pdf

Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2
Resin
Sb2O3
Brominated epoxy
Carbon Black
Subtotal
SOT 23
-6
Pb-free
Molding Compound
% of Compound
82.0
15.0
1.4
1.0
0.6
Weight (g)
6.67 E-03
1.22 E-03
1.14 E-04
8.12 E-05
4.06 E-05
8.12 E-03
PPM
379609
69356
6473
4624
2312
462374
Weight (g)
7.53 E-03
1.76 E-04
9.75 E-06
1.87 E-06
7.72 E-03
PPM
429006
10020
555
107
439688
Internal Leadframe Plating
% of Plating
100
Weight (g)
7.80 E-05
PPM
4442
Sn
External Leadframe Plating
% of Plating
100
Weight (g)
4.02 E-04
PPM
22889
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.70 E-04
PPM
9679
Si
Chip
% of Chip
100
Weight (g)
1.00 E-03
PPM
56943
Weight (g)
5.60 E-05
1.05 E-05
3.50 E-06
7.00 E-05
PPM
3189
598
199
3986
Item
Cu
Fe
Zn
P
Subtotal
Ag
Item
Item
Ag Filler
Resin
Aromatic Amine
Subtotal
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
Die Attach
% of Die Attach
80
15
5
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
PPM
Not Detected
Draft IEC 62321.
Not Detected
Draft IEC 62321.
Not Detected
Draft IEC 62321.
Not Detected
Draft IEC 62321.
Not Detected
Draft IEC 62321.
Not Detected
Draft IEC 62321.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Die Attach Paste
Package Totals
PPM
Weight (g)
1000000
1.76 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
ICP-OES.
ICP-OES.
ICP-OES.
UV-VIS.
GC-MSD
GC-MSD
Draft IEC 62321.
Draft IEC 62321.
Draft IEC 62321.
Draft IEC 62321.
Draft IEC 62321.
Draft IEC 62321.
Method
ICP-OES.
ICP-OES.
ICP-OES.
UV-VIS.
GC-MSD
GC-MSD
CRS-RJ-D
Materials Declaration
Package
Body Size
LeadCount
Option
Substance
Silica
Epoxy Resin
Phenol Resin
Antimony Trioxide
Additive
Brominated epoxy
Carbon Black
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
Subtotal
Substance
Tin
Substance
Lead
Indium
Subtotal
Substance
Lead
Tin
Subtotal
SOT 23 - FCOL
-6
Sn with exemption, RoHS-compliant
Molding Compound
% of Compound
81.0
10.0
5.0
1.4
1.1
1.0
0.5
100.0
Weight (g)
6.56 E-03
8.10 E-04
4.05 E-04
1.13 E-04
8.91 E-05
8.10 E-05
4.05 E-05
8.10 E-03
PPM
338233
41757
20879
5846
4593
4176
2088
417571
Weight (g)
6.03 E-03
1.45 E-04
7.43 E-06
1.86 E-06
6.19 E-03
PPM
311004
7496
383
96
318978
Weight (g)
2.34 E-04
PPM
12062
Solder Paste
% of Solder Paste
75.0
25.0
100.0
Weight (g)
3.83 E-04
1.28 E-04
5.10 E-04
PPM
19719
6573
26292
Wafer Bumps
% of Wafer Bumps
90.0
10.0
100.0
Weight (g)
3.02 E-04
3.35 E-05
3.35 E-04
PPM
15561
1729
17291
Weight (g)
1.28 E-06
4.96 E-07
1.83 E-07
3.73 E-08
2.00 E-06
1.82 E-06
PPM
Weight (g)
4.03 E-03
PPM
207703
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
100.00
External Leadframe Plating
% of Plating
100.0
Copper
Nickel
Vanadium
Aluminum
Subtotal
UBM
% of UBM
64.16
24.81
9.17
1.87
100.00
Substance
Doped Silicon
Chip
% of Chip
100.0
Substance
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Molding Compound
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
66
26
9
2
103
Package Totals
Weight (g)
PPM
1000000
1.94 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
RJ-15
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2
Resin
Sb2O3
