MBR6045WT D

MBR6045WTG
Switch Mode
Power Rectifier
The Switch Mode power rectifier employs the use of the Schottky
Barrier principle with a Platinum barrier metal.
Features
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• Dual Diode Construction; Terminals 1 and 3 May Be Connected for
•
•
•
•
•
Parallel Operation at Full Rating
45 V Blocking Voltage
Low Forward Voltage Drop
Guard−ring for Stress Protection and High dv/dt Capability (> 10 V/ns)
175°C Operating Junction Temperature
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
SCHOTTKY BARRIER
RECTIFIER
60 AMPERES, 45 VOLTS
1
2, 4
3
Mechanical Characteristics
• Case: Epoxy, Molded
• Weight: 4.3 Grams (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead Temperature for Soldering Purposes:
1
260°C Max. for 10 Seconds
2
TO−247
CASE 340AL
3
MAXIMUM RATINGS
Symbol
Max
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Rating
VRRM
VRWM
VR
45
V
Average Rectified Forward Current
(Rated VR, TC = 125°C)
Per Diode
Per Device
IF(AV)
Peak Repetitive Forward Current,
(Rated VR, Square Wave,
Per Diode
20 kHz, TC = 90°C)
IFRM
60
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
IFSM
500
A
Peak Repetitive Reverse Current
(2.0 ms, 1.0 kHz)
IRRM
2.0
A
Storage Temperature Range
Tstg
−65 to +175
°C
Operating Junction Temperature (Note 1)
TJ
−65 to +175
°C
TJ(pk)
175
°C
Peak Surge Junction Temperature
(Forward Current Applied)
MARKING DIAGRAM
A
30
60
Voltage Rate of Change
dv/dt
10,000
V/ms
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dPD/dTJ < 1/RqJA.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2014
July, 2014 − Rev. 10
1
MBR6045WT
AYWWG
A
Y
WW
G
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping
MBR6045WTG
TO−247
(Pb−Free)
30 Units/Rail
Publication Order Number:
MBR6045WT/D
MBR6045WTG
THERMAL CHARACTERISTICS (Per Diode)
Rating
Thermal Resistance, Junction−to−Case
Symbol
Max
Unit
RqJC
1.0
°C/W
ELECTRICAL CHARACTERISTICS (Per Diode)
Instantaneous Forward Voltage (Note 2)
@ IF = 30 Amps, TC = 25°C
@ IF = 30 Amps, TC = 125°C
@ IF = 60 Amps, TC = 25°C
VF
Instantaneous Reverse Current (Note 2)
@ Rated DC Voltage, TC = 25°C
@ Rated DC Voltage, TC = 100°C
IR
Volts
0.62
0.55
0.75
mA
1.0
50
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle < 2.0%
I R, REVERSE CURRENT (mA)
1000
100
TC = 150°C
10
TC = 100°C
1
0.1
TC = 25°C
0.01
0
10
20
30
40
VR, REVERSE VOLTAGE (VOLTS)
50
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
TYPICAL ELECTRICAL CHARACTERISTICS
100
10
150°C
1
100
Figure 1. Typical Reverse Current
100°C
TC = 25°C
200
300
400
500
600
700
vF, INSTANTANEOUS FORWARD VOLTAGE (mV)
Figure 2. Typical Forward Voltage
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2
800
MBR6045WTG
PACKAGE DIMENSIONS
TO−247
CASE 340AL
ISSUE A
B
A
NOTE 4
E
SEATING
PLANE
0.635
M
B A
P
A
E2/2
Q
E2
NOTE 4
D
S
NOTE 3
1
2
4
DIM
A
A1
b
b2
b4
c
D
E
E2
e
L
L1
P
Q
S
3
L1
NOTE 5
L
2X
b2
c
b4
3X
e
A1
b
0.25
NOTE 7
M
B A
M
NOTE 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. SLOT REQUIRED, NOTCH MAY BE ROUNDED.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH.
MOLD FLASH SHALL NOT EXCEED 0.13 PER SIDE. THESE
DIMENSIONS ARE MEASURED AT THE OUTERMOST
EXTREME OF THE PLASTIC BODY.
5. LEAD FINISH IS UNCONTROLLED IN THE REGION DEFINED BY
L1.
6. ∅P SHALL HAVE A MAXIMUM DRAFT ANGLE OF 1.5° TO THE
TOP OF THE PART WITH A MAXIMUM DIAMETER OF 3.91.
7. DIMENSION A1 TO BE MEASURED IN THE REGION DEFINED
BY L1.
M
MILLIMETERS
MIN
MAX
4.70
5.30
2.20
2.60
1.00
1.40
1.65
2.35
2.60
3.40
0.40
0.80
20.30
21.40
15.50
16.25
4.32
5.49
5.45 BSC
19.80
20.80
3.50
4.50
3.55
3.65
5.40
6.20
6.15 BSC
ON Semiconductor and the
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specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
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3
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Sales Representative
MBR6045WT/D