&6
3
PCA9411; PCA9411A
:/
3.0 MHz, 500 mA, DC-to-DC boost converter
Rev. 1 — 8 March 2016
Product data sheet
1. General description
The PCA9411 and PCA9411A are highly efficient 3.0 MHz, 500 mA, step-up DC-to-DC
converters. They convert input voltages from 2.5 V to 5.25 V to a fixed output voltage of
5.25 V.
These devices are optimized for battery-powered applications. High efficiency of up to
94 % enables an extended battery life in all portable designs. Step-up operation at a
switching frequency of 3 MHz allows using 1 H inductor or smaller.
2. Features and benefits
Efficiency up to 94 %
3 % output voltage accuracy at nominal and static conditions
3 % output voltage accuracy over full current, voltage and temperature range
VINVO, (Pass-Through Mode Operation)
Load disconnect
Current-mode controller
Soft start function for limiting inrush current with true load disconnect
Overcurrent and over-temperature protection
The PCA9411 totally disconnects input to output when disabled
The PCA9411A connects input to output when disabled
Wafer-Level Chip-Size Package (WLCSP) with 0.4 mm pitch; allows for the use of a
smaller antenna, or for greater signal strength
IOUT 400 mA at VIN = 2.5 V
IOUT 480 mA at VIN = 3.6 V
IOUT 640 mA at VIN = 4.8 V
IOUT 700 mA at VIN = 5.0 V
3. Applications
Smartphones
NFC terminals
PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
4. Ordering information
Table 1.
Ordering information
Type number
Topside Package
mark
Name
Description
Version
PCA9411UK
P11
WLCSP9
wafer-level chip-size package; 9 bumps; body 1.24 1.24
0.525 mm
-
PCA9411AUK
11A
WLCSP9
wafer-level chip-size package; 9 bumps; body 1.24 1.24
0.525 mm
-
4.1 Ordering options
Table 2.
Ordering options
Type number
Orderable part
number
Package
Packing method
Minimum
Temperature
order quantity
PCA9411UK
PCA9411UKZ
WLCSP9
REEL 7" Q1/T1
*SPECIAL MARK
CHIPS DP
3000
Tamb = 40 C to +85 C
PCA9411AUK
PCA9411AUKZ
WLCSP9
REEL 7" Q1/T1
*SPECIAL MARK
CHIPS DP
3000
Tamb = 40 C to +85 C
PCA9411
Product data sheet
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Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
2 of 28
PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
5. Block diagram
BANDGAP
REFERENCE
BIAS
SUPPLY
UNDERVOLTAGE
LOCKOUT
OVERCURRENT
PROTECTION
CONTROL
LOGIC
TEMPERATURE
WATCHDOG
GATE
DRIVER
PULSE
GENERATOR
SOFTSTART
aaa-013240
Fig 1.
Block diagram
6. Pinning information
6.1 Pinning
PCA9411/9411A
PCA9411/9411A
ball A1
index area
1
2
1
2
3
A
VOUT
VOUT
VIN
B
SW
SW
EN
C
PGND
PGND
AGND
3
A
B
C
aaa-016561
aaa-016560
Transparent top view
Fig 2.
Pin configuration WLCSP9 package
PCA9411
Product data sheet
Transparent top view
Fig 3.
Ball mapping for WLCSP9
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Rev. 1 — 8 March 2016
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PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
VOUT
A1, A2
Output voltage. This pin is the output voltage terminal; connect
directly to COUT.
VIN
A3
Input voltage. Connect to Li-Ion battery input power source.
SW
B1, B2
Switching node. Connect to inductor.
EN
B3
Enable. Used to enable/disable the device; HIGH = enabled.
Non-A version: EN low = total disconnect
A version: EN low = forced pass through
PCA9411
Product data sheet
PGND
C1, C2
Power ground. This is the power return for the IC. COUT capacitor
should be returned with the shortest path possible to these pins.
AGND
C3
Analog ground. This is the signal ground reference for the IC. All
voltage levels are measured with respect to this pin; connect to
PGND at a single point. The AGND pin should be flooded over by
the ground plane that is connecting the PGND pins to both the
input caps and the output caps.
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Rev. 1 — 8 March 2016
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PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
7. Functional description
The step-up converter (Figure 4) generates a regulated constant output voltage.
Li(ext)
SW SW
VOUT
VOUT
VIN
VOUT
C2
VIN
C1
Enable
EN
AGND PGND PGND
aaa-013259
Fig 4.
Typical DC-to-DC application
7.1 Enable (EN) pin
EN pin enables the boost converter when HIGH. However the effect of the EN when LOW
has two methods of operation, depending on which device is used.
PCA9411 device: the EN pin when LOW causes the part to go into a total disconnect
mode from input to output.
PCA9411A device: EN pin when LOW forces the part into Pass Through mode where the
output voltage is the same as the input voltage. This device emulates a conventional
boost converter (without the voltage drop of the internal diode).
When the EN pin is pulled HIGH it should be held HIGH for at least 500 s for the device
to properly initialize. This is for getting the forced Pass Through mode set up properly.
Shorter pulses may cause unpredictable behavior.
Table 4.
Operating modes
Mode
Description
Invoked when
LIN
linear start-up
VIN > VOUT
SS
boost soft-start
VIN < VOUT < VOUT(TARGET)
BST
boost operating mode
VOUT = VOUT(TARGET)
PT
pass-through mode
VIN > VOUT(TARGET) or in the advanced
part when EN is pulled LOW
7.1.1 Pass-Through (PT) mode
With both devices, the device automatically transitions from Boost Mode to Pass-Through
Mode if VIN goes above the VOUT target. In Pass-Through Mode, the device provides a
very low impedance path from VIN to VOUT. Entry to the Pass-Through Mode is triggered
PCA9411
Product data sheet
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Rev. 1 — 8 March 2016
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5 of 28
PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
by condition where VIN > VOUT target. Pass-Through Mode exit is triggered when VOUT
going down reaches the target VOUT voltage. During Automatic Pass-Through Mode, the
PMOS overcurrent protection remains enabled.
In the PCA9411A, user can force the device in Forced Pass-Through Mode through the
EN pin. If the EN pin is pulled HIGH, the device starts operating in Boost Mode. Once the
EN pin is pulled LOW, the device is forced into Pass-Through Mode. To disable the
device, the input supply voltage must be removed. The device cannot start-up in Forced
Pass-Through Mode. During start-up, keep the EN pulled HIGH for 500 s, before pulling
it LOW and putting the device into Forced Pass-Through Mode. The EN pin has an
internal pull-down resistor (see Figure 5 for the sequence).
Table 5.
Enable
EN logic level
Description Non-A
Description A
LOW
Power-down isolated output
Forced pass-through
HIGH
Boost mode
Boost mode
VIN
Enable
Boost
Boost
Forced Pass through
VOUT
Disconnect
aaa-019181
Fig 5.
Forced pass-through
7.2 Inrush current limiter (soft start)
The PCA9411 and PCA9411A have an integrated pre-charge circuit that prevents large
inrush currents when input voltage is applied. This inrush is accompanied with a current
limit that shuts down the device, and runs a delay timer then attempts a restart.
Once the output voltage reaches the input voltage the soft start function is enabled to limit
the maximum current in boost time and to reduce an input voltage dip. Therefore the
system has a turn-on procedure which starts up step-by-step and limits the inrush current
via a duty cycle control up to the maximum current capability.
7.3 Thermal protection
The PCA9411 and PCA9411A have an integrated thermal protection. The protection
circuit senses the internal temperature of the chip and switches off the integrated PMOS
power switch transistor when temperature reaches 150 C. After the temperature returns
to a safe value 20 C below the shutdown temperature, the system restarts in the
pre-charge phase.
PCA9411
Product data sheet
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Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
7.4 Overcurrent protection
Overcurrent protection circuit senses the current through the integrated PMOS. If the
diagnostic circuit detects an overcurrent, the system switches off the PMOS and NMOS to
break the current flow, and a 20 ms timeout is started. Once the 20 ms timeout expires,
the part restarts in the pre-charge phase.
