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Materials Declaration
Package
Body Size
LeadCount
Option
Substance
Silica
Epoxy resin
Phenol Resin
Metal Hyroxide
Carbon Black
Subtotal
Substance
Copper
Nickel
Silicon
Magnesium
Subtotal
Substance
Nickel
Palladium
Gold
Subtotal
LFCSP
2 X 2 X 0.55 mm
10
Halide-free, Pb-free
Molding Compound
% of Compound
80.80
9.00
5.00
5.00
0.20
100.00
Weight (g)
2.06E-03
2.30E-04
1.28E-04
1.28E-04
5.10E-06
2.55E-03
PPM
219659
24467
13593
13593
544
271855
Leadframe
% of Leadframe
96.20
3.00
0.65
0.15
100.00
Weight (g)
5.71 E-03
1.78 E-04
3.86 E-05
8.91 E-06
5.94 E-03
PPM
609198
18998
4116
950
633262
Internal/External Leadframe Plating
% of Plating
Weight (g)
1.45 E-04
90.91
1.26 E-05
7.91
1.90 E-06
1.19
100.00
1.60 E-04
PPM
15507
1348
202
17058
Bond Wires
% of Wire
100.0
Weight (g)
5.00 E-05
PPM
Substance
Doped Silicon
Chip
% of Chip
100.0
Weight (g)
5.90 E-04
PPM
62900
Substance
Silica
Resin
Additive
Bisphenol A Glycidylether
Subtotal
Die Attach
% of Die Attach
70.0
15.0
10.0
5.0
100.0
Weight (g)
6.30 E-05
1.35 E-05
9.00 E-06
4.50 E-06
9.00 E-05
PPM
Substance
Gold
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Molding Compound
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Die Attach 1
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
Draft IEC 62321. ICP-OES
Draft IEC 62321. ICP-OES
Draft IEC 62321. ICP-OES
Draft IEC 62321. UV-VIS
Draft IEC 62321. GC-MSD
Draft IEC 62321. GC-MSD
Method
EPA 3052. ICP-AES
EPA 3052. ICP-AES
EPA 3052. ICP-AES
EPA 3060A & 7196A. UV-VIS.
EPA Method 3540C/3541/3550C. GC/MS.
EPA Method 3540C/3541/3550C. GC/MS.
5330
6716
1439
959
480
9595
Package Totals
PPM
Weight (g)
1000000
9.38 E-03
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
amk-cp-m