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Product / Package Information
Environmental Compliance Information
Package
Body Size
Lead Count
Terminal Finish
MS Number
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
SOT23
5
100 Sn
MS010611B
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Thermosets
Others
Other inorganic materials
Subtotal
Substance
Silica
Phenol Resin
Epoxy Resin 1
Epoxy Resin 2
Others
Carbon Black
CAS#
60676-86-0
Proprietary
Proprietary
Proprietary
Proprietary
1333-86-4
Component Level
Weight (g)
7.01 E-03
3.61 E-04
2.41 E-04
2.41 E-04
1.61 E-04
1.61 E-05
8.03 E-03
Percentage (%)
PPM
Percentage (%)
87.30
4.50
3.00
3.00
2.00
0.20
100.0
873000
45000
30000
30000
20000
2000
1000000
41.80
2.15
1.44
1.44
0.96
0.10
47.88
PPM
417950
21544
14363
14363
9575
958
478752
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
6.95 E-03
1.68 E-04
8.55 E-06
2.14 E-06
7.13 E-03
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100
975000
23500
1200
300
1000000
41.43
1.00
0.05
0.01
42.50
PPM
414350
9987
510
127
424974
Internal Leadframe Plating
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Component Level
Weight (g)
7.20 E-05
Percentage (%)
PPM
Percentage (%)
100
1000000
0.43
PPM
4293
External Leadframe Plating
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Component Level
Weight (g)
3.23 E-04
Percentage (%)
PPM
Percentage (%)
100
1000000
1.92
PPM
19246
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Component Level
Weight (g)
1.50 E-04
Percentage (%)
PPM
Percentage (%)
99.99
1000000
0.89
PPM
8942
Chip
Homogeneous Material Level
Substance
Description
Other inorganic materials
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
1.00 E-03
Percentage (%)
PPM
Percentage (%)
100
1000000
5.96
PPM
59620
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Other organic materials
Other organic materials
Others
Other organic materials
Subtotal
Package Totals
Substance
Silver
Carbocyclic Acrylates
Bismaleimide resin
2-preponoic acid, 2-methyl
Additive
Dicumyl peroxide
CAS#
7440-22-4
Proprietary
Proprietary
68586-19-6
Proprietary
80-43-3
Component Level
Weight (g)
5.64 E-05
7.00 E-06
2.10 E-06
2.10 E-06
2.10 E-06
3.50 E-07
7.00 E-05
Weight (g)
1.68 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
80.50
10.00
3.00
3.00
3.00
0.50
100.00
805000
100000
30000
30000
30000
5000
1000000
0.34
0.04
0.01
0.01
0.01
0.002
0.42
Percentage (%)
100
PPM
3360
417
125
125
125
21
4173
PPM
1000000
Product / Package Information
Environmental Information
Package
Body Size
Lead Count
Terminal Finish
MS Number
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
SOT23
5
SnPb
MS011616A
No
No
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Thermosets
Others
Other inorganic materials
Subtotal
Substance
Silica
Phenol Resin
Epoxy Resin 1
Epoxy Resin 2
Others
Carbon Black
CAS#
60676-86-0
Proprietary
Proprietary
Proprietary
Proprietary
1333-86-4
Component Level
Weight (g)
7.01 E-03
3.61 E-04
2.41 E-04
2.41 E-04
1.61 E-04
1.61 E-05
8.03 E-03
Percentage (%)
PPM
Percentage (%)
87.3
4.5
3.0
3.0
2.0
0.2
100.0
873000
45000
30000
30000
20000
2000
1000000
41.79
2.15
1.44
1.44
0.96
0.10
48
PPM
417949
21544
14363
14363
9575
958
478750
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
6.95 E-03
1.68 E-04
8.55 E-06
2.14 E-06
7.13 E-03
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100
975000
23500
1200
300
1000000
41.43
1.00
0.05
0.01
42
