Materials Declaration Package Body Size LeadCount Option SC70 -4 Pb-Free Item OCN SiO2 Sb2O3 Br Carbon Black Item Fe Ni Mn Si Ag Item Sn Molding Compound % of Compound 16 80 2.4 0.6 1 Weight (g) 3.63 E-04 1.82 E-03 5.45 E-05 1.36 E-05 2.27 E-05 PPM 62874 314368 9431 2358 3930 Leadframe % of Leadframe 58.4 41 0.4 0.2 Weight (g) 1.50 E-03 1.05 E-03 1.02 E-05 5.12 E-06 PPM 258807 181696 1773 886 Internal Leadframe Plating % of Plating 100 Weight (g) 1.00 E-04 PPM 17311 External Leadframe Plating % of Plating 100 Weight (g) 5.83 E-04 PPM 100981 Weight (g) 3.33 E-05 PPM 99.99 100 Weight (g) 2.10 E-04 PPM 36353 Weight (g) 5.00 E-06 1.50 E-05 PPM 25 75 Bond Wires % of Wire Au Chip % of Chip Si Item Resin Ag Filler Die Attach % of Die Attach Item Pb Cd Hg Cr+6 Molding Compound Method PPM <10.38 ICP AES 0.0039 ICP AES Not Detected ICP AES Not Detected DIN 53314 Die Attach Paste Item Pb Cd Hg Cr+6 PBB PBDE PPM <5 <5 <5 <5 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES 5770 866 2597 Package Totals Weight (g) PPM 1000000 5.78 E-03 CRS-KS-E Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 05/24/05 Materials Declaration Package Body Size LeadCount Option SC70-ISOLATED BACKSIDE -4 Pb-free, Halide-free Substance Silica Epoxy resin Phenol Resin Metal Hyroxide Carbon Black Subtotal Molding Compound % of Compound 80.8 9.0 5.0 5.0 0.2 100.0 Weight (g) 2.63 E-03 2.93 E-04 1.63 E-04 1.63 E-04 6.52 E-06 3.26 E-03 PPM 465533 51854 28808 28808 1152 576154 Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. Substance Iron Nickel Manganese Cobalt Silicon Chromium Aluminum Subtotal Leadframe % of Leadframe 56.7 41.5 0.8 0.5 0.3 0.1 0.1 100 Weight (g) 1.02 E-03 7.48 E-04 1.44 E-05 9.01 E-06 5.41 E-06 1.80 E-06 1.80 E-06 1.80 E-03 PPM 180556 132153 2548 1592 955 318 318 318440 Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach Paste PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. Substance Internal Leadframe Plating Weight (g) % of Plating 1.82 E-05 100 PPM 3217 Substance External Leadframe Plating % of Plating Weight (g) 100 3.18 E-04 PPM 56238 Silver Tin Gold Bond Wires % of Wire 99.99 Weight (g) 3.00 E-05 PPM 5302 Substance Doped Silicon Chip % of Chip 100 Weight (g) 2.10 E-04 PPM 37114 Die Attach % of Die Attach 46.00 46.00 8.00 100 Weight (g) 9.20 E-06 9.20 E-06 1.60 E-06 2.00 E-05 PPM 1626 1626 283 3535 Substance Substance Silicon Dioxide Epoxy Resin Curing agent & hardener Subtotal Package Totals PPM Weight (g) 1000000 5.66 E-03 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Molding Compound % of Compound 87.3 4.5 3.0 3.0 2.0 0.2 100 Weight (g) 2.85 E-03 1.47 E-04 9.78 E-05 9.78 E-05 6.52 E-05 6.52 E-06 3.26 E-03 PPM 489006 25207 16804 16804 11203 1120 560145 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 100 Weight (g) 2.21 E-03 5.34 E-05 2.72 E-06 6.81 E-07 2.27 E-03 PPM 380428 9169 468 117 390182 Internal Leadframe Plating/External Leadframe Plating Substance % of Plating Weight (g) 2.65 E-05 90.91 2.30 E-06 7.91 3.45 E-07 1.19 100.00 2.91 E-05 PPM 4545 395 59 4999 Substance Silica Phenol Resin Epoxy Resin 1 Epoxy Resin 2 Others Carbon Black Subtotal Substance Copper Iron Zinc Phosphorus Subtotal Nickel Palladium Gold Subtotal SC70 - COL -4 NiPdAu Bond Wires % of Wire 99.99 Weight (g) 3.00 E-05 PPM 5154 Substance Doped Silicon Chip % of Chip 100 Weight (g) 2.10 E-04 PPM 36083 Substance Epoxy Resin Metal Oxide Glycol ethers Silica Curing agent & hardener Subtotal Die Attach % of Die Attach 31 31 22 8 8 100 Weight (g) 6.20 E-06 6.20 E-06 4.40 E-06 1.60 E-06 1.60 E-06 2.00 E-05 PPM 1065 1065 756 275 275 3436 Substance Gold Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Package Totals PPM Weight (g) 1000000 5.82 E-03 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method USEPA 3050B. ICP-OES. EN1122, method B:2001. ICP-OES. USEPA 3052. ICP-OES. EPA 3060A/7196A. UV-VIS. EPA 3540C/3550B. GC-MS. EPA 3540C/3550B. GC-MS. Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. Materials Declaration Package Body Size LeadCount Option Item OCN SiO2 Sb2O3 Br Carbon Black Item SC70 -4 Sn/Pb Molding Compound % of Compound 16 80 2.4 0.6 1 Weight (g) 3.63 E-04 1.82 E-03 5.45 E-05 1.36 E-05 2.27 E-05 PPM 62874 314368 9431 2358 3930 Weight (g) 1.50 E-03 1.05 E-03 1.02 E-05 5.12 E-06 PPM 258807 181696 1773 886 Internal Leadframe Plating % of Plating 100 Weight (g) 1.00 E-04 PPM 17311 External Leadframe Plating % of Plating 85 15 Weight (g) 4.96 E-04 8.75 E-05 PPM 85834 15147 Weight (g) 3.33 E-05 PPM 100 Weight (g) 2.10 E-04 PPM 36353 Weight (g) 5.00 E-06 1.50 E-05 PPM 25 75 Leadframe % of Leadframe Fe Ni Mn Si 58.4 41 0.4 0.2 Ag Item Sn Pb Bond Wires % of Wire 99.99 Au Chip % of Chip Si Item Resin Ag Filler Die Attach % of Die Attach Molding Compound Method PPM <10.38 ICP AES 0.0039 ICP AES Not Detected ICP AES Not Detected DIN 53314 Item Pb Cd Hg Cr+6 Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste PPM <5 ICP AES <5 ICP AES <5 ICP AES <5 ICP AES Not Detected Not Detected Method 5770 866 2597 Package Totals Weight (g) PPM 1000000 5.78 E-03 CRS-KS-A Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 05/24/05