PCA9411
Product data sheet
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Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
8. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VIN
voltage on pin IN
Vi
input voltage
on pin EN
VO
output voltage
on pins SW, OUT
Min
Max
Unit
0.5
+6.0
V
0.3
VIN + 0.3 V, up to
+6.0 V
V
0.5
+6.0
V
[1]
Ptot
total power dissipation
Tstg
storage temperature
65
+150
C
Tj
junction temperature
40
+125
C
Tamb
ambient temperature
40
+85
C
VESD
electrostatic discharge voltage
2
+2
kV
human body model
(JESD22-001)
[1]
Internally limited
9. Recommended operating conditions
Table 7.
Operating conditions
Symbol
Parameter
VIN
voltage on pin IN
Vi
input voltage
Conditions
on pin EN
Min
Typ
Max
Unit
2.5
-
5.25
V
0.3
-
VIN
V
C1
external input capacitance
VIN = 4.8 V
[1]
2.0
4.2
-
F
C2
external output capacitance
VO = 5.25 V
[1]
3.0
4.2
10
F
[1]
0.47
1
2.2
H
Li(ext)
[1]
external input inductance
This is the capacitance at 5.25 V bias. Check application section for more details.
PCA9411
Product data sheet
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Rev. 1 — 8 March 2016
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PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
10. Static characteristics
Table 8.
Static characteristics
At recommended input voltages and Tamb = 40 C to +85 C; voltages are referenced to GND (ground = 0 V); unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
2.5
3.6
5.25
V
EN = 0 V
-
3.0
10.0
A
EN = 1.8 V, VIN = 2.5 V
-
36
-
mA
EN = 1.8 V, VIN = 4.8 V
-
11
-
mA
EN = 1.8 V, VIN = 5.25 V
-
3.57
-
mA
5.0925
(3 %)
5.25
5.4075
(+3 %)
V
VIN = 2.5 V
400
-
-
mA
VIN = 3.6 V
480
-
-
mA
VIN = 4.8 V
640
-
-
mA
VIN = 5.0 V
700
-
-
mA
Input voltage and input current
VIN
input voltage
IQ
supply current
Output voltage and output current
VOUT
output voltage
IO 15 mA
IOUT(lim)
output current limit
EN = HIGH[1]
fo(boost)
boost output frequency
2.91
3
3.09
MHz
Vth(r)(UVLO)
rising threshold voltage
on VIN UVLO
1.9
2.1
2.3
V
Vth(f)(UVLOhyst)
falling UVLO hysteresis
70
-
120
mV
100 kHz to 1.5 MHz, VIN < 4.8 V
2
mV
12 MHz to 15 MHz, VIN < 4.8 V
2
mV
660
µV rms
660
µV rms
Vo(noise_p-p_coh) Vo coherent
peak-to-peak noise
Vo(noise_rms)
Vo rms noise (incoherent 100 kHz to 1.5 MHz, VIN < 4.8 V
noise)
12 MHz to 15 MHz, VIN < 4.8 V
Control input and timing
VIH
HIGH-level input voltage pins EN
1.16
-
-
V
VIL
LOW-level input voltage
-
-
0.4
V
tstartup
start-up time
-
500
600
S
pins EN
Over-temperature protection
Tsd
shutdown temperature
-
150
-
C
Tsd(hys)
hysteresis of shutdown
temperature
-
20
-
C
PCA9411
Product data sheet
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Rev. 1 — 8 March 2016
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PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
Table 8.
Static characteristics …continued
At recommended input voltages and Tamb = 40 C to +85 C; voltages are referenced to GND (ground = 0 V); unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
drain-source on-state
resistance
N-channel FET
-
70
-
m
P-channel FET
-
80
-
m
IL
leakage current
VIN = 3.6 V; EN = LOW
0
0.051
10
A
Rpd(en_low)
enable pull down
EN = LOW
450
640
800
k
I(ena-pulldown)
enable pull down current EN = HIGH, VIN 2.5 V
-
100
-
nA
Switches
RDSon
[1]
EN = HIGH is a common condition for the listed voltage and current cases.
DDD
2XWSXWYROWDJH
9
9
9
9
9
Fig 6.
/RDGFXUUHQW$
Output regulation vs Iload and VIN
DDD
33ULSSOH
P9
9
9
9
9
9
Fig 7.
