MBR7030WTG Switch Mode Power Rectifier The Switch Mode power rectifier, a state−of−the−art device, employs the use of the Schottky Barrier principle with a Platinum barrier metal. http://onsemi.com Features • Dual Diode Construction; Terminals 1 and 3 May Be Connected for • • • • • SCHOTTKY BARRIER RECTIFIER 70 AMPERES, 30 VOLTS Parallel Operation at Full Rating 30 V Blocking Voltage Low Forward Voltage Drop Guardring for Stress Protection and High dv/dt Capability 175°C Operating Junction Temperature These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant* 1 2, 4 3 Mechanical Characteristics • Case: Epoxy, Molded. Epoxy Meets UL 94 V−0 @ 0.125 in • Weight: 4.3 Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead Temperature for Soldering Purposes: • 1 260°C Max. for 10 Seconds ESD Ratings: Machine Model, B (< 400 V) Human Body Model, 3B (> 8000 V) 2 TO−247 CASE 340AL 3 MAXIMUM RATINGS Rating Symbol Max Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 30 V Average Rectified Forward Current Per Leg (Rated VR, TC = 100°C) Per Device IF(AV) Peak Repetitive Forward Current, (Rated VR, Square Wave, 20 kHz, TC = 100°C) IFRM 70 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 500 A Peak Repetitive Reverse Current (2.0 ms, 1.0 kHz) IRRM 2.0 A Storage Temperature Range Tstg −55 to +175 °C Operating Junction Temperature (Note 1) TJ −55 to +175 °C dv/dt 10,000 V/ms Voltage Rate of Change (Rated VR) A 35 70 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2014 July, 2014 − Rev. 4 MARKING DIAGRAM 1 MBR7030WT AYWWG A Y WW G = Assembly Location = Year = Work Week = Pb−Free Package ORDERING INFORMATION Device Package Shipping MBR7030WTG TO−247 (Pb−Free) 30 Units/Rail Publication Order Number: MBR7030WT/D MBR7030WTG THERMAL CHARACTERISTICS (Per Diode) Rating Thermal Resistance, Junction−to−Case Symbol Max Unit RqJC 0.55 °C/W ELECTRICAL CHARACTERISTICS (Per Diode) Instantaneous Forward Voltage (Note 2) @ IF = 35 Amps, TC = 25°C @ IF = 70 Amps, TC = 25°C @ IF = 35 Amps, TC = 100°C VF Instantaneous Reverse Current (Note 2) @ Rated DC Voltage, TC = 25°C @ Rated DC Voltage, TC = 100°C IR V 0.55 0.72 0.52 mA 5.0 250 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle < 2.0% 1000 100 IR, REVERSE CURRENT (mA) IF, INSTANTANEOUS FORWARD CURRENT (A) TYPICAL CHARACTERISTICS TJ = 150°C 10 TJ = 100°C TJ = 25°C 1 0.1 TJ = −55°C 0 0.1 0.2 0.3 0.4 0.5 0.6 100 TJ = 150°C 10 TJ = 100°C 1 0.1 TJ = 25°C 0.01 TJ = −55°C 0.001 0.0001 0.7 0.8 0 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 5 10 15 20 VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current http://onsemi.com 2 25 30 MBR7030WTG PF(AV), AVERAGE POWER DISSIPATION (WATTS) 80 70 DC 60 50 40 SQUARE WAVE 30 20 10 0 100 110 120 140 130 150 160 TC, CASE TEMPERATURE (°C) Figure 3. Current Derating (Case) 45 40 35 SQUARE WAVE 30 25 20 DC 15 10 5 0 0 10 20 8000 7000 6000 5000 4000 3000 2000 1000 0 5 40 50 60 Figure 4. Forward Power Dissipation (Per Leg) 9000 0 30 IF(AV), AVERAGE FORWARD CURRENT (AMPS) 10000 C, CAPACITANCE (pF) IF(AV), AVERAGE FORWARD CURRENT (A) TYPICAL CHARACTERISTICS 10 15 20 25 VR, REVERSE VOLTAGE (VOLTS) Figure 5. Typical Capacitance http://onsemi.com 3 30 MBR7030WTG PACKAGE DIMENSIONS TO−247 CASE 340AL ISSUE A B A NOTE 4 E SEATING PLANE 0.635 M B A P A E2/2 Q E2 NOTE 4 D S NOTE 3 1 2 4 DIM A A1 b b2 b4 c D E E2 e L L1 P Q S 3 L1 NOTE 5 L 2X b2 c b4 3X e A1 b 0.25 NOTE 7 M B A M NOTE 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. SLOT REQUIRED, NOTCH MAY BE ROUNDED. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.13 PER SIDE. THESE DIMENSIONS ARE MEASURED AT THE OUTERMOST EXTREME OF THE PLASTIC BODY. 5. LEAD FINISH IS UNCONTROLLED IN THE REGION DEFINED BY L1. 6. ∅P SHALL HAVE A MAXIMUM DRAFT ANGLE OF 1.5° TO THE TOP OF THE PART WITH A MAXIMUM DIAMETER OF 3.91. 7. DIMENSION A1 TO BE MEASURED IN THE REGION DEFINED BY L1. M MILLIMETERS MIN MAX 4.70 5.30 2.20 2.60 1.00 1.40 1.65 2.35 2.60 3.40 0.40 0.80 20.30 21.40 15.50 16.25 4.32 5.49 5.45 BSC 19.80 20.80 3.50 4.50 3.55 3.65 5.40 6.20 6.15 BSC ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 4 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MBR7030WT/D