Materials Declaration Package Body Size LeadCount Option Item SiO2 Resin Sb2O3 Brominated epoxy Carbon Black Subtotal SOT 23 -6 Pb-free Molding Compound % of Compound 82.0 15.0 1.4 1.0 0.6 Weight (g) 6.67 E-03 1.22 E-03 1.14 E-04 8.12 E-05 4.06 E-05 8.12 E-03 PPM 379609 69356 6473 4624 2312 462374 Weight (g) 7.53 E-03 1.76 E-04 9.75 E-06 1.87 E-06 7.72 E-03 PPM 429006 10020 555 107 439688 Internal Leadframe Plating % of Plating 100 Weight (g) 7.80 E-05 PPM 4442 Sn External Leadframe Plating % of Plating 100 Weight (g) 4.02 E-04 PPM 22889 Au Bond Wires % of Wire 99.99 Weight (g) 1.70 E-04 PPM 9679 Si Chip % of Chip 100 Weight (g) 1.00 E-03 PPM 56943 Weight (g) 5.60 E-05 1.05 E-05 3.50 E-06 7.00 E-05 PPM 3189 598 199 3986 Item Cu Fe Zn P Subtotal Ag Item Item Ag Filler Resin Aromatic Amine Subtotal Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Die Attach % of Die Attach 80 15 5 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound PPM Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Die Attach Paste Package Totals PPM Weight (g) 1000000 1.76 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD GC-MSD Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD GC-MSD CRS-RJ-D Materials Declaration Package Body Size LeadCount Option Substance Silica Epoxy Resin Phenol Resin Antimony Trioxide Additive Brominated epoxy Carbon Black Subtotal Substance Copper Iron Zinc Phosphorus Subtotal Substance Tin Substance Lead Indium Subtotal Substance Lead Tin Subtotal SOT 23 - FCOL -6 Sn with exemption, RoHS-compliant Molding Compound % of Compound 81.0 10.0 5.0 1.4 1.1 1.0 0.5 100.0 Weight (g) 6.56 E-03 8.10 E-04 4.05 E-04 1.13 E-04 8.91 E-05 8.10 E-05 4.05 E-05 8.10 E-03 PPM 338233 41757 20879 5846 4593 4176 2088 417571 Weight (g) 6.03 E-03 1.45 E-04 7.43 E-06 1.86 E-06 6.19 E-03 PPM 311004 7496 383 96 318978 Weight (g) 2.34 E-04 PPM 12062 Solder Paste % of Solder Paste 75.0 25.0 100.0 Weight (g) 3.83 E-04 1.28 E-04 5.10 E-04 PPM 19719 6573 26292 Wafer Bumps % of Wafer Bumps 90.0 10.0 100.0 Weight (g) 3.02 E-04 3.35 E-05 3.35 E-04 PPM 15561 1729 17291 Weight (g) 1.28 E-06 4.96 E-07 1.83 E-07 3.73 E-08 2.00 E-06 1.82 E-06 PPM Weight (g) 4.03 E-03 PPM 207703 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 100.00 External Leadframe Plating % of Plating 100.0 Copper Nickel Vanadium Aluminum Subtotal UBM % of UBM 64.16 24.81 9.17 1.87 100.00 Substance Doped Silicon Chip % of Chip 100.0 Substance Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM None Detected None Detected None Detected None Detected None Detected None Detected Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. 66 26 9 2 103 Package Totals Weight (g) PPM 1000000 1.94 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary RJ-15 Materials Declaration Package Body Size LeadCount Option Item SiO2 Resin Sb2O3 Brominated epoxy Carbon Black Subtotal Item Cu Fe Zn P Subtotal SOT 23 -6 SnPb Molding Compound % of Compound 82.0 15.0 1.4 1.0 0.6 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Internal Leadframe Plating % of Plating 100 Ag Item Sn Pb Subtotal External Leadframe Plating % of Plating 85 15 Weight (g) 6.67 E-03 1.22 E-03 1.14 E-04 8.12 E-05 4.06 E-05 8.12 E-03 PPM 379004 69245 6463 4616 2308 461637 Weight (g) 7.53 E-03 1.76 E-04 9.75 E-06 1.87 E-06 7.72 E-03 PPM 428323 10004 554 106 438987 Weight (g) 7.80 E-05 PPM 4434 Weight (g) 3.66 E-04 6.45 E-05 4.30 E-04 PPM 20779 3667 24446 Au Bond Wires % of Wire 99.99 Weight (g) 1.70 E-04 PPM 9664 Si Chip % of Chip 100 Weight (g) 1.00 E-03 PPM 56852 Weight (g) 5.60 E-05 1.05 E-05 3.50 E-06 7.00 E-05 PPM 3184 597 199 3980 Item Ag Filler Resin Aromatic Amine Subtotal Die Attach % of Die Attach 80 15 5 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MSD Not Detected Draft IEC 62321. GC-MSD Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Die Attach Paste Package Totals PPM Weight (g) 1000000 1.76 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD GC-MSD CRS-RJ-F Materials Declaration Package Body Size LeadCount Option SOT23-COL 6 NiPdAu Substance Silica Epoxy resin Phenol Resin Metal Hyroxide Carbon Black Subtotal Molding Compound % of Compound 80.8 9.0 5.0 5.0 0.2 100.0 Weight (g) 6.56 E-03 7.31 E-04 4.06 E-04 4.06 E-04 1.62 E-05 8.12 E-03 PPM 382346 42588 23660 23660 946 473201 Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC 62321. ICP-OES Draft IEC 62321. ICP-OES Draft IEC 62321. ICP-OES Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. Substance Copper Iron Zinc Phosphorus Subtotal Leadframe % of Leadframe 97.5 2.35 0.12 0.03 100 Weight (g) 7.51 E-03 1.76 E-04 9.75 E-06 1.87 E-06 7.70 E-03 PPM 437856 10255 568 109 448788 Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach Paste PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC 62321. ICP-OES Draft IEC 62321. ICP-OES Draft IEC 62321. ICP-OES Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. Internal/External Leadframe Plating % of Plating Weight (g) 8.97 E-05 90.91 7.80 E-06 7.91 1.17 E-06 1.19 9.87 E-05 100.00 PPM 5227 455 68 5750 Substance Nickel Palladium Gold Subtotal Gold Bond Wires % of Wire 99.99 Weight (g) 1.70 E-04 PPM 9906 Substance Doped Silicon Chip % of Chip 100 Weight (g) 1.00 E-03 PPM 58276 Die Attach % of Die Attach 31 31 22 8 8 100 Weight (g) 2.17 E-05 2.17 E-05 1.54 E-05 5.60 E-06 5.60 E-06 7.00 E-05 PPM 1265 1265 897 326 326 4079 Substance Substance Epoxy Resin Metal Oxide Glycol Ethers Silica Curing agent & hardener Subtotal Package Totals PPM Weight (g) 1000000 1.72 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary RJ-10