Materials Declaration Package Body Size/Pitch LeadCount Option QSOP_EP 150 mils 16 Pb-free Substance Silica Resin Antimony Trioxide Brominated Resin Subtotal Molding Compound % of Compound 75.00 22.20 2.00 0.80 100 Weight (g) 3.23 E-02 9.56 E-03 8.61 E-04 3.44 E-04 4.30 E-02 PPM 415760 123065 11087 4435 554346 Substance Copper Iron Zinc Phosphorus Subtotal Leadframe % of Leadframe 97.5 2.35 0.12 0.03 100 Weight (g) 2.99 E-02 7.21 E-04 3.68 E-05 9.21 E-06 3.07 E-02 PPM 385470 9291 474 119 395354 Substance Silver Internal Leadframe Plating % of Plating 100 Weight (g) 4.45 E-04 PPM 5731 Substance Tin External Leadframe Plating % of Plating 100 Weight (g) 1.43 E-03 PPM 18421 Gold Bond Wires % of Wire 99.99 Weight (g) 4.20 E-04 PPM 5409 Substance Doped Silicon Chip % of Chip 100 Weight (g) 1.30 E-03 PPM 16701 Substance Silver Epoxy Resin Metal oxide Amine Gamma Butyrolactone Subtotal Die Attach % of Die Attach 73.40 18.35 2.75 2.75 2.75 100.00 Weight (g) 2.30 E-04 5.75 E-05 8.62 E-06 8.62 E-06 8.62 E-06 3.14 E-04 PPM 2964 741 111 111 111 4039 Substance Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Package Totals PPM Weight (g) 1000000 7.77 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Molding Compound Method PPM Not Detected Draft IEC62321. ICP-OES. Not Detected Draft IEC62321. ICP-OES. Not Detected Draft IEC62321. ICP-OES. Not Detected Draft IEC62321. UV-VIS. Not Detected Draft IEC62321. GC-MSD. Not Detected Draft IEC62321. GC-MSD. Die Attach Paste PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC62321. ICP-OES. Draft IEC62321. ICP-OES. Draft IEC62321. ICP-OES. Draft IEC62321. UV-VIS. Draft IEC62321. GC-MSD. Draft IEC62321. GC-MSD. AMK-RQ-B Materials Declaration Package Body Size/Pitch LeadCount Option QSOP_EP 150 mils 16 with Pb Substance Silica Resin Antimony Trioxide Brominated Resin Subtotal Molding Compound % of Compound 75.00 22.20 2.00 0.80 100 Weight (g) 3.23 E-02 9.56 E-03 8.61 E-04 3.44 E-04 4.30 E-02 PPM 415760 123065 11087 4435 554346 Substance Copper Iron Zinc Phosphorus Subtotal Leadframe % of Leadframe 97.5 2.35 0.12 0.03 100 Weight (g) 2.99 E-02 7.21 E-04 3.68 E-05 9.21 E-06 3.07 E-02 PPM 385470 9291 474 119 395354 Silver Internal Leadframe Plating % of Plating Weight (g) 4.45 E-04 100 Tin Lead Subtotal External Leadframe Plating % of Plating 85 15 100 Substance Substance PPM 5731 Weight (g) 1.22 E-03 2.15 E-04 1.43 E-03 PPM 15658 2763 18421 Bond Wires % of Wire 99.99 Weight (g) 4.20 E-04 PPM Gold Substance Doped Silicon Chip % of Chip 100 Weight (g) 1.30 E-03 PPM 16701 Die Attach % of Die Attach 73.40 18.35 2.75 2.75 2.75 100 Weight (g) 2.30 E-04 5.75 E-05 8.62 E-06 8.62 E-06 8.62 E-06 3.14 E-04 PPM Substance Substance Silver Epoxy Resin Metal oxide Amine Gamma Butyrolactone Subtotal Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC62321. ICP-OES. Draft IEC62321. ICP-OES. Draft IEC62321. ICP-OES. Draft IEC62321. UV-VIS. Draft IEC62321. GC-MSD. Draft IEC62321. GC-MSD. Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach Paste PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC62321. ICP-OES. Draft IEC62321. ICP-OES. Draft IEC62321. ICP-OES. Draft IEC62321. UV-VIS. Draft IEC62321. GC-MSD. Draft IEC62321. GC-MSD. 5409 2964 741 111 111 111 4039 Package Totals PPM Weight (g) 1000000 7.77 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary AMK-RQ-A