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Materials Declaration
Package
Body Size/Pitch
LeadCount
Option
QSOP_EP
150 mils
16
Pb-free
Substance
Silica
Resin
Antimony Trioxide
Brominated Resin
Subtotal
Molding Compound
% of Compound
75.00
22.20
2.00
0.80
100
Weight (g)
3.23 E-02
9.56 E-03
8.61 E-04
3.44 E-04
4.30 E-02
PPM
415760
123065
11087
4435
554346
Substance
Copper
Iron
Zinc
Phosphorus
Subtotal
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
100
Weight (g)
2.99 E-02
7.21 E-04
3.68 E-05
9.21 E-06
3.07 E-02
PPM
385470
9291
474
119
395354
Substance
Silver
Internal Leadframe Plating
% of Plating
100
Weight (g)
4.45 E-04
PPM
5731
Substance
Tin
External Leadframe Plating
% of Plating
100
Weight (g)
1.43 E-03
PPM
18421
Gold
Bond Wires
% of Wire
99.99
Weight (g)
4.20 E-04
PPM
5409
Substance
Doped Silicon
Chip
% of Chip
100
Weight (g)
1.30 E-03
PPM
16701
Substance
Silver
Epoxy Resin
Metal oxide
Amine
Gamma Butyrolactone
Subtotal
Die Attach
% of Die Attach
73.40
18.35
2.75
2.75
2.75
100.00
Weight (g)
2.30 E-04
5.75 E-05
8.62 E-06
8.62 E-06
8.62 E-06
3.14 E-04
PPM
2964
741
111
111
111
4039
Substance
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Package Totals
PPM
Weight (g)
1000000
7.77 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
Molding Compound
Method
PPM
Not Detected
Draft IEC62321. ICP-OES.
Not Detected
Draft IEC62321. ICP-OES.
Not Detected
Draft IEC62321. ICP-OES.
Not Detected
Draft IEC62321. UV-VIS.
Not Detected
Draft IEC62321. GC-MSD.
Not Detected
Draft IEC62321. GC-MSD.
Die Attach Paste
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
Draft IEC62321. ICP-OES.
Draft IEC62321. ICP-OES.
Draft IEC62321. ICP-OES.
Draft IEC62321. UV-VIS.
Draft IEC62321. GC-MSD.
Draft IEC62321. GC-MSD.
AMK-RQ-B
Materials Declaration
Package
Body Size/Pitch
LeadCount
Option
QSOP_EP
150 mils
16
with Pb
Substance
Silica
Resin
Antimony Trioxide
Brominated Resin
Subtotal
Molding Compound
% of Compound
75.00
22.20
2.00
0.80
100
Weight (g)
3.23 E-02
9.56 E-03
8.61 E-04
3.44 E-04
4.30 E-02
PPM
415760
123065
11087
4435
554346
Substance
Copper
Iron
Zinc
Phosphorus
Subtotal
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
100
Weight (g)
2.99 E-02
7.21 E-04
3.68 E-05
9.21 E-06
3.07 E-02
PPM
385470
9291
474
119
395354
Silver
Internal Leadframe Plating
% of Plating
Weight (g)
4.45 E-04
100
Tin
Lead
Subtotal
External Leadframe Plating
% of Plating
85
15
100
Substance
Substance
PPM
5731
Weight (g)
1.22 E-03
2.15 E-04
1.43 E-03
PPM
15658
2763
18421
Bond Wires
% of Wire
99.99
Weight (g)
4.20 E-04
PPM
Gold
Substance
Doped Silicon
Chip
% of Chip
100
Weight (g)
1.30 E-03
PPM
16701
Die Attach
% of Die Attach
73.40
18.35
2.75
2.75
2.75
100
Weight (g)
2.30 E-04
5.75 E-05
8.62 E-06
8.62 E-06
8.62 E-06
3.14 E-04
PPM
Substance
Substance
Silver
Epoxy Resin
Metal oxide
Amine
Gamma Butyrolactone
Subtotal
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Molding Compound
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
Draft IEC62321. ICP-OES.
Draft IEC62321. ICP-OES.
Draft IEC62321. ICP-OES.
Draft IEC62321. UV-VIS.
Draft IEC62321. GC-MSD.
Draft IEC62321. GC-MSD.
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Die Attach Paste
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
Draft IEC62321. ICP-OES.
Draft IEC62321. ICP-OES.
Draft IEC62321. ICP-OES.
Draft IEC62321. UV-VIS.
Draft IEC62321. GC-MSD.
Draft IEC62321. GC-MSD.
5409
2964
741
111
111
111
4039
Package Totals
PPM
Weight (g)
1000000
7.77 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
AMK-RQ-A