Freescale Semiconductor Application Note AN1984 Rev 3, 11/2006 Handling Freescale Pressure Sensors by: William McDonald INTRODUCTION Smaller package outlines and higher board densities require the need for automated placement of components. These components are supplied in embossed carrier tape on plastic reels to meet the increased demand and facilitate ease of handling. This application note is intended to provide general information and understanding for handling Freescale’s surface mount pressure sensors. Equipment details are not provided in this document and it is recommended that end users contact suppliers of equipment for specific applications. METHODS OF HANDLING Components can be picked from the carrier tape using either the vacuum assist or the mechanical type pick up heads. A vacuum assist nozzle type is most common due to its lower cost of maintenance and ease of operation. The recommended vacuum nozzle configuration should be designed to make contact with the device directly on the metal Figure 1. MPXH Series Multiple Port Vacuum Nozzles cover and avoid vacuum port location directly over the vent hole in the metal cover of the device. To provide a more secure hold on the device, contact with the plastic ridge around the perimeter of the metal cover should be avoided to prevent loss of vacuum pressure. Multiple vacuum ports within the nozzle may be required to effectively handle the device and prevent shifting during movement to placement position. Figure 1 shows two styles of multiple port vacuum nozzles for the MPXH series device as an example. Figure 2 represents the nozzle location on the device. Vacuum pressure required to adequately support the component should be approximately 25 in Hg (85kPa). This level is typical of in-house vacuum supply. Pick up nozzles are available in various sizes and configurations to suit a variety of component geometries. To select the nozzle best suited for the specific application, it is recommended that the customer consult their pick and place equipment supplier to determine the correct nozzle. In some cases it may be necessary to fabricate a special nozzle depending on the equipment and speed of operation. Figure 2. Nozzle Location AVAILABLE PACKAGES Freescale offers several small outline surface mount device families. These are MPXA, MPXH, MPXM, and MPXY series of devices. These devices are also available in axial ported versions to allow pressure to be interfaced to a device via a hose connection. © Freescale Semiconductor, Inc., 2006. All rights reserved. Figure 3. SSOP Axial Style Port Pick up nozzles for these packages should be configured to apply vacuum only to the flat surface of a port base. An access clearance in the nozzle for a port shank is necessary to properly handle these device configurations. See Figure 3. SOP MPAK SSOP SOIC16 Figure 2. Available Packages Table 1. Tape and Reel Information Case Carrier Tape 423A 1317 1317A 1320 1320A 482 482A 1369 Chip Pak SSOP SSOP Ported M-Pak M-Pak Ported SOP SOP Ported SOP Side Port Tape Width W 24.0+/-0.3 24.0+/-0.3 24.0+/-0.3 24.0+/-0.3 24.0+/-0.3 32+/-0.3 32+/-0.3 32+/-0.3 Pocket Width Ao 8.5+/-0.2 7.7+/-0.1 8.8+/-0.1 6.8+/-0.1 7.2+/-0.1 11.3+/-0.1 12.0+/-0.2 12.6+/-0.2 Length Bo 14.2+/-0.2 10.7+/-0.1 11.8+/-0.1 12.6+/-0.1 13.2+/-0.1 18.9+/-0.1 18.8+/-0.2 18.8+/-0.2 Depth Ko 4.7+/-0.1 5.0+/-0.1 10.8+/-0.1 4.6+/-0.1 10.5+/-0.1 6.4+/-0.1 13.8+/-0.1 9.2+/-0.2 Sprocket Hole Pitch Po 4.0 +/-0.1 4.0+/-0.1 4.0+/-0.1 4.0+/-0.1 4.0+/-0.1 4.0+/-0.1 4.0+/-0.1 4.0+/-0.1 Sprocket Hole Diagram Do 1.55+/-0.05 1.55+/-0.05 1.55+/-0.05 1.55+/-0.05 1.55+/-0.05 1.5+/-0.05 1.5+/-0.1 1.5+/-0.1 Edge to Hole E1 1.75+/-0.1 1.75+/-0.1 1.75+/-0.1 1.75+/-0.1 1.75+/-0.1 1.75+/-0.1 1.75+/-0.1 1.75+/-0.1 Hole to Edge E2 22.2 min 22.2 min 22.2 min 22.2 min 22.2 min N/A N/A N/A Distance between Holes So N/A N/A N/A N/A N/A 28.4+/-0.1 28.4+/-0.1 28.4+/-0.1 Pocket Pitch P1 12.0+/-0.1 12.0+/-0.1 