PCA9411
Product data sheet
,ORDG$
Output ripple vs Iload and VIN
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Rev. 1 — 8 March 2016
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PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
DDD
2XWSXWYROWDJH
&
&
&
Fig 8.
/RDGFXUUHQW$
Output regulation vs Iload and temp (VIN = 3.6 V)
DDD
)UHTXHQF\
0+]
9
9
9
9
9
Fig 9.
PCA9411
Product data sheet
/RDGFXUUHQW$
Frequency vs load current and VIN
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11 of 28
PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
DDD
(IILFLHQF\
9
9
9
9
9
/RDGFXUUHQW$
Fig 10. Efficiency vs Iload and VIN
DDD
(IILFLHQF\
&
&
&
/RDGFXUUHQW$
Fig 11. Efficiency vs Iload and temp (VIN = 3.6 V)
PCA9411
Product data sheet
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Rev. 1 — 8 March 2016
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12 of 28
PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
aaa-017048
Fig 12. Startup
aaa-020572
Fig 13. Line step response
PCA9411
Product data sheet
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Rev. 1 — 8 March 2016
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PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
aaa-017047
Fig 14. Pass through
aaa-020573
Fig 15. Load step
PCA9411
Product data sheet
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Rev. 1 — 8 March 2016
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14 of 28
PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
DDD
,287OLP
$
í&
&
&
9,19
Fig 16. Typical load current capability vs VIN and temp
11. Application information
11.1 Overcurrent protection
Conventional Boost convertors have no output current limit protection. Additionally they
have a phantom power path made up of the inductor and output diode connecting the
input directly to the output; this causes an inrush of current when power is applied. The
PCA9411 has extra provisions to prevent the inrush current and output current limit
problems.
To implement these protections this device has a start-up state machine. This machine
includes a two-stage pre-charge of the output circuitry:
• Stage 1, Inrush control: a 1 A current source is turned on providing a path from input
to output while a voltage comparator and a timer1 are active. If the output voltage
doesn't reach VIN - 200 mV within 1 ms, the device goes into the fault state. If the
output voltage reaches 200 mV below the input voltage first the state machine
advances to the boost mode soft start state.
• Stage 2, Boost Soft-Start: Starting from VOUT = VIN, the output will ramp up to VOUT
target. The PMOS current limit will be enabled during this stage.
The current levels are implemented through the synchronous rectifier transistor properties
and drive states.
11.2 Thermal shutdown
A thermal shutdown state shuts out all other states out until the device has cooled to the
(HiTemp Thysteresis) turn back on temperature, and then it enters the fault state.
PCA9411
Product data sheet
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Rev. 1 — 8 March 2016
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PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
11.3 Fault recovery
When a fault occurs, the device has a fault state that disables the output for 20 ms. After
the 20 ms timeout, the device will attempt a restart starting from the inrush state.
11.4 Enable delay
Once the device has been running and gets disabled, it cannot be re-enabled until the
output voltage discharges down to the input voltage. The device has an internal pull-down
to accomplish this, however in the absence of any external load this will take 3 ms. Any
external load will shorten the time it takes to get re-enabled.
11.5 Connection diagram
The DC-to-DC converter requires an external inductor and two decoupling capacitors.
Li(ext)
SW SW
VOUT
VOUT
VIN
VOUT
C2
VIN
C1
Enable
EN
AGND PGND PGND
aaa-013259
Fig 17. Simple DC-to-DC application diagram
11.6 Recommended inductors
In order to ensure proper operation of the step-up DC-to-DC converter an inductor with a
sufficient inductance and sufficient saturation current value needs to be used. Recommended
inductance is 1 H. Using this recommended 0603 inductor puts a 300 mA current limit on the
circuit; this inductor has a 800 mA saturation current. For more output current a larger, higher
saturation current inductor will be required according to Figure 18. The saturation current of the
inductor has to be properly chosen for the input voltage and load current range. The lower the
input voltage the higher the input current for a given load current. Once the saturation current of
the inductor is reached, the ferromagnetic core of the inductor will show a rapid nonlinear
behavior and the output current capability of the circuit will drop significantly.
Table 9.
