Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy Resin Phenol Resin Subtotal Item Cu Fe Zn P Subtotal Ag Item Sn LFCSP 7X7 48 Pb-free Molding Compound % of Compound 85 10 5 Weight (g) 4.25 E-02 4.99 E-03 2.50 E-03 4.99 E-02 PPM 336123 39544 19772 395439 Weight (g) 6.50 E-02 1.57 E-03 8.01 E-05 2.00 E-05 6.67 E-02 PPM 514996 12413 634 158 528201 Internal Leadframe Plating Weight (g) % of Plating 1.35 E-03 100 PPM 10685 External Leadframe Plating % of Plating Weight (g) 100 3.34 E-04 PPM 2644 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Au Bond Wires % of Wire 99.99 Weight (g) 1.00 E-03 PPM 7918 Si Chip % of Chip 100 Weight (g) 5.97 E-03 PPM 47254 Weight (g) 7.44 E-04 2.48 E-04 9.92 E-04 PPM 5894 1965 7858 Item Ag Filler Resin Subtotal Die Attach % of Die Attach 75 25 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3060A & 7196A. UV-VIS. Not Detected EPA Method 3540C/3550C. GC/MS. Not Detected EPA Method 3540C/3550C. GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected 3 Not Detected Not Detected Die Attach Paste Method EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3060A & 7196A. UV-VIS. EPA Method 3540C/3550C. GC/MS. EPA Method 3540C/3550C. GC/MS. Package Totals PPM Weight (g) 1000000 1.26 E-01 AMK-CP-C Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy Resin Phenol Resin Subtotal Item Cu Fe Zn P Subtotal Ag Item Sn Pb Subtotal LFCSP 7X7 48 Sn/Pb Molding Compound % of Compound 85 10 5 Weight (g) 4.25 E-02 4.99 E-03 2.50 E-03 4.99 E-02 PPM 336123 39544 19772 395439 Weight (g) 6.50 E-02 1.57 E-03 8.01 E-05 2.00 E-05 6.67 E-02 PPM 514996 12413 634 158 528201 Internal Leadframe Plating Weight (g) % of Plating 1.35 E-03 100 PPM 10685 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 External Leadframe Plating % of Plating Weight (g) 85 2.84 E-04 15 5.01 E-05 3.34 E-04 Weight (g) 1.00 E-03 PPM Si Chip % of Chip 100 Weight (g) 5.97 E-03 PPM 47254 Weight (g) 7.44 E-04 2.48 E-04 9.92 E-04 PPM Die Attach % of Die Attach 75 25 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected 3 Not Detected Not Detected Die Attach Paste Method EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3051A/3052. ICP-OES. EPA Method 3060A & 7196A. UV-VIS. EPA Method 3540C/3550C. GC/MS. EPA Method 3540C/3550C. GC/MS. 2247 397 2644 Au Item Molding Compound Method PPM Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3051A/3052. ICP-OES. Not Detected EPA Method 3060A & 7196A. UV-VIS. Not Detected EPA Method 3540C/3550C. GC/MS. Not Detected EPA Method 3540C/3550C. GC/MS. PPM Bond Wires % of Wire 99.99 Ag Filler Resin Subtotal Item Pb Cd Hg Cr+6 PBB PBDE 7918 5894 1965 7858 Package Totals PPM Weight (g) 1000000 1.26 E-01 AMK-CP-A Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary