Materials Declaration Package Body Size LeadCount Option Substance Silica Epoxy resin Phenol Resin Metal Hyroxide Carbon Black Subtotal Substance Copper Nickel Silicon Magnesium Subtotal Substance Nickel Palladium Gold Subtotal Substance Gold Substance Doped Silicon Substance Silica Resin Additive Bisphenol A Glycidylether Subtotal LFCSP 2 X 2 X 0.55 mm 8 Halide-free, Pb-free Molding Compound % of Compound 80.80 9.00 5.00 5.00 0.20 100.00 Weight (g) 2.07E-03 2.30E-04 1.28E-04 1.28E-04 5.12E-06 2.56E-03 PPM 234522 26122 14512 14512 580 290249 Leadframe % of Leadframe 96.20 3.00 0.65 0.15 100.00 Weight (g) 5.19 E-03 1.62 E-04 3.51 E-05 8.10 E-06 5.40 E-03 PPM 588980 18367 3980 918 612245 Internal/External Leadframe Plating % of Plating Weight (g) 1.36 E-04 90.91 1.19 E-05 7.91 1.78 E-06 1.19 100.00 1.50 E-04 PPM 15461 1344 202 17007 Bond Wires % of Wire 100.0 Weight (g) 5.00 E-05 PPM Chip % of Chip 100.0 Weight (g) 5.70 E-04 PPM 64626 Weight (g) 6.30 E-05 1.35 E-05 9.00 E-06 4.50 E-06 9.00 E-05 PPM Die Attach % of Die Attach 70.0 15.0 10.0 5.0 Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Die Attach 1 PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC 62321. ICP-OES Draft IEC 62321. ICP-OES Draft IEC 62321. ICP-OES Draft IEC 62321. UV-VIS Draft IEC 62321. GC-MSD Draft IEC 62321. GC-MSD Method EPA 3052. ICP-AES EPA 3052. ICP-AES EPA 3052. ICP-AES EPA 3060A & 7196A. UV-VIS. EPA Method 3540C/3541/3550C. GC/MS. EPA Method 3540C/3541/3550C. GC/MS. 5669 7143 1531 1020 510 10204 Package Totals PPM Weight (g) 1000000 8.82 E-03 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary amk-cp-m