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Product / Package Information
Environmental Information
Package
Body Size (mm)
LeadCount
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
JIG Material Content Compliant
REACH SVHC Compliant
LFCSP - Punch
5 X 5 X 0.85 (3.1 EP)
32
100 Sn
Yes
Yes
Yes
Level A & B Compliant
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
60676-86-0
Proprietary
1333-86-4
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
86.9
12.8
0.3
100.00
869100
127800
3100
1000000
32.14
4.73
0.11
36.98
2.67E-02
3.93E-03
9.53E-05
3.07 E-02
PPM
321426
47265
1146
369837
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
52.89
1.27
0.07
0.02
54.25
4.40 E-02
1.06 E-03
5.41 E-05
1.35 E-05
4.51 E-02
PPM
528899
12748
651
163
542460
Internal Leadframe Plating
Homogeneous Material Level
Substance
Description
Precious metals
CAS#
7440-22-4
Silver
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.11
9.03 E-05
PPM
1087
External Leadframe Plating
Component Level
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin
CAS#
7440-31-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.26
1.05 E-03
PPM
12629
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.26
2.14 E-04
PPM
2575
Chip
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
6.15
5.11 E-03
PPM
61534
Die Attach
Homogeneous Material Level
Description
Precious metals
Thermoset
Other inorganic materials
Others
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epoxy Resin
Metal oxide
Curing and hardening agent
Gamma Butyrolactone
CAS#
7440-22-4
Proprietary
Proprietary
Proprietary
96-48-0
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
73.40
18.35
2.75
2.75
2.75
100.0
734000
183500
27500
27500
27500
1000000
0.73
0.18
0.03
0.03
0.03
0.99
6.02 E-04
1.51 E-04
2.26 E-05
2.26 E-05
2.26 E-05
8.21 E-04
Weight (g)
8.31 E-02
Percentage (%)
100
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
PPM
7250
1813
272
272
272
9878
PPM
1000000