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Materials Declaration
Package
Body Size
LeadCount
Option
Substance
Silica
Epoxy & Phenol Resin
Carbon black
Subtotal
TQFP - EP
10 X 10 X 1.0 (7.5EP)
64
Pb-free, Halide-free
Molding Compound
% of Compound
88
11.5
0.5
100
Weight (g)
1.15 E-01
1.51 E-02
6.55 E-04
1.31 E-01
PPM
394725
51583
2243
448551
Leadframe
% of Leadframe
99.25
0.30
0.25
0.20
100.00
Weight (g)
9.71 E-02
2.93 E-04
2.45 E-04
1.96 E-04
9.78 E-02
PPM
332286
1004
837
670
334797
Substance
Silver
Internal Leadframe Plating
% of Plating
100
Weight (g)
1.20 E-03
PPM
4107
Substance
Tin
External Leadframe Plating
% of Plating
100
Weight (g)
8.86 E-03
PPM
30318
Substance
Gold
Bond Wires
% of Wire
99.99
Weight (g)
1.52 E-03
PPM
5216
Substance
Doped Silicon
Chip
% of Chip
100
Weight (g)
4.52 E-02
PPM
154555
Substance
Silver
Epoxy resin
Gamma Butyrolactone
Curing agent & hardener
Subtotal
Die Attach
% of Die Attach
75.47
18.87
2.83
2.83
100.00
Weight (g)
4.95 E-03
1.24 E-03
1.86 E-04
1.86 E-04
6.56 E-03
PPM
16948
4238
636
636
22457
Substance
Copper
Chromium
Tin
Zinc
Subtotal
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Molding Compound
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Die Attach Paste
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Package Totals
PPM
Weight (g)
1000000
2.92 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information
ADI Proprietary
Method
Draft IEC 62321. ICP
Draft IEC 62321. ICP
Draft IEC 62321. ICP
Draft IEC 62321. Colorimetric Method.
Draft IEC 62321. GC-MS.
Draft IEC 62321. GC-MS.
Method
Draft IEC 62321. ICP-AES.
Draft IEC 62321. ICP-AES.
Draft IEC 62321. ICP-AES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MS.
Draft IEC 62321. GC-MS.
Materials Declaration
Package
Body Size
LeadCount
Option
Substance
Silica
Epoxy & Phenol Resin
Carbon black
Subtotal
Substance
Copper
Chromium
Tin
Zinc
Subtotal
TQFP - EP
10 X 10 X 1.0 (7.5EP)
64
With Pb, Halide-free
Molding Compound
% of Compound
88
11.5
0.5
Leadframe
% of Leadframe
99.25
0.30
0.25
0.20
100.00
Weight (g)
1.15 E-01
1.51 E-02
6.55 E-04
1.31 E-01
PPM
394725
51584
2242
448551
Weight (g)
9.71 E-02
2.93 E-04
2.45 E-04
1.96 E-04
9.78 E-02
PPM
332285
1003
838
671
334797
Internal Leadframe Plating
% of Plating
100
Weight (g)
1.20 E-03
PPM
Silver
Tin
Lead
Subtotal
External Leadframe Plating
% of Plating
85
15
100
Weight (g)
7.53 E-03
1.33 E-03
8.86 E-03
PPM
25770
4548
30318
Gold
Bond Wires
% of Wire
99.99
Weight (g)
1.52 E-03
PPM
5216
Substance
Doped Silicon
Chip
% of Chip
100
Weight (g)
4.52 E-02
PPM
154555
Substance
Silver
Epoxy resin
Gamma Butyrolactone
Curing agent & hardener
Subtotal
Die Attach
% of Die Attach
75.47
18.87
2.83
2.83
100.00
Weight (g)
4.95 E-03
1.24 E-03
1.86 E-04
1.86 E-04
6.56 E-03
PPM
16948
4238
636
636
22457
Substance
Substance
Substance
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Molding Compound
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Die Attach Paste
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
4107
Package Totals
PPM
Weight (g)
1000000
2.92 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information
ADI Proprietary
Method
Draft IEC 62321. ICP
Draft IEC 62321. ICP
Draft IEC 62321. ICP
Draft IEC 62321. Colorimetric Method.
Draft IEC 62321. GC-MS.
Draft IEC 62321. GC-MS.
Method
Draft IEC 62321. ICP-AES.
Draft IEC 62321. ICP-AES.
Draft IEC 62321. ICP-AES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MS.
Draft IEC 62321. GC-MS.