LITTELFUSE SP1002

Silicon Protection Arrays
Bi-Directinal ESD Protection Array
RoHS
Pb
GREEN
SP1002 Lead-free/Green Series
Description
Back-to-Back Zener diodes fabricated in a proprietary
silicon avalanche technology protect each I/O pin to provide
a high level of protection for electronic equipment that
may experience destructive electrostatic discharges (ESD).
These robust diodes can safely absorb repetitive ESD
strikes at the maximum level specified in the IEC 610004-2 international standard (Level 4, 8KV contact discharge)
without performance degradation. Their very low loading
capacitance also makes them ideal for protecting highspeed signal pins.
Pinout
Features
SP1002-01
(SC70-3)
1
NC
t -PXDBQBDJUBODFPGQ'
(TYP) I/O to I/O
t -PXMFBLBHFDVSSFOUPG
ç"."9
BU7
t &4%QSPUFDUJPOPGL7
DPOUBDUEJTDIBSHFL7
air discharge, (Level 4,
IEC61000-4-2)
t 4NBMMQBDLBHFTBWFT
board space
t &'5QSPUFDUJPO
IEC61000-4-4, 40A
OT
2
Functional Block Diagram
Applications
SP1002-01
SP1002 Lead-free/Green Series
Specifications are subject to change without notice.
t $PNQVUFS1FSJQIFSBMT
t -$%1%157T
t .PCJMF1IPOFT
t 4FU5PQ#PYFT
t %JHJUBM$BNFSBT
t %7%1MBZFST
t %FTLUPQT/PUFCPPLT
t .11.1
8
Electronics Designers Guide
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©2008 Littelfuse
Silicon Protection Arrays
Bi-Directinal ESD Protection Array
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
2
A
IP
Peak Current (tp
TOP
Operating Temperature
°C
TSTOR
Storage Temperature
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Rating
Units
Storage Temperature Range
°C
°C
°C
Electrical Characteristics (TOP = 25°C)
Parameter
Voltage Drop
Symbol
VD
Standoff Voltage
V
Leakage Current
ILEAK
VC
Clamp Voltage1
ESD Withstand Voltage
VESD
Test Conditions
Min
Typ
IR=10mA
6.0
7.0
Diode Capacitance
1
2
Units
V
IR
6.0
VR
V
μA
IPP=1A, tp
9.2
V
IPP=2A, tp
11.2
V
IEC61000-4-2 (Contact)
±8
kV
IEC61000-4-2 (Air)
Reverse Bias=0V
1
Max
kV
6
CD
Parameter is guaranteed by device characterization
A minimum of 1,000 ESD pulses are applied at 1s intervals
Application Example
MultiMedia
Device
MultiMedia
Device
2 x SP1002-01
Audio Out L
Audio In L
Audio Out R
Audio In R
SCART MultiMedia Application of SP1002-01
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©2008 Littelfuse
9
Electronics Designers Guide
SP1002 Lead-free/Green Series
Specifications are subject to change without notice.
Silicon Protection Arrays
Bi-Directinal ESD Protection Array
Soldering Parameters
Reflow Condition
Pre Heat
1Co'SFFBTTFNCMZ
- Temperature Min (Ts(min))
¡$
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
¡$TFDPOENBY
TS(max) to TL - Ramp-up Rate
¡$TFDPOENBY
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
oTFDPOET
Peak Temperature (TP)
°C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes max.
Do not exceed
260°C
Part Numbering System
Product Characteristics
SP XXXX XX X T G
G= Green
Silicon
Protection Array
T= Tape & Reel
Series
Package
Number of
Channels
Part Marking System
Lead Plating
.BUUF5JO
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
.PMEFE&QPYZ
Flammability
UL94-V-0
/PUFT
1. All dimensions are in millimeters
2. Dimensions include solder plating.
XXX
XXX
%JNFOTJPOTBSFFYDMVTJWFPGNPMEnBTINFUBMCVSS
Product Series
"MMTQFDJmDBUJPOTDPNQMZUP+&%&$41&$.0*TTVF"
Number of Channels
#MPJTGBDJOHVQGPSNPMEBOEGBDJOHEPXOGPSUSJNGPSNJFSFWFSTFUSJNGPSN
1BDLBHFTVSGBDFNBUUFmOJTI7%*
Assembly Site
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
41+5(
4$
#9
SP1002 Lead-free/Green Series
Specifications are subject to change without notice.
10
Electronics Designers Guide
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©2008 Littelfuse
Silicon Protection Arrays
Bi-Directinal ESD Protection Array
Package Dimensions
B
Solder Pad Layout
1.30
[0.0512]
3
e
e
1.90
[0.0748]
D
A2 A
A1
MO-203 Issue A
L
Inches
Min
Max
Min
Max
A
0.80
1.10
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
B
0.006
0.012
c
0.08
0.010
D
0.089
E
e
0.90
[0.0354]
C
3
Millimeters
2
1
SC70-3
Pins
JEDEC
0.65
[0.0256]
0.70
[0.0276]
E HE
Package
0.66 BSC
0.026 BSC
HE
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
Embossed Carrier Tape & Reel Specification - SC70-3
PO
Dimensions
ØD
t
Symbol
F
W
E
P2
AO
A1
BO
B1
ØD1
K1
P
Min
Max
Min
Max
'
P2
0.077
0.081
D
1.40
1.60
D1
1.00
0.049
P0
4.10
0.161
W
40.0 +/- 0.20
7.70
P
4.10
0.161
0.090
0.098
B0
1.00 Ref
B1
K0
©2008 Littelfuse
8.10
A0
A1
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Inches
E
10P0
KO
Millimetres
3FG
0.090
1.90 Ref
1.10
0.098
0.074
K1
0.60 Ref
3FG
t
0.27 max
0.010
11
Electronics Designers Guide
SP1002 Lead-free/Green Series
Specifications are subject to change without notice.