Product / Package Information Environmental Information Package Body Size (mm) LeadCount Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant JIG Material Content Compliant REACH SVHC Compliant LFCSP - Punched 12 X 12 X 0.85 (6.0 EP) 88 100 Sn Yes Yes Yes Level A Compliant Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) Percentage (%) PPM Percentage (%) 86.9 12.8 0.3 100.00 869100 127800 3100 1000000 44.19 6.50 0.16 50.85 1.60E-01 2.35E-02 5.71E-04 1.84 E-01 PPM 441895 64980 1576 508451 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Nickel Silicon Zinc CAS# 7440-50-8 7440-02-0 7440-21-3 7440-66-6 Component Level Weight (g) Percentage (%) PPM Percentage (%) 96.40 2.50 0.60 0.50 100.00 963989 25006 6004 5001 1000000 41.93 1.09 0.26 0.22 43.50 1.52 E-01 3.94 E-03 9.46 E-04 7.88 E-04 1.58 E-01 PPM 419302 10877 2611 2175 434965 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance CAS# 7440-22-4 Silver Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.27 9.92 E-04 PPM 2739 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.13 4.11 E-03 PPM 11335 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.46 5.28 E-03 PPM 14572 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 2.60 9.41 E-03 PPM 25985 Die Attach 1 Homogeneous Material Level Description Precious metals Thermoset Other inorganic materials Others Other organic materials Subtotal Substance Silver Epoxy Resin Metal oxide Curing and hardening agent Gamma Butyrolactone CAS# Component Level Weight (g) 7440-22-4 Proprietary Proprietary Proprietary 96-48-0 1.09 E-04 2.72 E-05 4.07 E-06 4.07 E-06 4.07 E-06 1.48 E-04 CAS# Weight (g) Proprietary Proprietary 3.69 E-04 1.90 E-04 5.59 E-04 Percentage (%) PPM Percentage (%) 73.40 18.35 2.75 2.75 2.75 100.0 734000 183500 27500 27500 27500 1000000 0.03 0.01 0.00 0.00 0.00 0.04 PPM 300 75 11 11 11 409 Die Attach 2 Description Thermoset Others Subtotal Package Totals Substance Epoxy Resin Polymeric Resin Homogeneous Material Level Percentage (%) PPM 66.00 90648649 34.00 46697789 100.0 137346437 Weight (g) 3.62 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Component Level Percentage (%) 0.10 0.05 0.15 Percentage (%) 100 PPM 1019 525 1544 PPM 1000000