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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Resin
Sb2O3
Brominated Resin
Subtotal
Item
Cu
Ni
Si
Mg
Subtotal
Item
Ag
Item
Sn
Pb
Subtotal
Item
Au
Item
Si
Item
Ag Filler
Resin
Aromatic Amine
Subtotal
TSSOP
6.1 mm
28
SnPb
Molding Compound
% of Compound
85
14.2
0.5
0.35
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Weight (g)
6.99 E-02
1.16 E-02
4.11 E-04
2.88 E-04
8.23 E-02
PPM
456753
76038
2684
1881
537356
Weight (g)
5.74 E-02
1.79 E-03
3.88 E-04
9.00 E-05
5.97 E-02
PPM
375124
11697
2534
588
389943
Internal Leadframe Plating
% of Plating
Weight (g)
1.02 E-03
100
External Leadframe Plating
% of Plating
Weight (g)
85
2.58 E-03
15
4.56 E-04
3.04 E-03
PPM
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
6655
PPM
16876
2978
19854
Bond Wires
% of Wire
99.99
Weight (g)
4.67 E-04
PPM
Chip
% of Chip
100
Weight (g)
5.47 E-03
PPM
35724
Weight (g)
8.52 E-04
2.27 E-04
5.70 E-05
1.14 E-03
PPM
Die Attach
% of Die Attach
75
20
5
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
3050
5564
1482
372
7419
Package Totals
Weight (g)
PPM
1000000
1.53 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liab
any inaccuracy of such information.
ADI Proprietary
Molding Compound
Method
USEPA 3050B. ICP AES
EN1122, MethodB:2001. ICP-AES
USEPA 3052. ICP-AES.
USEPA 7196A. USEPA 3060A.
USEPA 3540C/3550C. HPLC/DAD,LC/MS or GC/MS.
USEPA 3540C/3550C. HPLC/DAD,LC/MS or GC/MS.
Die Attach Paste
Method
EPA Method 3051/3052. ICP-OES
EPA Method 3051/3052. ICP-OES
EPA Method 3051/3052. ICP-OES
EPA Method 3060A & 7196A. UV-VIS.
EPA Method 3550/3540C. GC/MS.
EPA Method 3550/3540C. GC/MS.
AMK-RV-A
bility to