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Materials Declaration
Package
Body Size
LeadCount
Option
LFCSP
9 X 9 X 0.85 (4.7 EP)
64
Pb-free, Halide-free
Substance
Silica
Epoxy & Phenol Resin
Carbon black
Subtotal
Molding Compound
% of Compound
86.91
12.78
0.31
100.00
Weight (g)
9.32 E-02
1.37 E-02
3.32 E-04
1.07 E-01
PPM
495599
72875
1766
570239
Substance
Copper
Iron
Zinc
Phosphorus
Subtotal
Leadframe
% of Leadframe
97.62
2.19
0.11
0.07
100.00
Weight (g)
7.08 E-02
1.59 E-03
8.20 E-05
5.30 E-05
7.25 E-02
PPM
376544
8452
436
282
385714
Substance
Silver
Internal Leadframe Plating
% of Plating
Weight (g)
7.13 E-04
100
PPM
3792
Substance
Tin
External Leadframe Plating
Weight (g)
% of Plating
3.00 E-03
100
PPM
15957
Gold
Bond Wires
% of Wire
99.99
Weight (g)
1.63 E-03
PPM
8659
Substance
Doped Silicon
Chip
% of Chip
100
Weight (g)
2.40 E-03
PPM
12755
Die Attach
% of Die Attach
73.40
18.35
2.75
2.75
2.75
100.00
Weight (g)
3.98 E-04
9.90 E-05
1.50 E-05
1.50 E-05
1.50 E-05
5.42 E-04
PPM
2117
527
80
80
80
2883
Substance
Substance
Silver
Epoxy Resin
Metal oxide
Curing and hardening agent
Gamma Butyrolactone
Subtotal
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Molding Compound
PPM
Not Detected
Draft IEC62321.
Not Detected
Draft IEC62321.
Not Detected
Draft IEC62321.
Not Detected
Draft IEC62321.
Not Detected
Draft IEC62321.
Not Detected
Draft IEC62321.
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Die Attach Paste 1
Method
PPM
Not Detected
Draft IEC 62321. ICP-AES.
Not Detected
Draft IEC 62321. ICP-AES.
Not Detected
Draft IEC 62321. ICP-AES.
Not Detected
Draft IEC 62321. UV-VIS.
Not Detected
Draft IEC 62321. GC-MS.
Not Detected
Draft IEC 62321. GC-MS.
Package Totals
PPM
Weight (g)
1000000
1.88 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
Method
ICP.
ICP.
ICP.
Colorimetric Method.
GC-MS.
GC-MS.