PCA9411
Product data sheet
Recommended inductors
Inductor Manufacturer
Product
Parameter
Package size
L
ASMPH-0603-1R0M-T
1 H
0603
Abracon
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PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
DDD
3HDNLQGXFWRUFXUUHQW
$
9
9
9
9
9
9
9
/RDGFXUUHQW$
Fig 18. Inductor peak current vs Iload and VIN
11.7 Input capacitor
To eliminate unwanted voltage transients at the input, place an input decoupling capacitor
of at least 2.2 F as close as possible to the input pin. Due to the voltage dependence of
the capacitor, care should be taken that the effective capacitance of 2 F is available at
input voltages up to 5.25 V. To ensure best performance, it is recommended to use a
capacitor with a low Equivalent Series Resistance (ESR). When using a capacitor with
X5R or X7R dielectric keep in mind that the capacitance drops significantly with voltage,
thus a 22 F cap will actually only have 4.2 F at 5 V as shown in Table 10.
Table 10.
PCA9411
Product data sheet
Recommended input capacitors
Manufacturer
Product
Parameter
Package size
Samsung
CL05A106MQ5NUNC
10 f 6.3 V,
2.5 F at 5 V
0402
TDK
C1608X5R0J226M080AC
22 f at 6.3 V,
4.2 F at 5 V
0603
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PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
11.8 Output capacitor
Because of the narrow voltage-dependent capacitance spread, high temperature stability
and low ESR at high frequencies, it is recommended to use the dielectric X7R or X5R.
The rated capacitance of the output capacitor will be much greater than the actual
capacitance at the 5.25 V output voltage. The device requires at least 3 F of output
capacitance at its rated output voltage for suppression of ringing, overshoot, as well as for
loop stability. We recommend a 22 F 6.3 V capacitor that is actually a 3.75 F capacitor
when biased at 5.25 V.
Table 11.
Recommended output capacitors
Cap
Manufacturer
Product
C2
TDK
C1608X5R0J226M080AC 22 F 6.3 V,
3.75 F at 5.25 V
Parameter
Package size
0603
When the space on the application board allows, it is recommended to use two capacitors
instead of a single large value. The reason is that the equivalent series inductance
reduces to half when using two capacitors with the same value and this helps the
capacitors to work more efficiently against high frequency noise where it can be reduced
by a factor of 2. The minimum capacitance needed can either be obtained with a single
22 F capacitor or two 10 F capacitors when the space allows and lower noise is
targeted; keep in mind that the bulk capacitance at the output voltage needs to be greater
than 3.0 F for control loop stability, and two large capacitors will have superior
performance when compared with two smaller capacitors. The boost factor, output
current, switching frequency and the desired peak to peak ripple limit define the minimum
capacitance needed.
The duty cycle (D) needed with 90 % efficiency at a worst case of 2.5 V VIN.
Eff V IN
D = 1 – --------------------V OUT
(1)
For the minimum input voltage 2.5 V and 5.25 V output voltage D = 0.57
Using the simplified correlation between the current (IOUT(max)), ripple (Vripple), duty cycle
(D) and switching frequency (fsw) the minimum Cout capacitance can be calculated as
follows:
D
C OUT min = I OUT max ----------------------------f sw V ripple
(2)
With a sample set of values: Iout = 300 mA, D = 0.57, fsw = 3 MHz, Vripple = 20 mV
COUT(min) = 2.87 F (This is not the nominal value at 0 V bias, it is the derated value at
5.25 V bias).
This value presumes that the ESR and ESL of the capacitor is negligible and the path
output-capacitor-ground is as short as possible. Compensating for the listed factors, the
minimum output capacitance is specified at 3.0 f at 5.25 V. How much the capacitance
degrades at high bias voltage is supplier dependent and especially when 0402 size
capacitors are chosen the voltage dependence should be taken into consideration.
