uClamp3311Z Ultra Small μClamp® 1-Line, 3.3V ESD Protection PROTECTION PRODUCTS - Z-PakTM Description Features High ESD withstand Voltage: +/-14kV (Contact) and μClamp TVS diodes are designed to protect sensitive electronics from damage or latch-up due to ESD. They are designed to replace 0201 size multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. They features large cross-sectional area junctions for conducting high transient currents. These devices offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. μClamp®3311Z is constructed using Semtech’s proprietary EPD process technology. The EPD process provides low standoff voltages with significant reductions in leakage currents and capacitance over silicon-avalanche diode processes. They feature a true operating voltage of 3.3 volts for superior protection when compared to traditional pn junction devices. μClamp3311Z is in a 2-pin SLP0603P2X3A package. It measures 0.6 x 0.3 mm with a nominal height of only 0.25mm. Leads are finished with lead-free NiAu. Each device will protect one line operating at 3.3 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. ® +/- 16kV (Air) per IEC 61000-4-2 Able to withstand over 1000 ESD strikes per IEC 61000-4-2 Level 4 1 pack age Ultra-small 020 0201 package Protects one data line Low reverse current: <10nA typical (VR=5V) Working voltage: +/- 3.3V Low capacitance: 6pF typical Extremely low dynamic resistance: 0.21 Ohms (Typ) Solid-state silicon-avalanche technology Mechanical Characteristics SLP0603P2X3A package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 0.6 x 0.3 x 0.25 mm Lead Finish: NiAu Marking : Marking code Packaging : Tape and Reel Applications Nominal Dimensions Cellular Handsets & Accessories Keypads, Side Keys, Audio Ports Portable Instrumentation Digital Lines Tablet PC Schematic 0.62 0.22 1 0.32 0.16 0.355 BSC 2 0.25 SLP0603P2X3A (Bottom View) Nominal Dimensions (mm) 2/6/2015 1 www.semtech.com uClamp3311Z PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 30 Watts Maximum Peak Pulse Current (tp = 8/20μs) Ip p 4 Amps VESD +/- 16 +/- 14 kV TJ -40 to +85 °C TSTG -55 to +150 °C ESD per IEC 61000-4-2 (Air)1 ESD per IEC 61000-4-2 (Contact)1 Operating Temperature Storage Temperature Electrical Characteristics (T=25oC) Parameter Reverse Stand-Off Voltage Symbol Conditions Minimum Typical VRWM Punch-Through Voltage V PT IPT = 50μA 3.65 Snap-Back Voltage VSB ISB = 50mA 2.8 Reverse Leakage Current IR VRWM = 3.3V Clamping Voltage VC Clamping Voltage 4 Maximum Units 3.3 V 4.4 V V 0.001 0.05 μA IPP = 1A, tp = 8/20μs 5.5 V VC IPP = 3A, tp = 8/20μs 6.5 V Clamping Voltage VC IPP = 4A, tp = 8/20μs 7.5 V Dynamic Resistance2, 3 RD tp = 100ns 0.21 Cj I/O pin to Gnd VR = 0V, f = 1MHz 6 Junction Capacitance Ohms 9 pF Notes 1)ESD gun return path connected to ESD ground reference plane. 2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A © 2015 Semtech Corporation 2 www.semtech.com uClamp3311Z PROTECTION PRODUCTS Typical Characteristics Clamping Voltage vs. Peak Pulse Current (tp=8/20us) Non-Repetitive Peak Pulse Power vs. Pulse Time 7 1000 O 6 Clamping Voltage - VC (V) Peak Pulse Power - P PP (W) TA = 25 C 100 10 5 4 3 2 1 DR040412-40 1 0.1 1 10 Waveform Parameters: tr = 8μs td = 20μs 0 100 0 1 2 3 Peak Pulse Current - IPP (A) Pulse Duration - tp (µs) Normalized Junction Capacitance vs. Reverse Voltage 5 TLP Characteristic 1.6 25 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns 1.4 20 TLP Current (A) 1.2 CJ(VR) / CJ(VR=0) 4 1 0.8 0.6 15 10 0.4 5 0.2 f = 1 MHz 0 0 0.5 1 1.5 2 2.5 Reverse Voltage - VR (V) 3 0 0 3.5 6 8 10 12 14 16 Typical Insertion Loss (S21) 30KHz to 3GhZ 35 Clamping Voltage (V) 4 TLP Voltage (V) ESD Clamping (+8kV Contact per IEC 61000-4-2) 5 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane 30 2 0 25 -3dB 977MHz 20 -5 15 -10 10 5 -15 0 -10 0 10 20 © 2015 Semtech Corporation 30 40 Time (ns) 50 60 70 80 -20 1.00E+04 3 1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10 www.semtech.com uClamp3311Z PROTECTION PRODUCTS Applications Information Device Connection Options Circuit Diagram The μClamp3311Z is designed to protect one data line operating up to 3.3 volts. It will present a high impedance to the protected line up to 3.3 volts. It will “turn on” when the line voltage exceeds 3.5 volts. The device is bidirectional and may be used on lines where the signal polarity is above and below ground. These devices are not recommended for use on DC power supply lines due to their snap-back voltage characteristic. Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech’s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. Assembly Parameter Stencil Aperture Mounting Pad Package 0.175 R ecommendation 0.272 Solder Stencil Design Laser cut, Electro-polished Aper ture shape Rectangular with rounded corners Solder Stencil Thickness Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish © 2015 Semtech Corporation 0.250 0.298 0.100 mm (0.004") 0.270 Type 4 size sphere or smaller Recommended Mounting Pattern Per JEDEC J-STD-020 N on-Solder mask defined OSP OR N iAu 4 www.semtech.com uClamp3311Z PROTECTION PRODUCTS Outline Drawing - SLP0603P2X3A A B D DIM A A1 b D E e L N aaa bbb E TOP VIEW DIMENSIONS MILLIMETERS MIN NOM MAX 0.235 0.25 0.265 0.000 0.02 0.025 0.22 0.24 0.20 0.585 0.62 0.655 0.285 0.32 0.355 0.355 BSC 0.16 0.18 0.14 2 0.08 0.10 A SEATING PLANE aaa C C A1 e/2 bxN C A B bbb Pin 1 ID R 0.060mm 2xL e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP0603P2X3A DIMENSIONS (C) Z G DIM C G X Y Z MILLIMETERS (0.425) 0.175 0.270 0.250 0.675 Y X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2015 Semtech Corporation 5 www.semtech.com uClamp3311Z PROTECTION PRODUCTS Marking Code H Notes: 1)Dots represent date code matrix and Pin 1 location Ordering Information Ordering Number Qty per Reel Carrier Tape Reel Size Comments uClamp3311Z.TN T 10,000 Plastic 7 Inch N ot Recommended for N ew Designs uClamp3311Z.TFT 15,000 Paper 7 Inch uClamp3311Z.T V T 50,000 Paper 13 Inch Notes: 1) MicroClamp, uClamp and μClamp are trademarks of Semtech Corporation Device Orientation in Tape H H H Date Code Location (Towards Sprocket Holes) © 2015 Semtech Corporation 6 www.semtech.com uClamp3311Z PROTECTION PRODUCTS Carrier Tape Specification Plastic Tape Bo Ko Ao Paper Tape Note: All dimensions in mm unless otherwise specified © 2015 Semtech Corporation 7 www.semtech.com uClamp3311Z PROTECTION PRODUCTS Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2015 Semtech Corporation 8 www.semtech.com