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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Epoxy & Phenol Resin
Carbon black
Subtotal
LFCSP
3 X 3 X 0.85
16
Halide-free, Pb-free
Molding Compound
% of Compound
86.9
12.8
0.3
Weight (g)
5.77 E-03
8.48 E-04
2.06 E-05
6.64 E-03
PPM
331321
48720
1182
381223
Weight (g)
8.91 E-03
2.15 E-04
1.10 E-05
2.74 E-06
9.14 E-03
PPM
511859
12351
632
157
525000
Internal Leadframe Plating
% of Plating
100
Weight (g)
1.78 E-04
PPM
10226
Sn
External Leadframe Plating
% of Plating
100
Weight (g)
1.11 E-04
PPM
6377
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.99 E-04
PPM
11432
Si
Chip
% of Chip
100
Weight (g)
9.71 E-04
PPM
55782
Weight (g)
1.27 E-04
3.18 E-05
4.77 E-06
4.77 E-06
4.77 E-06
1.73 E-04
PPM
7312
1828
274
274
274
9961
Item
Cu
Fe
Zn
P
Ag
Item
Item
Ag
Epoxy Resin
Metal oxide
Curing and hardening agent
Gamma Butyrolactone
Subtotal
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
Die Attach
% of Die Attach
73.40
18.35
2.75
2.75
2.75
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. UV-VIS.
Not Detected
Draft IEC 62321. GC-MSD.
Not Detected
Draft IEC 62321. GC-MSD.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. UV-VIS.
Not Detected
Draft IEC 62321. GC-MSD.
Not Detected
Draft IEC 62321. GC-MSD.
Package Totals
Weight (g)
PPM
1000000
1.74 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
LFCSP
3 X 3 X 0.85
16
Halide-free, Sn/Pb
Item
SiO2 Filler
Epoxy & Phenol Resin
Carbon black
Subtotal
Molding Compound
% of Compound
86.9
12.8
0.3
Cu
Fe
Zn
P
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
Ag
Internal Leadframe Plating
% of Plating
100
Item
Item
Sn
Pb
Subtotal
External Leadframe Plating
% of Plating
85
15
Weight (g)
5.77 E-03
8.48 E-04
2.06 E-05
6.64 E-03
PPM
331330
48722
1182
381234
Weight (g)
8.91 E-03
2.15 E-04
1.10 E-05
2.74 E-06
9.14 E-03
PPM
511874
12352
632
157
525015
Weight (g)
1.78 E-04
PPM
10226
Weight (g)
9.39 E-05
1.66 E-05
1.11 E-04
PPM
Bond Wires
% of Wire
99.99
Weight (g)
1.99 E-04
PPM
11432
Si
Chip
% of Chip
100
Weight (g)
9.71 E-04
PPM
55783
Weight (g)
1.27 E-04
3.18 E-05
4.77 E-06
4.77 E-06
4.77 E-06
1.73 E-04
PPM
Die Attach
% of Die Attach
73.40
18.35
2.75
2.75
2.75
Molding Compound
Method
PPM
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. UV-VIS.
Not Detected
Draft IEC 62321. GC-MSD.
Not Detected
Draft IEC 62321. GC-MSD.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste
Method
PPM
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. UV-VIS.
Not Detected
Draft IEC 62321. GC-MSD.
Not Detected
Draft IEC 62321. GC-MSD.
5394
954
6348
Au
Item
Ag
Epoxy Resin
Metal oxide
Curing and hardening agent
Gamma Butyrolactone
Subtotal
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
7312
1828
274
274
274
9962
Package Totals
Weight (g)
PPM
1000000
1.74 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary