Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Punched 7 X 7 X 0.85 (5.5 EP) 48 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) 5.27E-02 7.75E-03 1.88E-04 6.06 E-02 Percentage (%) PPM Percentage (%) 86.9 12.8 0.3 100.00 869100 127800 3100 1000000 34.61 5.09 0.12 39.82 PPM 346073 50890 1234 398197 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 7.44 E-02 1.79 E-03 9.16 E-05 2.29 E-05 7.63 E-02 Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 48.87 1.18 0.06 0.02 50.12 PPM 488696 11779 601 150 501226 Internal Leadframe Plating Homogeneous Material Level Substance Description Precious metals Silver CAS# 7440-22-4 Component Level Weight (g) 7.63 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.50 PPM 5012 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) 1.88 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.12 PPM 1234 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) 8.21 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.54 PPM 5389 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Weight (g) 1.15 E-02 Percentage (%) PPM Percentage (%) 100.0 1000000 7.52 PPM 75205 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Package Totals Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 Component Level Weight (g) 1.63 E-03 6.51 E-05 6.51 E-05 6.51 E-05 6.51 E-05 6.51 E-05 6.51 E-05 6.51 E-05 1.09 E-05 2.09 E-03 Weight (g) 1.52 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100.0 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 1.07 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.01 1.37 Percentage (%) 100 PPM 10675 427 427 427 427 427 427 427 71 13737 PPM 1000000