uClamp0541Z Ultra Small μClamp® 1-Line ESD Protection PROTECTION PRODUCTS - Z-PakTM Description Features μClamp TVS diodes are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace 0201 size multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. This device offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. μClamp®0541Z is in a 2-pin SLP0603P2X3 package. It measures 0.6 x 0.3 mm with a nominal height of only 0.25mm. Leads are finished with lead-free NiAu. Each device will protect one line operating at 5 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. High ESD withstand Voltage: +/-17kV (Contact/Air) ® per IEC 61000-4-2 Able to withstand over 1000 ESD strikes per IEC 61000-4-2 Level 4 1 pack age Ultra-small 020 0201 package Protects one data or power line Low reverse current: <10nA typical (VR=5V) Working voltage: +/- 5V Low capacitance: 6.5pF typical Solid-state silicon-avalanche technology Mechanical Characteristics SLP0603P2X3 package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 0.6 x 0.3 x 0.25 mm Lead Finish: NiAu Marking : Marking code + dot matrix date code Packaging : Tape and Reel Applications Nominal Dimensions Cellular Handsets & Accessories Keypads, Side Keys, Audio Ports Portable Instrumentation Digital Lines Tablet PC Schematic 0.62 0.22 1 0.32 0.16 0.355 BSC 2 0.25 SLP0603P2X3 (Bottom View) 2/6/2015 1 www.semtech.com uClamp0541Z PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 25 Watts Maximum Peak Pulse Current (tp = 8/20μs) Ip p 2 Amps VESD +/- 17 +/- 17 kV TJ -55 to +125 °C TSTG -55 to +150 °C ESD p er IEC 61000-4-2 (Air)1 ESD p er IEC 61000-4-2 (Contact)1 Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Pin 1 to 2 or 2 to 1 Reverse Breakdown Voltage V BR It = 1mA Pin 1 to 2 or 2 to 1 Reverse Leakage Current IR VRWM = 5V, T=25°C Pin 1 to 2 or 2 to 1 Clamp ing Voltage VC Clamp ing Voltage Minimum Maximum Units 5 V 8.2 9.5 V 3 50 nA IPP = 1A, tp = 8/20μs Pin 1 to 2 or 2 to 1 12 V VC IPP = 2A, tp = 8/20μs Pin 1 to 2 or 2 to 1 15 V Dynamic Resistance2, 3 RDYN tlp = 0.2 / 100ns 0.78 Junction Cap acitance Cj VR = 0V, f = 1MHz 6.5 6 Typical Ohms 9 pF Notes 1)ESD gun return path connected to ESD ground reference plane. 2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A © 2015 Semtech Corporation 2 www.semtech.com uClamp0541Z PROTECTION PRODUCTS Typical Characteristics Clamping Voltage vs. Peak Pulse Current (tp=8/20us) Non-Repetitive Peak Pulse Power vs. Pulse Time 15 Clamping Voltage - VC (V) Peak Pulse Power - P PP (kW) 1 0.1 0.01 0.001 10 5 Waveform Parameters: tr = 8μs td = 20μs 0 0.1 1 10 Pulse Duration - tp (µs) 100 0 0.5 Junction Capacitance vs. Reverse Voltage 2 2.5 TLP Characteristic 1.2 25 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns f = 1 MHz 1 20 TLP Current (A) 0.8 CJ(VR) / CJ(VR=0) 1 1.5 Peak Pulse Current - IPP (A) 0.6 0.4 15 10 5 0.2 0 0 0 1 2 3 Reverse Voltage - VR (V) 4 0 5 15 20 25 ESD Clamping (-8kV Contact per IEC 61000-4-2) 40 10 30 0 20 -10 Voltage (V) Voltage (V) 10 TLP Voltage (V) ESD Clamping (+8kV Contact per IEC 61000-4-2) 10 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane 0 5 -20 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane -30 -40 -10 -10 0 10 20 30 40 50 60 70 -10 80 Time (ns) © 2015 Semtech Corporation 3 0 10 20 30 40 Time (ns) 50 60 70 80 www.semtech.com uClamp0541Z PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss S21 CH1 S21 LOG 6 dB / REF 0 dB 1: -2.0678 dB 800 MHz 2: -2.2545 dB 900 MHz 0 dB 12 3: -6.6417 dB 1.8 GHz -6 dB 3 -12 dB 5 4 4: -12.722 dB 2.5 GHz -18 dB -24 dB -30 dB -36 dB -42 dB -48 dB 1 MHz 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz START . 030 MHz Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech’s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. Assembly Parameter Laser cut, Electro-polished Aper ture shape Rectangular with rounded corners Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish © 2015 Semtech Corporation Mounting Pad Package 0.175 0.272 0.250 0.298 R ecommendation Solder Stencil Design Solder Stencil Thickness Stencil Aperture 0.270 Recommended Mounting Pattern 0.100 mm (0.004") Type 4 size sphere or smaller Per JEDEC J-STD-020 N on-Solder mask defined OSP OR N iAu 4 www.semtech.com uClamp0541Z PROTECTION PRODUCTS Outline Drawing - SLP0603P2X3 A D B DIM A A1 b D E e L N aaa bbb E TOP VIEW DIMENSIONS MILLIMETERS MIN NOM MAX 0.235 0.25 0.265 0.00 0.02 0.025 0.22 0.24 0.20 0.585 0.62 0.655 0.285 0.32 0.355 0.355 BSC 0.14 0.16 0.18 2 0.08 0.10 A SEATING PLANE aaa C C A1 bbb bxN C A B 2xL e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP0603P2X3 DIMENSIONS (C) Z G DIM C G X Y Z MILLIMETERS (0.425) 0.175 0.270 0.250 0.675 Y X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2015 Semtech Corporation 5 www.semtech.com uClamp0541Z PROTECTION PRODUCTS Marking Code K Notes: 1) Dots represent matrix date code Ordering Information Ordering Number Qty per Reel Carrier Tape Reel Size Comments uClamp0541Z.TN T 10,000 Plastic 7 Inch N ot Recommended for N ew Designs uClamp0541Z.TFT 15,000 Paper 7 Inch uClamp0541Z.T V T 50,000 Paper 13 Inch Notes: 1) MicroClamp, uClamp and μClamp are trademarks of Semtech Corporation © 2015 Semtech Corporation 6 www.semtech.com uClamp0541Z PROTECTION PRODUCTS Carrier Tape Specification Plastic Tape Bo Ko Ao Paper Tape Note: All dimensions in mm unless otherwise specified K K K K K Device Orientation in Tape Date Code Location (Away from Sprocket Holes) © 2015 Semtech Corporation 7 www.semtech.com uClamp0541Z PROTECTION PRODUCTS Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2015 Semtech Corporation 8 www.semtech.com