uClamp3311Z

uClamp3311Z
Ultra Small μClamp®
1-Line, 3.3V ESD Protection
PROTECTION PRODUCTS - Z-PakTM
Description
Features
 High ESD withstand Voltage: +/-14kV (Contact) and
μClamp TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. They
are designed to replace 0201 size multilayer varistors
(MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. They
features large cross-sectional area junctions for conducting high transient currents. These devices offer desirable characteristics for board level protection including
fast response time, low operating and clamping voltage,
and no device degradation.
μClamp®3311Z is constructed using Semtech’s proprietary EPD process technology. The EPD process provides
low standoff voltages with significant reductions in leakage currents and capacitance over silicon-avalanche diode processes. They feature a true operating voltage of
3.3 volts for superior protection when compared to traditional pn junction devices.
μClamp3311Z is in a 2-pin SLP0603P2X3A package.
It measures 0.6 x 0.3 mm with a nominal height of only
0.25mm. Leads are finished with lead-free NiAu. Each
device will protect one line operating at 3.3 volts. It
gives the designer the flexibility to protect single lines in
applications where arrays are not practical. The
combination of small size and high ESD surge capability
makes them ideal for use in portable applications such
as cellular phones, digital cameras, and MP3 players.
®
+/- 16kV (Air) per IEC 61000-4-2
 Able to withstand over 1000 ESD strikes per IEC







61000-4-2 Level 4
1 pack
age
Ultra-small 020
0201
package
Protects one data line
Low reverse current: <10nA typical (VR=5V)
Working voltage: +/- 3.3V
Low capacitance: 6pF typical
Extremely low dynamic resistance: 0.21 Ohms (Typ)
Solid-state silicon-avalanche technology
Mechanical Characteristics






SLP0603P2X3A package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking : Marking code
Packaging : Tape and Reel
Applications





Nominal Dimensions
Cellular Handsets & Accessories
Keypads, Side Keys, Audio Ports
Portable Instrumentation
Digital Lines
Tablet PC
Schematic
0.62
0.22
1
0.32
0.16
0.355 BSC
2
0.25
SLP0603P2X3A (Bottom View)
Nominal Dimensions (mm)
2/6/2015
1
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uClamp3311Z
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
30
Watts
Maximum Peak Pulse Current (tp = 8/20μs)
Ip p
4
Amps
VESD
+/- 16
+/- 14
kV
TJ
-40 to +85
°C
TSTG
-55 to +150
°C
ESD per IEC 61000-4-2 (Air)1
ESD per IEC 61000-4-2 (Contact)1
Operating Temperature
Storage Temperature
Electrical Characteristics (T=25oC)
Parameter
Reverse Stand-Off Voltage
Symbol
Conditions
Minimum
Typical
VRWM
Punch-Through Voltage
V PT
IPT = 50μA
3.65
Snap-Back Voltage
VSB
ISB = 50mA
2.8
Reverse Leakage Current
IR
VRWM = 3.3V
Clamping Voltage
VC
Clamping Voltage
4
Maximum
Units
3.3
V
4.4
V
V
0.001
0.05
μA
IPP = 1A, tp = 8/20μs
5.5
V
VC
IPP = 3A, tp = 8/20μs
6.5
V
Clamping Voltage
VC
IPP = 4A, tp = 8/20μs
7.5
V
Dynamic Resistance2, 3
RD
tp = 100ns
0.21
Cj
I/O pin to Gnd
VR = 0V, f = 1MHz
6
Junction Capacitance
Ohms
9
pF
Notes
1)ESD gun return path connected to ESD ground reference plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
© 2015 Semtech Corporation
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uClamp3311Z
PROTECTION PRODUCTS
Typical Characteristics
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
Non-Repetitive Peak Pulse Power vs. Pulse Time
7
1000
O
6
Clamping Voltage - VC (V)
Peak Pulse Power - P PP (W)
TA = 25 C
100
10
5
4
3
2
1
DR040412-40
1
0.1
1
10
Waveform
Parameters:
tr = 8μs
td = 20μs
0
100
0
1
2
3
Peak Pulse Current - IPP (A)
Pulse Duration - tp (µs)
Normalized Junction Capacitance vs. Reverse Voltage
5
TLP Characteristic
1.6
25
Transmission Line Pulse Test (TLP)
Settings:
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
1.4
20
TLP Current (A)
1.2
CJ(VR) / CJ(VR=0)
4
1
0.8
0.6
15
10
0.4
5
0.2
f = 1 MHz
0
0
0.5
1
1.5
2
2.5
Reverse Voltage - VR (V)
3
0
0
3.5
6
8
10
12
14
16
Typical Insertion Loss (S21)
30KHz to 3GhZ
35
Clamping Voltage (V)
4
TLP Voltage (V)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
5
Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane
30
2
0
25
-3dB
977MHz
20
-5
15
-10
10
5
-15
0
-10
0
10
20
© 2015 Semtech Corporation
30
40
Time (ns)
50
60
70
80
-20
1.00E+04
3
1.00E+05
1.00E+06
1.00E+07
1.00E+08
1.00E+09
1.00E+10
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uClamp3311Z
PROTECTION PRODUCTS
Applications Information
Device Connection Options
Circuit Diagram
The μClamp3311Z is designed to protect one data line
operating up to 3.3 volts. It will present a high
impedance to the protected line up to 3.3 volts. It will
“turn on” when the line voltage exceeds 3.5 volts. The
device is bidirectional and may be used on lines where
the signal polarity is above and below ground. These
devices are not recommended for use on DC power
supply lines due to their snap-back voltage
characteristic.
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufacturing parameters will require some experimentation to
get the desired solder application.
Assembly Parameter
Stencil Aperture
Mounting Pad
Package
0.175
R ecommendation
0.272
Solder Stencil Design
Laser cut, Electro-polished
Aper ture shape
Rectangular with rounded
corners
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
© 2015 Semtech Corporation
0.250
0.298
0.100 mm (0.004")
0.270
Type 4 size sphere or smaller
Recommended Mounting Pattern
Per JEDEC J-STD-020
N on-Solder mask defined
OSP OR N iAu
4
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uClamp3311Z
PROTECTION PRODUCTS
Outline Drawing - SLP0603P2X3A
A
B
D
DIM
A
A1
b
D
E
e
L
N
aaa
bbb
E
TOP VIEW
DIMENSIONS
MILLIMETERS
MIN NOM MAX
0.235 0.25 0.265
0.000 0.02 0.025
0.22 0.24
0.20
0.585 0.62 0.655
0.285 0.32 0.355
0.355 BSC
0.16 0.18
0.14
2
0.08
0.10
A
SEATING
PLANE
aaa C
C
A1
e/2
bxN
C A B
bbb
Pin 1 ID
R 0.060mm
2xL
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP0603P2X3A
DIMENSIONS
(C)
Z
G
DIM
C
G
X
Y
Z
MILLIMETERS
(0.425)
0.175
0.270
0.250
0.675
Y
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2015 Semtech Corporation
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uClamp3311Z
PROTECTION PRODUCTS
Marking Code
H
Notes:
1)Dots represent date code matrix and Pin 1 location
Ordering Information
Ordering Number
Qty per
Reel
Carrier
Tape
Reel
Size
Comments
uClamp3311Z.TN T
10,000
Plastic
7 Inch
N ot Recommended
for N ew Designs
uClamp3311Z.TFT
15,000
Paper
7 Inch
uClamp3311Z.T V T
50,000
Paper
13 Inch
Notes:
1) MicroClamp, uClamp and μClamp are trademarks of
Semtech Corporation
Device Orientation in Tape
H
H
H
Date Code Location
(Towards Sprocket Holes)
© 2015 Semtech Corporation
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uClamp3311Z
PROTECTION PRODUCTS
Carrier Tape Specification
Plastic Tape
Bo
Ko
Ao
Paper Tape
Note: All dimensions in mm unless otherwise specified
© 2015 Semtech Corporation
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uClamp3311Z
PROTECTION PRODUCTS
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2015 Semtech Corporation
8
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