MBR7030WT D

MBR7030WTG
Switch Mode
Power Rectifier
The Switch Mode power rectifier, a state−of−the−art device,
employs the use of the Schottky Barrier principle with a Platinum
barrier metal.
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Features
• Dual Diode Construction; Terminals 1 and 3 May Be Connected for
•
•
•
•
•
SCHOTTKY BARRIER
RECTIFIER
70 AMPERES, 30 VOLTS
Parallel Operation at Full Rating
30 V Blocking Voltage
Low Forward Voltage Drop
Guardring for Stress Protection and High dv/dt Capability
175°C Operating Junction Temperature
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
1
2, 4
3
Mechanical Characteristics
• Case: Epoxy, Molded. Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 4.3 Grams (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead Temperature for Soldering Purposes:
•
1
260°C Max. for 10 Seconds
ESD Ratings: Machine Model, B (< 400 V)
Human Body Model, 3B (> 8000 V)
2
TO−247
CASE 340AL
3
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
30
V
Average Rectified Forward Current
Per Leg
(Rated VR, TC = 100°C)
Per Device
IF(AV)
Peak Repetitive Forward Current,
(Rated VR, Square Wave,
20 kHz, TC = 100°C)
IFRM
70
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
IFSM
500
A
Peak Repetitive Reverse Current
(2.0 ms, 1.0 kHz)
IRRM
2.0
A
Storage Temperature Range
Tstg
−55 to +175
°C
Operating Junction Temperature (Note 1)
TJ
−55 to +175
°C
dv/dt
10,000
V/ms
Voltage Rate of Change (Rated VR)
A
35
70
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dPD/dTJ < 1/RqJA.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2014
July, 2014 − Rev. 4
MARKING DIAGRAM
1
MBR7030WT
AYWWG
A
Y
WW
G
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping
MBR7030WTG
TO−247
(Pb−Free)
30 Units/Rail
Publication Order Number:
MBR7030WT/D
MBR7030WTG
THERMAL CHARACTERISTICS (Per Diode)
Rating
Thermal Resistance,
Junction−to−Case
Symbol
Max
Unit
RqJC
0.55
°C/W
ELECTRICAL CHARACTERISTICS (Per Diode)
Instantaneous Forward Voltage (Note 2)
@ IF = 35 Amps, TC = 25°C
@ IF = 70 Amps, TC = 25°C
@ IF = 35 Amps, TC = 100°C
VF
Instantaneous Reverse Current (Note 2)
@ Rated DC Voltage, TC = 25°C
@ Rated DC Voltage, TC = 100°C
IR
V
0.55
0.72
0.52
mA
5.0
250
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle < 2.0%
1000
100
IR, REVERSE CURRENT (mA)
IF, INSTANTANEOUS FORWARD CURRENT (A)
TYPICAL CHARACTERISTICS
TJ = 150°C
10
TJ = 100°C
TJ = 25°C
1
0.1
TJ = −55°C
0
0.1
0.2
0.3
0.4
0.5
0.6
100
TJ = 150°C
10
TJ = 100°C
1
0.1
TJ = 25°C
0.01
TJ = −55°C
0.001
0.0001
0.7
0.8
0
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
5
10
15
20
VR, REVERSE VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Typical Reverse Current
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2
25
30
MBR7030WTG
PF(AV), AVERAGE POWER DISSIPATION (WATTS)
80
70
DC
60
50
40
SQUARE WAVE
30
20
10
0
100
110
120
140
130
150
160
TC, CASE TEMPERATURE (°C)
Figure 3. Current Derating (Case)
45
40
35
SQUARE
WAVE
30
25
20
DC
15
10
5
0
0
10
20
8000
7000
6000
5000
4000
3000
2000
1000
0
5
40
50
60
Figure 4. Forward Power Dissipation (Per Leg)
9000
0
30
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
10000
C, CAPACITANCE (pF)
IF(AV), AVERAGE FORWARD CURRENT (A)
TYPICAL CHARACTERISTICS
10
15
20
25
VR, REVERSE VOLTAGE (VOLTS)
Figure 5. Typical Capacitance
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3
30
MBR7030WTG
PACKAGE DIMENSIONS
TO−247
CASE 340AL
ISSUE A
B
A
NOTE 4
E
SEATING
PLANE
0.635
M
B A
P
A
E2/2
Q
E2
NOTE 4
D
S
NOTE 3
1
2
4
DIM
A
A1
b
b2
b4
c
D
E
E2
e
L
L1
P
Q
S
3
L1
NOTE 5
L
2X
b2
c
b4
3X
e
A1
b
0.25
NOTE 7
M
B A
M
NOTE 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. SLOT REQUIRED, NOTCH MAY BE ROUNDED.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH.
MOLD FLASH SHALL NOT EXCEED 0.13 PER SIDE. THESE
DIMENSIONS ARE MEASURED AT THE OUTERMOST
EXTREME OF THE PLASTIC BODY.
5. LEAD FINISH IS UNCONTROLLED IN THE REGION DEFINED BY
L1.
6. ∅P SHALL HAVE A MAXIMUM DRAFT ANGLE OF 1.5° TO THE
TOP OF THE PART WITH A MAXIMUM DIAMETER OF 3.91.
7. DIMENSION A1 TO BE MEASURED IN THE REGION DEFINED
BY L1.
M
MILLIMETERS
MIN
MAX
4.70
5.30
2.20
2.60
1.00
1.40
1.65
2.35
2.60
3.40
0.40
0.80
20.30
21.40
15.50
16.25
4.32
5.49
5.45 BSC
19.80
20.80
3.50
4.50
3.55
3.65
5.40
6.20
6.15 BSC
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4
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MBR7030WT/D