LITTELFUSE SP3004_10

SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
HF
RoHS
Pb
GREEN
SP3004 Lead-Free/Green Series
Description
The SP3004 has ultra low capacitance rail-to rail diodes
with an additional zener diode fabricated in a proprietary
silicon avalanche technology to protect each I/O pin
providing a high level of protection for electronic equipment
that may experience destructive electrostatic discharges
(ESD). These robust diodes can safely absorb repetitive
ESD strikes at the maximum level (Level 4) specified in the
IEC 61000-4-2 international standard without performance
degradation. Their very low loading capacitance also makes
them ideal for protecting high speed signal pins such as
HDMI, DVI, USB2.0, and IEEE 1394.
Pinout
Features
I/O 1
I/O 4
GND
VCC
I/O 2
I/O 3
t-PXDBQBDJUBODFPG
0.85pF (TYP) per I/O
t-PXMFBLBHFDVSSFOUPG
0.5μA (MAX) at 5V
t&4%QSPUFDUJPOPGœL7
contact discharge,
œL7BJSEJTDIBSHF
(IEC61000-4-2)
t4NBMM405QBDLBHF
saves board space
t&'5QSPUFDUJPO
IEC61000-4-4, 40A
(5/50ns)
t-JHIUOJOH1SPUFDUJPO
IEC61000-4-5, 4A
(8/20μs)
Functional Block Diagram
Applications
I/O4
VCC
t$PNQVUFS1FSJQIFSBMT
t/FUXPSL)BSEXBSF1PSUT
t.PCJMF1IPOFT
t5FTU&RVJQNFOU
t1%"T
t.FEJDBM&RVJQNFOU
t%JHJUBM$BNFSBT
I/O1
GND
I/O3
-JGF4VQQPSU/PUF
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
73
Revised: August 19, 2010
SP3004 Lead-Free/Green Series
Lead-Free/Green SP3004
I/O2
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
4
A
Operating Temperature
-40 to 85
°C
Storage Temperature
-50 to 150
°C
IPP
Peak Current (tp=8/20μs)
TOP
TSTOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Rating
Storage Temperature Range
Units
-65 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering 10s)
260
°C
Electrical Characteristics (TOP=25ºC)
Symbol
Test Conditions
Max
Units
Reverse Standoff Voltage
Parameter
VRWM
IR ≤ 1μA
6
V
Reverse Leakage Current
ILEAK
VR=5V
0.5
μA
Clamp Voltage1
ESD Withstand Voltage1
VC
VESD
Diode Capacitance1
C*0(/%
Diode Capacitance1
CI/O-I/O
Min
Typ
IPP=1A, tp=8/20μs, Fwd
10.0
12.0
V
IPP=2A, tp=8/20μs, Fwd
11.8
15.0
V
IEC61000-4-2 (Contact)
œ
kV
IEC61000-4-2 (Air)
œ
kV
Reverse Bias=0V
0.95
1.1
1.25
pF
Reverse Bias=1.65V
0.7
0.85
1
pF
Reverse Bias=0V
0.5
pF
/PUF1 Parameter is guaranteed by design and/or device characterization.
SP3004 Lead-Free/Green Series
74
Revised: August 19, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Insertion Loss (S21) I/O to GND
Capacitance vs. Bias Voltage
1.50
0
1.40
I/O Capacitance (pF)
Insertion Loss [dB]
1.30
-5
-10
-15
1.20
VCC = Float
1.10
1.00
VCC = 3.3V
0.90
0.80
VCC = 5V
0.70
0.60
0.50
-20
1.E+06
1.E+07
1.E+08
1.E+09
0.0
1.E+10
Frequency [Hz]
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
I/O DC Bias (V)
Capacitance vs. Frequency
2E-12
1.8E-12
1.6E-12
Capacitance [F]
1.4E-12
1.2E-12
1E-12
8E-13
6E-13
4E-13
2E-13
0
1.E+07
1.E+08
1.E+09
Lead-Free/Green SP3004
1.E+06
Frequency [Hz]
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
75
Revised: August 19, 2010
SP3004 Lead-Free/Green Series
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Application Example
+5V
D2+
D2+
Gnd
D2-
D26
5
4
SP300x-04
1
2
3
D1+
D1+
Gnd
D1HDMI
or DVI
Connector
D1HDMI
or DVI
Interface
IC
D0+
D0+
Gnd
D0-
D06
5
4
SP300x-04
1
2
3
Clk+
Clk+
Gnd
Clk-
ClkGnd
voltage ASIC HDMI/DVI drivers can also be protected with
the SP300x-04, the +VCC pins on the SP300x-04 can be
substituted with a suitable bypass capacitor or in some
backdrive applications the +VCC of the SP300x-04 can be
nPBUFEPS/$
HDMI or DVI application example for the Littelfuse
SP300x-04 protection devices. A single 4 channel
SP300x-04 device can be used to protect four of the
data lines in a HDMI/DVI interface. Two (2) SP300x-04
devices provide protection for the main data lines. Low
Soldering Parameters
Reflow Condition
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
250+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
SP3004 Lead-Free/Green Series
76
Revised: August 19, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Package Dimensions - SOT563
A
D
6
5
2
4
E
Package
L
c
B
Max
Min
Max
0.50
0.60
0.020
0.024
B
0.17
0.27
0.007
0.011
c
0.08
0.18
0.003
0.007
D
1.50
1.70
0.059
0.067
E
1.10
1.30
0.043
0.051
0.50 BSC
e
Part Numbering System
Silicon
Protection
Array
0.30
0.004
0.012
HE
1.50
1.70
0.059
0.067
Pre-Plated Frame
G= Green
Lead Material
Copper Alloy
T= Tape & Reel
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL94-V-0
X = SOT563, 5000 quantity
-04 = 4 channel
0.10
Lead Plating
Package
Number of Channels
0.020 BSC
L
Product Characteristics
SP3004-04X T G
Series
Inches
Min
A
e
6
Millimeters
Solder Pad Layout
HE
3
SOT 563
Pins
Part Marking System
1. All dimensions are in millimeters
GX 4
3. Dimensions are exclusive of mold flash & metal burr.
GX4
Product Series
Number of Channels
G = SP3004 series
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
Assembly Site
6. Package surface matte finish VDI 11-13.
(varies)
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SP3004-04XTG
SOT563
GX4
5000
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
77
Revised: August 19, 2010
SP3004 Lead-Free/Green Series
Lead-Free/Green SP3004
2. Dimensions include solder plating.
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Embossed Carrier Tape & Reel Specification - SOT563
Millimetres
Min
Min
Max
E
1.65
1.85
0.065
0.073
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
0.45
0.55
0.017
0.021
P0
3.90
4.10
0.154
0.161
10P0
40.0+/- 0.20
W
7.70
8.10
1.574+/-0.008
0.303
0.318
P
3.90
4.10
0.153
0.161
A0
1.73
1.83
0.068
0.072
B0
1.73
1.83
0.068
0.072
K0
0.64
0.74
0.025
0.029
t
SP3004 Lead-Free/Green Series
Inches
Max
78
Revised: August 19, 2010
0.22 max
0.009 max
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.