Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Resin Sb2O3 Brominated Resin Subtotal Item Cu Ni Si Mg Subtotal Item Ag Item Sn Pb Subtotal Item Au Item Si Item Ag Filler Resin Aromatic Amine Subtotal TSSOP 6.1 mm 28 SnPb Molding Compound % of Compound 85 14.2 0.5 0.35 Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 6.99 E-02 1.16 E-02 4.11 E-04 2.88 E-04 8.23 E-02 PPM 456753 76038 2684 1881 537356 Weight (g) 5.74 E-02 1.79 E-03 3.88 E-04 9.00 E-05 5.97 E-02 PPM 375124 11697 2534 588 389943 Internal Leadframe Plating % of Plating Weight (g) 1.02 E-03 100 External Leadframe Plating % of Plating Weight (g) 85 2.58 E-03 15 4.56 E-04 3.04 E-03 PPM PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected 6655 PPM 16876 2978 19854 Bond Wires % of Wire 99.99 Weight (g) 4.67 E-04 PPM Chip % of Chip 100 Weight (g) 5.47 E-03 PPM 35724 Weight (g) 8.52 E-04 2.27 E-04 5.70 E-05 1.14 E-03 PPM Die Attach % of Die Attach 75 20 5 Item Pb Cd Hg Cr+6 PBB PBDE 3050 5564 1482 372 7419 Package Totals Weight (g) PPM 1000000 1.53 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liab any inaccuracy of such information. ADI Proprietary Molding Compound Method USEPA 3050B. ICP AES EN1122, MethodB:2001. ICP-AES USEPA 3052. ICP-AES. USEPA 7196A. USEPA 3060A. USEPA 3540C/3550C. HPLC/DAD,LC/MS or GC/MS. USEPA 3540C/3550C. HPLC/DAD,LC/MS or GC/MS. Die Attach Paste Method EPA Method 3051/3052. ICP-OES EPA Method 3051/3052. ICP-OES EPA Method 3051/3052. ICP-OES EPA Method 3060A & 7196A. UV-VIS. EPA Method 3550/3540C. GC/MS. EPA Method 3550/3540C. GC/MS. AMK-RV-A bility to