level Weight (g) 2.74 E-04 4.84 E-05 3.23 E-04 Percentage (%) PPM Percentage (%) 85 15 100 850000 150000 1000000 1.64 0.29 1.92 PPM 16361 2887 19248 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) 1.50 E-04 Percentage (%) PPM Percentage (%) 99.99 1000000 0.89 PPM 8943 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 1.00 E-03 Percentage (%) PPM Percentage (%) 100 1000000 5.96 PPM 59620 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Others Subtotal Package Totals Substance Silver Epoxy Resin Curing agent & hardener CAS# 7440-22-4 Proprietary Proprietary Component Level Weight (g) 5.60 E-05 1.05 E-05 3.50 E-06 7.00 E-05 Weight (g) 1.68 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 80.00 15.00 5.00 100 800000 150000 50000 1000000 0.33 0.06 0.02 0.42 Percentage (%) 100 PPM 3339 626 209 4173 PPM 1000000 Product / Package Information Environmental Information Package Body Size Lead Count Terminal Finish MS Number RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant SOT23 - COL 5 NiPdAu MS011613A Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Others Subtotal Substance Silica Epoxy resin Phenol resin Metal Hydroxide Others CAS# Component Level Weight (g) 60676-86-0 158117-90-9 / 85954-11-6 26834-02-6 1309-42-8 / 20427-58-1 Proprietary 6.68 E-03 4.35 E-04 2.77 E-04 4.35 E-04 1.98 E-04 8.03 E-03 Percentage (%) PPM Percentage (%) 83.25 5.42 3.45 5.42 2.46 100.0 832500 54200 34500 54200 24600 1000000 40.59 2.64 1.68 2.64 1.20 48.76 PPM 405911 26427 16822 26427 11994 487580 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 6.95 E-03 1.68 E-04 8.55 E-06 2.14 E-06 7.13 E-03 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 42.20 1.02 0.05 0.01 43.28 PPM 421991 10171 519 130 432811 Internal / External Leadframe Plating Homogeneous Material Level Description Nickel & its alloys Precious metals Precious metals Subtotal Substance Nickel Palladium Gold CAS# 7440-02-0 7440-05-3 7440-57-5 Component Level Weight (g) 8.28 E-05 7.20 E-06 1.08 E-06 9.11 E-05 Percentage (%) PPM Percentage (%) 90.91 7.91 1.19 100.00 909091 79051 11858 1000000 0.50 0.04 0.01 0.55 PPM 5028 437 66 5530 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) 1.50 E-04 Percentage (%) PPM Percentage (%) 99.99 1000000 0.91 PPM 9108 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 1.00 E-03 Percentage (%) PPM Percentage (%) 100 1000000 6.07 PPM 60720 Die Attach Homogeneous Material Level Description Other inorganic materials Other organic materials Thermoset Others Subtotal Package Totals Substance Aluminum oxide Diethylene glycol monoethyl ether acetate Epoxy Resin Amine CAS# 1344-28-1 112-15-2 Proprietary Proprietary Component Level Weight (g) 2.45 E-05 2.45 E-05 1.75 E-05 3.50 E-06 7.00 E-05 Weight (g) 1.65 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 35.00 35.00 25.00 5.00 100.00 350000 350000 250000 50000 1000000 0.15 0.15 0.11 0.02 0.43 Percentage (%) 100 PPM 1488 1488 1063 213 4250 PPM 1000000