Materials Declaration Package Body Size LeadCount Option Substance Silica Epoxy resin Phenol Resin Metal Hyroxide Carbon Black Subtotal Substance Copper Nickel Silicon Magnesium Subtotal Substance Nickel Palladium Gold Subtotal LFCSP 2 X 2 X 0.55 mm 10 Halide-free, Pb-free Molding Compound % of Compound 80.80 9.00 5.00 5.00 0.20 100.00 Weight (g) 2.06E-03 2.30E-04 1.28E-04 1.28E-04 5.10E-06 2.55E-03 PPM 219659 24467 13593 13593 544 271855 Leadframe % of Leadframe 96.20 3.00 0.65 0.15 100.00 Weight (g) 5.71 E-03 1.78 E-04 3.86 E-05 8.91 E-06 5.94 E-03 PPM 609198 18998 4116 950 633262 Internal/External Leadframe Plating % of Plating Weight (g) 1.45 E-04 90.91 1.26 E-05 7.91 1.90 E-06 1.19 100.00 1.60 E-04 PPM 15507 1348 202 17058 Bond Wires % of Wire 100.0 Weight (g) 5.00 E-05 PPM Substance Doped Silicon Chip % of Chip 100.0 Weight (g) 5.90 E-04 PPM 62900 Substance Silica Resin Additive Bisphenol A Glycidylether Subtotal Die Attach % of Die Attach 70.0 15.0 10.0 5.0 100.0 Weight (g) 6.30 E-05 1.35 E-05 9.00 E-06 4.50 E-06 9.00 E-05 PPM Substance Gold Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Die Attach 1 PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC 62321. ICP-OES Draft IEC 62321. ICP-OES Draft IEC 62321. ICP-OES Draft IEC 62321. UV-VIS Draft IEC 62321. GC-MSD Draft IEC 62321. GC-MSD Method EPA 3052. ICP-AES EPA 3052. ICP-AES EPA 3052. ICP-AES EPA 3060A & 7196A. UV-VIS. EPA Method 3540C/3541/3550C. GC/MS. EPA Method 3540C/3541/3550C. GC/MS. 5330 6716 1439 959 480 9595 Package Totals PPM Weight (g) 1000000 9.38 E-03 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary amk-cp-m