Materials Declaration Package Body Size LeadCount Option LFCSP 9 X 9 X 0.85 (4.7 EP) 64 Pb-free, Halide-free Substance Silica Epoxy & Phenol Resin Carbon black Subtotal Molding Compound % of Compound 86.91 12.78 0.31 100.00 Weight (g) 9.32 E-02 1.37 E-02 3.32 E-04 1.07 E-01 PPM 495599 72875 1766 570239 Substance Copper Iron Zinc Phosphorus Subtotal Leadframe % of Leadframe 97.62 2.19 0.11 0.07 100.00 Weight (g) 7.08 E-02 1.59 E-03 8.20 E-05 5.30 E-05 7.25 E-02 PPM 376544 8452 436 282 385714 Substance Silver Internal Leadframe Plating % of Plating Weight (g) 7.13 E-04 100 PPM 3792 Substance Tin External Leadframe Plating Weight (g) % of Plating 3.00 E-03 100 PPM 15957 Gold Bond Wires % of Wire 99.99 Weight (g) 1.63 E-03 PPM 8659 Substance Doped Silicon Chip % of Chip 100 Weight (g) 2.40 E-03 PPM 12755 Die Attach % of Die Attach 73.40 18.35 2.75 2.75 2.75 100.00 Weight (g) 3.98 E-04 9.90 E-05 1.50 E-05 1.50 E-05 1.50 E-05 5.42 E-04 PPM 2117 527 80 80 80 2883 Substance Substance Silver Epoxy Resin Metal oxide Curing and hardening agent Gamma Butyrolactone Subtotal Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Draft IEC62321. Not Detected Draft IEC62321. Not Detected Draft IEC62321. Not Detected Draft IEC62321. Not Detected Draft IEC62321. Not Detected Draft IEC62321. Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach Paste 1 Method PPM Not Detected Draft IEC 62321. ICP-AES. Not Detected Draft IEC 62321. ICP-AES. Not Detected Draft IEC 62321. ICP-AES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MS. Not Detected Draft IEC 62321. GC-MS. Package Totals PPM Weight (g) 1000000 1.88 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Method ICP. ICP. ICP. Colorimetric Method. GC-MS. GC-MS.