Materials Declaration Package Body Size LeadCount Option Substance Silica Epoxy & Phenol Resin Carbon black Subtotal TQFP - EP 10 X 10 X 1.0 (7.5EP) 64 Pb-free, Halide-free Molding Compound % of Compound 88 11.5 0.5 100 Weight (g) 1.15 E-01 1.51 E-02 6.55 E-04 1.31 E-01 PPM 394725 51583 2243 448551 Leadframe % of Leadframe 99.25 0.30 0.25 0.20 100.00 Weight (g) 9.71 E-02 2.93 E-04 2.45 E-04 1.96 E-04 9.78 E-02 PPM 332286 1004 837 670 334797 Substance Silver Internal Leadframe Plating % of Plating 100 Weight (g) 1.20 E-03 PPM 4107 Substance Tin External Leadframe Plating % of Plating 100 Weight (g) 8.86 E-03 PPM 30318 Substance Gold Bond Wires % of Wire 99.99 Weight (g) 1.52 E-03 PPM 5216 Substance Doped Silicon Chip % of Chip 100 Weight (g) 4.52 E-02 PPM 154555 Substance Silver Epoxy resin Gamma Butyrolactone Curing agent & hardener Subtotal Die Attach % of Die Attach 75.47 18.87 2.83 2.83 100.00 Weight (g) 4.95 E-03 1.24 E-03 1.86 E-04 1.86 E-04 6.56 E-03 PPM 16948 4238 636 636 22457 Substance Copper Chromium Tin Zinc Subtotal Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach Paste PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Package Totals PPM Weight (g) 1000000 2.92 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information ADI Proprietary Method Draft IEC 62321. ICP Draft IEC 62321. ICP Draft IEC 62321. ICP Draft IEC 62321. Colorimetric Method. Draft IEC 62321. GC-MS. Draft IEC 62321. GC-MS. Method Draft IEC 62321. ICP-AES. Draft IEC 62321. ICP-AES. Draft IEC 62321. ICP-AES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MS. Draft IEC 62321. GC-MS. Materials Declaration Package Body Size LeadCount Option Substance Silica Epoxy & Phenol Resin Carbon black Subtotal Substance Copper Chromium Tin Zinc Subtotal TQFP - EP 10 X 10 X 1.0 (7.5EP) 64 With Pb, Halide-free Molding Compound % of Compound 88 11.5 0.5 Leadframe % of Leadframe 99.25 0.30 0.25 0.20 100.00 Weight (g) 1.15 E-01 1.51 E-02 6.55 E-04 1.31 E-01 PPM 394725 51584 2242 448551 Weight (g) 9.71 E-02 2.93 E-04 2.45 E-04 1.96 E-04 9.78 E-02 PPM 332285 1003 838 671 334797 Internal Leadframe Plating % of Plating 100 Weight (g) 1.20 E-03 PPM Silver Tin Lead Subtotal External Leadframe Plating % of Plating 85 15 100 Weight (g) 7.53 E-03 1.33 E-03 8.86 E-03 PPM 25770 4548 30318 Gold Bond Wires % of Wire 99.99 Weight (g) 1.52 E-03 PPM 5216 Substance Doped Silicon Chip % of Chip 100 Weight (g) 4.52 E-02 PPM 154555 Substance Silver Epoxy resin Gamma Butyrolactone Curing agent & hardener Subtotal Die Attach % of Die Attach 75.47 18.87 2.83 2.83 100.00 Weight (g) 4.95 E-03 1.24 E-03 1.86 E-04 1.86 E-04 6.56 E-03 PPM 16948 4238 636 636 22457 Substance Substance Substance Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach Paste PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected 4107 Package Totals PPM Weight (g) 1000000 2.92 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information ADI Proprietary Method Draft IEC 62321. ICP Draft IEC 62321. ICP Draft IEC 62321. ICP Draft IEC 62321. Colorimetric Method. Draft IEC 62321. GC-MS. Draft IEC 62321. GC-MS. Method Draft IEC 62321. ICP-AES. Draft IEC 62321. ICP-AES. Draft IEC 62321. ICP-AES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MS. Draft IEC 62321. GC-MS.