Brominated epoxy
Carbon Black
Subtotal
Item
Cu
Fe
Zn
P
Subtotal
SOT 23
-6
SnPb
Molding Compound
% of Compound
82.0
15.0
1.4
1.0
0.6
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
Internal Leadframe Plating
% of Plating
100
Ag
Item
Sn
Pb
Subtotal
External Leadframe Plating
% of Plating
85
15
Weight (g)
6.67 E-03
1.22 E-03
1.14 E-04
8.12 E-05
4.06 E-05
8.12 E-03
PPM
379004
69245
6463
4616
2308
461637
Weight (g)
7.53 E-03
1.76 E-04
9.75 E-06
1.87 E-06
7.72 E-03
PPM
428323
10004
554
106
438987
Weight (g)
7.80 E-05
PPM
4434
Weight (g)
3.66 E-04
6.45 E-05
4.30 E-04
PPM
20779
3667
24446
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.70 E-04
PPM
9664
Si
Chip
% of Chip
100
Weight (g)
1.00 E-03
PPM
56852
Weight (g)
5.60 E-05
1.05 E-05
3.50 E-06
7.00 E-05
PPM
3184
597
199
3980
Item
Ag Filler
Resin
Aromatic Amine
Subtotal
Die Attach
% of Die Attach
80
15
5
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. ICP-OES.
Not Detected
Draft IEC 62321. UV-VIS.
Not Detected
Draft IEC 62321. GC-MSD
Not Detected
Draft IEC 62321. GC-MSD
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Die Attach Paste
Package Totals
PPM
Weight (g)
1000000
1.76 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Draft IEC 62321.
Draft IEC 62321.
Draft IEC 62321.
Draft IEC 62321.
Draft IEC 62321.
Draft IEC 62321.
Method
ICP-OES.
ICP-OES.
ICP-OES.
UV-VIS.
GC-MSD
GC-MSD
CRS-RJ-F
Materials Declaration
Package
Body Size
LeadCount
Option
SOT23-COL
6
NiPdAu
Substance
Silica
Epoxy resin
Phenol Resin
Metal Hyroxide
Carbon Black
Subtotal
Molding Compound
% of Compound
80.8
9.0
5.0
5.0
0.2
100.0
Weight (g)
6.56 E-03
7.31 E-04
4.06 E-04
4.06 E-04
1.62 E-05
8.12 E-03
PPM
382346
42588
23660
23660
946
473201
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Molding Compound
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
Draft IEC 62321. ICP-OES
Draft IEC 62321. ICP-OES
Draft IEC 62321. ICP-OES
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
Substance
Copper
Iron
Zinc
Phosphorus
Subtotal
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
100
Weight (g)
7.51 E-03
1.76 E-04
9.75 E-06
1.87 E-06
7.70 E-03
PPM
437856
10255
568
109
448788
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Die Attach Paste
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
Draft IEC 62321. ICP-OES
Draft IEC 62321. ICP-OES
Draft IEC 62321. ICP-OES
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
Internal/External Leadframe Plating
% of Plating
Weight (g)
8.97 E-05
90.91
7.80 E-06
7.91
1.17 E-06
1.19
9.87 E-05
100.00
PPM
5227
455
68
5750
Substance
Nickel
Palladium
Gold
Subtotal
Gold
Bond Wires
% of Wire
99.99
Weight (g)
1.70 E-04
PPM
9906
Substance
Doped Silicon
Chip
% of Chip
100
Weight (g)
1.00 E-03
PPM
58276
Die Attach
% of Die Attach
31
31
22
8
8
100
Weight (g)
2.17 E-05
2.17 E-05
1.54 E-05
5.60 E-06
5.60 E-06
7.00 E-05
PPM
1265
1265
897
326
326
4079
Substance
Substance
Epoxy Resin
Metal Oxide
Glycol Ethers
Silica
Curing agent & hardener
Subtotal
Package Totals
PPM
Weight (g)
1000000
1.72 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
RJ-10