PCA9411
Product data sheet
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PCA9411/9411A
NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
11.9 Layout of the PCB
The most critical layout constraint of this circuit is that the output Cap C2 be placed as
close to the IC as possible. Use short wide traces to connect this capacitor to the IC. See
below for an example of the layout detailing the IC and the output capacitor. The
connection from switch pin to the inductor should have minimum capacitance to GND.
aaa-016344
Fig 19. Layout of PCB
PCA9411
Product data sheet
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PCA9411/9411A
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3.0 MHz, 500 mA, DC-to-DC boost converter
12. Package outline
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Fig 20. Package outline WLCSP9
PCA9411
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3.0 MHz, 500 mA, DC-to-DC boost converter
BD: 260 µm ± 30 µm
Solder ball: SAC105N
BH: 200 µm ± 30 µm
UBM: 240 µm ± 4 µm
PI opening: 160 µm
UBM: 1K Ti: 1K ± 0.2K
2 K Cu: 2K ± 0.2K
8.3 µm Cu:
All: 8.6 µm ± 1.7 µm
PI: 10 µm
Passivation opening: 190 µm
Al pad: 220 µm
aaa-019496
Fig 21. WLCSP9 Under Ball Metal (UBM) structure
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13. Soldering of WLCSP packages
13.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
13.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
13.3 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 22) than a SnPb process, thus
reducing the process window
• Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 12.
Table 12.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2 000
> 2 000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 22.
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3.0 MHz, 500 mA, DC-to-DC boost converter
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 22. Temperature profiles for large and small components
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
13.3.1 Stand off
The stand off between the substrate and the chip is determined by:
• The amount of printed solder on the substrate
• The size of the solder land on the substrate
• The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
13.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
13.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
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Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
13.3.4 Cleaning
Cleaning can be done after reflow soldering.
14. References
PCA9411
Product data sheet
[1]
IEC60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[2]
IEC61340-3-1 — Method for simulation of electrostatic effects - Human body model
(HBM) electrostatic discharge test waveforms
[3]
JESD22-A115C — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model
(MM)
[4]
NX2-00001 — NXP Semiconductors Quality and Reliability Specification
[5]
AN10365 — NXP Semiconductors application note “Surface mount reflow soldering
description”
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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3.0 MHz, 500 mA, DC-to-DC boost converter
15. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCA9411 v.1
20160308
Product data sheet
-
-
PCA9411
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3.0 MHz, 500 mA, DC-to-DC boost converter
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PCA9411
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
26 of 28
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NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCA9411
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 8 March 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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NXP Semiconductors
3.0 MHz, 500 mA, DC-to-DC boost converter
18. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.1.1
7.2
7.3
7.4
8
9
10
11
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
12
13
13.1
13.2
13.3
13.3.1
13.3.2
13.3.3
13.3.4
14
15
16
16.1
16.2
16.3
16.4
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Enable (EN) pin . . . . . . . . . . . . . . . . . . . . . . . . 5
Pass-Through (PT) mode . . . . . . . . . . . . . . . . . 5
Inrush current limiter (soft start) . . . . . . . . . . . . 6
Thermal protection . . . . . . . . . . . . . . . . . . . . . . 6
Overcurrent protection . . . . . . . . . . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Recommended operating conditions. . . . . . . . 8
Static characteristics. . . . . . . . . . . . . . . . . . . . . 9
Application information. . . . . . . . . . . . . . . . . . 15
Overcurrent protection . . . . . . . . . . . . . . . . . . 15
Thermal shutdown . . . . . . . . . . . . . . . . . . . . . 15
Fault recovery . . . . . . . . . . . . . . . . . . . . . . . . . 16
Enable delay . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Connection diagram . . . . . . . . . . . . . . . . . . . . 16
Recommended inductors . . . . . . . . . . . . . . . . 16
Input capacitor . . . . . . . . . . . . . . . . . . . . . . . . 17
Output capacitor . . . . . . . . . . . . . . . . . . . . . . . 18
Layout of the PCB . . . . . . . . . . . . . . . . . . . . . 19
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
Soldering of WLCSP packages. . . . . . . . . . . . 22
Introduction to soldering WLCSP packages . . 22
Board mounting . . . . . . . . . . . . . . . . . . . . . . . 22
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Quality of solder joint . . . . . . . . . . . . . . . . . . . 23
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25
Legal information. . . . . . . . . . . . . . . . . . . . . . . 26
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Contact information. . . . . . . . . . . . . . . . . . . . . 27
18
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 March 2016
Document identifier: PCA9411