PPM
414348
9987
510
127
424973
Internal Leadframe Plating
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Component Level
Weight (g)
7.20 E-05
Percentage (%)
PPM
Percentage (%)
100
1000000
0.43
PPM
4293
External Leadframe Plating
Homogeneous Material Level
Description
Tin & its alloys
Tin & its alloys
Subtotal
Substance
Tin
Lead
CAS#
7440-31-5
7439-92-1
Component Level
Weight (g)
2.74 E-04
4.84 E-05
3.23 E-04
Percentage (%)
PPM
Percentage (%)
85
15
100
850000
150000
1000000
1.64
0.29
1.92
PPM
16361
2887
19248
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Component Level
Weight (g)
1.50 E-04
Percentage (%)
PPM
Percentage (%)
99.99
1000000
0.89
PPM
8943
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
1.00 E-03
Percentage (%)
PPM
Percentage (%)
100
1000000
5.96
PPM
59620
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Others
Subtotal
Package Totals
Substance
Silver
Epoxy Resin
Curing agent & hardener
CAS#
7440-22-4
Proprietary
Proprietary
Component Level
Weight (g)
5.60 E-05
1.05 E-05
3.50 E-06
7.00 E-05
Weight (g)
1.68 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
80.00
15.00
5.00
100
800000
150000
50000
1000000
0.33
0.06
0.02
0.42
Percentage (%)
100
PPM
3339
626
209
4173
PPM
1000000
Product / Package Information
Environmental Information
Package
Body Size
Lead Count
Terminal Finish
MS Number
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
SOT23 - COL
5
NiPdAu
MS011613A
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Others
Subtotal
Substance
Silica
Epoxy resin
Phenol resin
Metal Hydroxide
Others
CAS#
Component Level
Weight (g)
60676-86-0
158117-90-9 / 85954-11-6
26834-02-6
1309-42-8 / 20427-58-1
Proprietary
6.68 E-03
4.35 E-04
2.77 E-04
4.35 E-04
1.98 E-04
8.03 E-03
Percentage (%)
PPM
Percentage (%)
83.25
5.42
3.45
5.42
2.46
100.0
832500
54200
34500
54200
24600
1000000
40.59
2.64
1.68
2.64
1.20
48.76
PPM
405911
26427
16822
26427
11994
487580
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
6.95 E-03
1.68 E-04
8.55 E-06
2.14 E-06
7.13 E-03
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100
975000
23500
1200
300
1000000
42.20
1.02
0.05
0.01
43.28
PPM
421991
10171
519
130
432811
Internal / External Leadframe Plating
Homogeneous Material Level
Description
Nickel & its alloys
Precious metals
Precious metals
Subtotal
Substance
Nickel
Palladium
Gold
CAS#
7440-02-0
7440-05-3
7440-57-5
Component Level
Weight (g)
8.28 E-05
7.20 E-06
1.08 E-06
9.11 E-05
Percentage (%)
PPM
Percentage (%)
90.91
7.91
1.19
100.00
909091
79051
11858
1000000
0.50
0.04
0.01
0.55
PPM
5028
437
66
5530
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Component Level
Weight (g)
1.50 E-04
Percentage (%)
PPM
Percentage (%)
99.99
1000000
0.91
PPM
9108
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
1.00 E-03
Percentage (%)
PPM
Percentage (%)
100
1000000
6.07
PPM
60720
Die Attach
Homogeneous Material Level
Description
Other inorganic materials
Other organic materials
Thermoset
Others
Subtotal
Package Totals
Substance
Aluminum oxide
Diethylene glycol monoethyl ether acetate
Epoxy Resin
Amine
CAS#
1344-28-1
112-15-2
Proprietary
Proprietary
Component Level
Weight (g)
2.45 E-05
2.45 E-05
1.75 E-05
3.50 E-06
7.00 E-05
Weight (g)
1.65 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
35.00
35.00
25.00
5.00
100.00
350000
350000
250000
50000
1000000
0.15
0.15
0.11
0.02
0.43
Percentage (%)
100
PPM
1488
1488
1063
213
4250
PPM
1000000