Product / Package Information Environmental Information Package Body Size (mm) LeadCount Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant JIG Material Content Compliant REACH SVHC Compliant LFCSP - Punch 5 X 5 X 0.85 (3.1 EP) 32 100 Sn Yes Yes Yes Level A & B Compliant Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) Percentage (%) PPM Percentage (%) 86.9 12.8 0.3 100.00 869100 127800 3100 1000000 32.14 4.73 0.11 36.98 2.67E-02 3.93E-03 9.53E-05 3.07 E-02 PPM 321426 47265 1146 369837 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 52.89 1.27 0.07 0.02 54.25 4.40 E-02 1.06 E-03 5.41 E-05 1.35 E-05 4.51 E-02 PPM 528899 12748 651 163 542460 Internal Leadframe Plating Homogeneous Material Level Substance Description Precious metals CAS# 7440-22-4 Silver Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.11 9.03 E-05 PPM 1087 External Leadframe Plating Component Level Homogeneous Material Level Substance Description Tin & its alloys Tin CAS# 7440-31-5 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.26 1.05 E-03 PPM 12629 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.26 2.14 E-04 PPM 2575 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 6.15 5.11 E-03 PPM 61534 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other inorganic materials Others Other organic materials Subtotal Package Totals Substance Silver Epoxy Resin Metal oxide Curing and hardening agent Gamma Butyrolactone CAS# 7440-22-4 Proprietary Proprietary Proprietary 96-48-0 Component Level Weight (g) Percentage (%) PPM Percentage (%) 73.40 18.35 2.75 2.75 2.75 100.0 734000 183500 27500 27500 27500 1000000 0.73 0.18 0.03 0.03 0.03 0.99 6.02 E-04 1.51 E-04 2.26 E-05 2.26 E-05 2.26 E-05 8.21 E-04 Weight (g) 8.31 E-02 Percentage (%) 100 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary PPM 7250 1813 272 272 272 9878 PPM 1000000