16.0+/-0.1 12.0+/-0.1 16.0+/-0.1 16.0+/-0.1 20.0+/-0.1 24.0+/-.01 Pocket Position P2 2.0+/-0.1 2.0+/-0.1 2.0+/-0.1 2.0+/-0.1 2.0+/-0.1 2.0+/-0.1 2.0+/-0.1 2.0+/-0.1 F 11.5+/-0.1 11.5+/-0.1 11.5+/-0.1 11.5+/-0.1 11.5+/-0.1 14.2+/-0.1 14.2+/-0.1 14.2+/-0.1 Tape Thickness T 0.40+/-0.05 0.40+/-0.05 0.40+/-0.05 0.40+/-0.05 0.40+/-0.05 0.30+/-0.05 0.35+/-0.05 0.40+/-0.05 Distance Pocket to Edge S1 0.6 min. 0.6 min 0.6 min 0.6 min 0.6 min N/A N/A N/A Pocket Hole Diagram D1 N/A 1.5+/-0.1 1.5+/-0.1 1.5+/-0.1 1.5+/-0.1 2.0+/-0.1 2.0+/-0.1 2.0+/-0.1 Thickness T1 0.052 +/-0.01 0.052 +/-0.01 0.052 +/-0.01 0.052 +/-0.01 0.052 +/-0.01 0.052 +/-0.01 0.052 +/-0.01 0.052 +/-0.01 Width W4 21.1+/-0.1 21.1+/-0.1 21.1+/-0.1 21.1+/-0.1 21.1+/-0.1 21.1+/-0.1 25.5+/-0.1 25.5+/-0.1 Width at Hub W1 23.7 - 25.2 23.7 - 25.2 23.7 - 25.2 23.7 - 25.2 23.7 - 25.2 23.7 - 25.2 31.7 - 33.2 31.7 - 33.2 Width at outer flange W3 23.7 - 28.0 23.7 - 28.0 23.7 - 28.0 23.7 - 28.0 23.7 - 28.0 23.7 - 28.0 31.7 - 36.0 31.7 - 36.0 Cover Tape Reel Overall Width W2 30.4 max. 30.4 max. 30.4 max. 30.4 max. 30.4 max. 30.4 max. 38.4 max. 38.4 max Hub Diagram N 100+/-2.50 100+/-2.50 100+/-2.50 100+/-2.50 100+/-2.50 100+/-2.50 178+/-2.50 178+/-2.50 Arbor Hole Diagram C 13.0+ 0.5/-0.2 13.0+ 0.5/-0.2 13.0+ 0.5/-0.2 13.0 +0.5/-0.2 13.0 +0.5/-0.2 13.0 +0.5/-0.2 13.0 +0.5/-0.2 13.0 +0.5/-0.2 Slot of Arbor Hole B 1.50/2.50 1.50/2.50 1.50/2.50 1.50/2.50 1.50/2.50 1.50/2.50 1.50/2.50 1.50/2.50 A 330+/-0.76 330+/-0.76 330+/-0.76 330+/-0.76 330+/-0.76 330+/-0.76 330+/-0.76 330+/-0.76 MPQ 1000 1000 300 1000 400 600 100 200 Reel Diagram DEVICE QTY/REEL AN1984 2 Sensors Freescale Semiconductor Cover Tape Carrier Tape D0 T P2 D1 P0 B E1 F E2 B0 W4 A0 S1 P1 T1 W B K0 A0 m 0.2 0+/- B0 K1 Hole Location View A-A View B-B Figure 3. Carrier Tape Plastic Reel W3 W2 A N D* C B* W1 Front View Side View Reel Sealing Tape Pocket Carrier Tape Bar Code Label Figure 4. Reel AN1984 Sensors Freescale Semiconductor 3 Pin 1 Pin 1 Corner Chamfer User Direction of Feed Figure 5. Orientation of Small Outline Package Sensor Device AN1984 4 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B A S S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 SOP PACKAGE CASE 482-01 CASE 482-01 ISSUE OO ISSUE DATE 01/27/98 -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER SOP PACKAGE CASE 482A-01 CASE 482A-01 ISSUE A ISSUE A DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE DATE 05/13/98 AN1984 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS PAGE 1 OF 2 MPAK PACKAGE CASE 1320-02 ISSUE B AN1984 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 2 MPAK PACKAGE CASE 1320-02 ISSUE B AN1984 Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS PAGE 1 OF 2 MPAK PACKAGE CASE 1320A-02 ISSUE A AN1984 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 2 MPAK PACKAGE CASE 1320A-02 ISSUE A AN1984 Sensors Freescale Semiconductor 9 PACKAGE DIMENSIONS PAGE 1 OF 2 SSOP PACKAGE CASE 1317A-03 ISSUE C AN1984 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 2 SSOP PACKAGE CASE 1317A-03 ISSUE C AN1984 Sensors Freescale Semiconductor 11 PACKAGE DIMENSIONS PAGE 1 OF 3 SSOP PACKAGE CASE 1317-04 ISSUE F AN1984 12 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 3 SSOP PACKAGE CASE 1317-04 ISSUE F AN1984 Sensors Freescale Semiconductor 13 PACKAGE DIMENSIONS PAGE 3 OF 3 SSOP PACKAGE CASE 1317-04 ISSUE F AN1984 14 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 3 SSOP PACKAGE CASE 1352-03 ISSUE C AN1984 Sensors Freescale Semiconductor 15 PACKAGE DIMENSIONS PAGE 2 OF 3 SSOP PACKAGE CASE 1352-03 ISSUE C AN1984 16 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 3 OF 3 SSOP PACKAGE CASE 1352-03 ISSUE C AN1984 Sensors Freescale Semiconductor 17 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 [email protected] AN1984 Rev. 3 11/2006 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. 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