pdf

Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Epoxy Resin
Phenol Resin
Subtotal
Item
Cu
Fe
Zn
P
Subtotal
Ag
Item
Sn
LFCSP
7X7
48
Pb-free
Molding Compound
% of Compound
85
10
5
Weight (g)
4.25 E-02
4.99 E-03
2.50 E-03
4.99 E-02
PPM
336123
39544
19772
395439
Weight (g)
6.50 E-02
1.57 E-03
8.01 E-05
2.00 E-05
6.67 E-02
PPM
514996
12413
634
158
528201
Internal Leadframe Plating
Weight (g)
% of Plating
1.35 E-03
100
PPM
10685
External Leadframe Plating
% of Plating
Weight (g)
100
3.34 E-04
PPM
2644
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.00 E-03
PPM
7918
Si
Chip
% of Chip
100
Weight (g)
5.97 E-03
PPM
47254
Weight (g)
7.44 E-04
2.48 E-04
9.92 E-04
PPM
5894
1965
7858
Item
Ag Filler
Resin
Subtotal
Die Attach
% of Die Attach
75
25
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
EPA Method 3051A/3052. ICP-OES.
Not Detected
EPA Method 3051A/3052. ICP-OES.
Not Detected
EPA Method 3051A/3052. ICP-OES.
Not Detected
EPA Method 3060A & 7196A. UV-VIS.
Not Detected
EPA Method 3540C/3550C. GC/MS.
Not Detected
EPA Method 3540C/3550C. GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
3
Not Detected
Not Detected
Die Attach Paste
Method
EPA Method 3051A/3052. ICP-OES.
EPA Method 3051A/3052. ICP-OES.
EPA Method 3051A/3052. ICP-OES.
EPA Method 3060A & 7196A. UV-VIS.
EPA Method 3540C/3550C. GC/MS.
EPA Method 3540C/3550C. GC/MS.
Package Totals
PPM
Weight (g)
1000000
1.26 E-01
AMK-CP-C
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Epoxy Resin
Phenol Resin
Subtotal
Item
Cu
Fe
Zn
P
Subtotal
Ag
Item
Sn
Pb
Subtotal
LFCSP
7X7
48
Sn/Pb
Molding Compound
% of Compound
85
10
5
Weight (g)
4.25 E-02
4.99 E-03
2.50 E-03
4.99 E-02
PPM
336123
39544
19772
395439
Weight (g)
6.50 E-02
1.57 E-03
8.01 E-05
2.00 E-05
6.67 E-02
PPM
514996
12413
634
158
528201
Internal Leadframe Plating
Weight (g)
% of Plating
1.35 E-03
100
PPM
10685
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
External Leadframe Plating
% of Plating
Weight (g)
85
2.84 E-04
15
5.01 E-05
3.34 E-04
Weight (g)
1.00 E-03
PPM
Si
Chip
% of Chip
100
Weight (g)
5.97 E-03
PPM
47254
Weight (g)
7.44 E-04
2.48 E-04
9.92 E-04
PPM
Die Attach
% of Die Attach
75
25
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
3
Not Detected
Not Detected
Die Attach Paste
Method
EPA Method 3051A/3052. ICP-OES.
EPA Method 3051A/3052. ICP-OES.
EPA Method 3051A/3052. ICP-OES.
EPA Method 3060A & 7196A. UV-VIS.
EPA Method 3540C/3550C. GC/MS.
EPA Method 3540C/3550C. GC/MS.
2247
397
2644
Au
Item
Molding Compound
Method
PPM
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3051A/3052. ICP-OES.
Not Detected EPA Method 3060A & 7196A. UV-VIS.
Not Detected EPA Method 3540C/3550C. GC/MS.
Not Detected EPA Method 3540C/3550C. GC/MS.
PPM
Bond Wires
% of Wire
99.99
Ag Filler
Resin
Subtotal
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
7918
5894
1965
7858
Package Totals
PPM
Weight (g)
1000000
1.26 E-01
AMK-CP-A
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary