Step Down Voltage-Regulator with Reset TLE 6365 Datasheet 1 Overview 1.1 Features • • • • • • • • • • Step down converter Supply Over- and Under-Voltage-Lockout Low Output voltage tolerance Output Overvoltage Lockout Output Under-Voltage-Reset with delay Overtemperature Shutdown Wide Ambient operation range -40°C to 125°C Wide Supply voltage operation range Very low current consumption Very small P-DSO-8 SMD package P-DSO-8-3 Type Ordering Code Package TLE 6365 G Q67006-A9515 P-DSO-8-3 Functional description General The TLE 6365 G is a power supply circuit especially designed for automotive applications. The device is based on Infineon’s power technology SPT® which allows bipolar and CMOS control circuitry to be integrated with DMOS power devices on the same monolithic circuitry. The TLE 6365 G contains a buck converter and a power on reset feature to start up the system. The very small P-DSO-8-3 SMD package meets the application requierements. It delivers a precise 5V fully short circuit protected output voltage. Furthermore, the build-in features like under- and overvoltage lockout for supply- and output-voltage and the overtemperature shutdown feature increase the reliability of the TLE 6365 G supply system. Data Sheet Rev. 1.7 1 2003-06-02 TLE 6365 1.2 Pin Definitions and Functions Pin No Symbol Function 1 R Reference Input; an external resistor from this pin to GND determines the reference current and so the oscillator / switching frequency 2 RO Reset Output; open drain output from reset comparator with an internal pull up resistor 3 BUC Buck-Converter Compensation Input; output of internal error amplifier; for loop-compensation and therefore stability connect an external R-C-series combination to GND. 4 GND Ground; analog signal ground 5 VCC Output Voltage Input; feedback input (with integrated resistor devider) and logic supply input; external blocking capacitor necessary 7 BUO Buck Converter Output; source of the integrated power-DMOS 6 BDS Buck Driver Supply Input; voltage to drive the buck converter powerstage 8 VS Supply Voltage Input; buck converter input voltage; external blocking capacitor necessary. Pin Configuration R 1 8 VS RO 2 7 BUO BUC 3 6 BDS GND 4 5 VCC P-DSO-8-3 Figure 1 Pin Configuration (top view) Data Sheet Rev. 1.7 2 2003-06-02 TLE 6365 1.3 Block Diagram VS 8 Biasing and VREF BUC 6 Buck Converter 3 7 TLE 6365 G R 1 Reference Current Generator and Oscillator Undervoltage Reset Generator 4 Figure 2 Vinternal 5 2 BDS BUO VCC RO GND Block Diagram Data Sheet Rev. 1.7 3 2003-06-02 TLE 6365 1.4 Absolute Maximum Ratings Parameter Symbol Limit Values min. max. Unit Remarks Voltages Supply voltage VS – 0.3 46 V Buck output voltage VBUO –1 46 V Buck driver supply voltage VBDS – 0.3 55 V Buck compensation input voltage VBUC – 0.3 6.8 V Logic supply voltage VCC – 0.3 6.8 V Reset output voltage VRO – 0.3 6.8 V Current reference voltage VR – 0.3 6.8 V ESD-Protection (Human Body Model; R=1,5kΩ; C=100pF) all pins to GND VHBM –2 2 kV Tj Tstg – 40 150 °C – – 50 150 °C – Temperatures Junction temperature Storage temperature Note: Stresses above those listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Data Sheet Rev. 1.7 4 2003-06-02 TLE 6365 1.5 Operating Range Parameter Symbol Limit Values min. max. Unit Remarks Supply voltage VS – 0.3 40 V Supply voltage VS 5 35 V VS increasing Supply voltage VS 4.5 36 V VS decreasing Supply voltage VS – 0.3 4.5 V Buck-Converter OFF Buck output voltage VBUO – 0.6 40 V Buck driver supply voltage VBDS – 0.3 50 V Buck compensation input voltage VBUC 0 3.0 V Logic supply voltage VCC 4.0 6.2 V Reset output voltage VRO – 0.3 VCC +0.3 V Current reference voltage VCREF 0 1.23 V Junction temperature Tj – 40 150 °C 180 K/W Thermal Resistance Junction ambient Data Sheet Rev. 1.7 Rthj-a 5 – 2003-06-02 TLE 6365 1.6 Electrical Characteristics 8V< VS < 35V; 4.75V< VCC <5.25V; - 40°C< Tj <150°C; RR=47kΩ; all voltages with respect to ground; positive current defined flowing into the pin; unless otherwise specified No. Parameter Symbol Limit Values min. typ. Unit Test Condition max . 1.6.1 Current Consumption 1.6.1.1 Current consumption; see applicatiopn circuit IS 1.5 4 mA ICC=0mA 1.6.1.2 Current consumption; see applicatiopn circuit IS 5 10 mA ICC=400mA 1.6.2 Under- and Over-Voltage Lockout at VS 1.6.2.1 UV ON voltage; buck conv. ON VSUVON 4.0 4.5 5.0 V VS increasing; 1.6.2.2 UV OFF voltage; buck conv. OFF VSUVOFF 3.5 4.0 4.5 V VS decreasing 1.6.2.3 UV Hysteresis voltage VSUVHY 0.2 0.5 1.0 V HY = ON OFF 1.6.2.4 OV OFF voltage; buck conv. OFF VSOVOFF 34 37 40 V VS increasing 1.6.2.5 OV ON voltage; buck conv. ON VSOVON 30 33 36 V VS decreasing 1.6.2.6 OV Hysteresis voltage VSUVHY 1.5 4 10 V HY = OFF ON 6.0 6.5 V VCC increasing 1.6.3 Over-Voltage Lockout at VCC 1.6.3.1 OV OFF voltage; buck conv. OFF VCCOVOFF 5.5 1.6.3.2 OV ON voltage; buck conv. ON VCCOVON 5.25 5.75 6.25 V VCC decreasing 1.6.3.3 OV Hysteresis voltage VCCOVHY 0.10 0.25 0.50 V HY = OFF ON Data Sheet Rev. 1.7 6 2003-06-02 TLE 6365 1.6 Electrical Characteristics (cont’d) 8V< VS < 35V; 4.75V< VCC <5.25V; - 40°C< Tj <150°C; RR=47kΩ; all voltages with respect to ground; positive current defined flowing into the pin; unless otherwise specified No. Parameter Symbol Limit Values min. typ. Unit Test Condition max . 1.6.4 Buck-Converter; BUO, BDS, BUC and VCC 1.6.4.1 Logic supply voltage VCC 4.9 5.1 1.6.4.2 Efficiency; see. appl. circuit η 85 1.6.4.3 Power-Stage ON resistance RBUON 0.38 1.6.4.4 Power-Stage ON resistance RBUON 1.6.4.5 Buck overcurrent threshold IBUOC 1.6.4.6 Input current on pin VCC ICC 1.6.4.7 Buck Gate supply voltage; VBGS=VS - VBDS VBGS 1.6.5 0.7 5 0.9 7.2 V 1mA < ICC< 400mA; see. appl. circuit % ICC = 400mA; VS = 14V 0.5 Ω Tj=25°C; IBUO= 0.6A 1.0 Ω IBUO= 0.6A 1.2 A 500 µA 10 V VCC=5V Reference Input ; R (Oscillator; Timebase for Buck-Converter and Reset) 1.6.5.1 Voltage on pin R 1.6.5.2 Oscillator frequency 1.6.5.3 Oscillator frequency 1.6.5.4 Cycle time for reset timing Data Sheet Rev. 1.7 VR fOSC fOSC tCYL 105 RR = 100kΩ kHz Tj = 25°C 115 kHz 1.4 85 95 75 1 7 V ms tCYL = 100 / fOSC 2003-06-02 TLE 6365 1.6 Electrical Characteristics (cont’d) 8V< VS < 35V; 4.75V< VCC <5.25V; - 40°C< Tj <150°C; RR=47kΩ; all voltages with respect to ground; positive current defined flowing into the pin; unless otherwise specified No. Parameter Symbol Limit Values min. typ. Unit Test Condition max . 1.6.6 Reset Generator; RO 1.6.6.1 Reset threshold; VCC decreasing VRT 4.50 4.65 4.75 V VRO H to L or L to H transition; VRO remains low down to VCC>1V 1.6.6.2 Reset low voltage VROL - 0.2 0.4 V IROL=1mA; 2.5V < VCC < VRT 1.6.6.3 Reset low voltage VROL - 0.2 0.4 V IROL=0.2mA ; 1V < VCC < VRT 1.6.6.4 Reset high voltage VROH VCC -0.1 VCC V +0.1 IROH = 0mA 1.6.6.5 Reset pull up curent IRO 240 tRR 1.6.6.7 Power-up reset delay time tRD 1.6.6.6 Reset Reaction time 10 40 90 µΑ 0V < VRO< 4V µs VCC < VRT tCYL VCC ≥ 4.8 V 128 1.6.7 Thermal Shutdown (Boost and Buck-Converter OFF) 1.6.7.1 Thermal shutdown junction TjSD temperature 150 1.6.7.2 Thermal switch-on junction TjSO temperature 120 1.6.7.3 Temperature hysteresis Data Sheet Rev. 1.7 ∆T 175 30 8 200 °C 170 °C K 2003-06-02 TLE 6365 2 Circuit Description Below some important sections of the TLE 6365 are described in more detail. Power On Reset In order to avoid any system failure, a sequence of several conditions has to be passed. In case of VCC power down (VCC < VRT for t > tRR) a logic LOW signal is generated at the pin RO to reset an external microcontroller. When the level of VCC reaches the reset threshold VRT, the signal at RO remains LOW for the Power-up reset delay time tRD before switching to HIGH. If VCC drops below the reset threshold VRT for a time extending the reset reaction time tRR, the reset circuit is activated and a power down sequence of period tRD is initiated. The reset reaction time tRR avoids wrong triggering caused by short “glitches” on the VCC-line. VCC < tRR VPG VRT < tRD typ.4,70V typ.4,65V 1V Start Up RO H L Power Figure 3 ON Delay ON Delay invalid tRD Sart-Up ON Delay started stopped invalid invalid tRR Normal t tRD Failed N Failed t Normal Reset Function Data Sheet Rev. 1.7 9 2003-06-02 TLE 6365 Buck Converter A stabilized logic supply voltage (typ. 5 V) for general purpose is realized in the system by a buck converter. An external buck-inductance LBU is PWM switched by a high side DMOS power transistor with the programmed frequency (pin R). The buck converter uses the temperature compensated bandgap reference voltage (typ. 2.8 V) for its regulation loop. This reference voltage is connected to the non-inverting input of the error amplifier and an internal voltage divider supplies the inverting input. Therefore the output voltage VCC is fixed due to the internal resistor ratio to typ. 5.0 V. The output of the error amplifier goes to the inverting input of the PWM comparator as well as to the buck compensation output BUC. When the error amplifier output voltage exceeds the sawtooth voltage the output power MOS-transistor is switched on. So the duration of the output transistor conduction phase depends on the VCC level. A logic signal PWM with variable pulse width is generated. + RVCC3 39R7 VthOV H when OV at VCC L when Overcurrent + VthUV OC COMP 4V GND RProt1 200Ω H when UV at VBOOST 1,2V RVCC4 10R3 BUC Pin 3 - - UV COMP Gate Driver Supply NOR1 VCC Pin 5 Error-Signal Error AMP VCC PWM COMP + VREF Error-Ramp H when Error-Signal < Error-Ramp NOR 1 Output Stage OFF when H R L when Tj >175°C GND >1 & & Oscillator Vmax Ramp Vmin tr tf tr Figure 4 S Schmitt-trigger 1 t Vhigh Vlow & H= OFF INV 1 H= ON Gate Driver Power D-MOS OFF when H NAND 2 GND & Q BDS Pin 6 Q RVCC2 28R R Pin 1 PWM-FF R ERROR-FF + 2,8V RVCC1 22R - RSense 18mΩ GND L when Overcurrent GND VS Pin 8 VthOC 18mV + OV COMP - VCC S & BUO Pin 7 Q Q Clock tr tf tr t Buck Converter Block Diagram External loop compensation is required for converter stability, and is formed by connecting a compensation resistor-capacitor series-network (RBUC, CBUC) between pin BUC and GND. Data Sheet Rev. 1.7 10 2003-06-02 TLE 6365 In the case of overload or short-circuit at VCC (the output current exceeds the buck overcurrent threshold IBUOC) the DMOS output transistor is switched off by the overcurrent comparator immediately. In order to protect the VCC input as well as the external load against catastrophic failures, an overvoltage protection is provided which switches off the output transistor as soon as the voltage at pin VCC exceeds the internal fixed overvoltage threshold VCCOVOFF = typ. 6.0 V. Also a battery undervoltage protection is implemented in the TLE 6365 to avoid wrong operation of the following supplied devices, the typical threshold when decreasing the battery voltage is at VSUVOFF = typ. 4.0 V. Data Sheet Rev. 1.7 11 2003-06-02 TLE 6365 VO Error Voltage and VError Vmax Vmin t OCLK H L PWM H L t I BUO I BUOC t I DBU t VBUO t VS VCC t Overcurrent Threshold Exceeded Load-Current Increasing with Time; Controlled by the Error Amp Controlled by the Overcurrent Comp AED02673 Figure 5 Most Important Waveforms of the Buck Converter Circuit Data Sheet Rev. 1.7 12 2003-06-02 TLE 6365 3 Application circui t D1 CL ZD1 CS 10uF 36V 220nF VS VBatt 8 Biasing and VREF BUC RCO 6 CBOT Buck Converter 3 7 47k CCO TLE 6365 G 470nF R RR 100k Reference Current Generator and Oscillator 1 Figure 6 BUO DBU 5 Vinternal Undervoltage Reset Generator 4 BDS 2 10nF LBU 220uH VCC RO CBU1 CBU2 100uF 220nF VCC Reset output GND Device Type Supplier Remarks D1 BAW78C Infineon 200V; 1A; SOT89 DBU SS14 - Schottky; 100V; 1A LBU B82476-A1224-M Epcos 220µH; 0.8A; 0.53Ω LBU DO3316P-224 Coilcraft 220µH; 0.8A; 0.61Ω Application Circuit Data Sheet Rev. 1.7 13 2003-06-02 TLE 6365 4 Diagrams: Oscillator and Boost/Buck-Converter Performance In the following the behaviour of the Boost/Buck-converter and the oscillator is shown. Efficiency Buck vs. Boost Voltage Oscillator Frequency Deviation vs. Junction Temperature AED03017 95 AED03016 10 kHz η % ∆f OSC 90 Referred to f OSC at Tj = 25 ˚C 5 VCC = 5 V 85 0 I Load = 120 mA 80 75 -10 70 65 -5 80 mA 40 mA 5 15 25 -15 -50 -25 0 V 30 25 50 75 100 ˚C 150 VS Tj Feedback Voltage vs. Junction Temperature Buck Overcurrent Threshold vs. Junction Temperature 5.15 VCC V I OC 5.10 AED03018 1.4 A 1.3 5.05 1.2 IBUO = 400 mA 5.00 1.1 4.95 1 4.90 0.9 4.85 4.80 -50 I BUOC (Buck-Converter) -25 0 25 50 75 100 °C 0.8 -50 -25 0 150 Tj Data Sheet Rev. 1.7 25 50 75 100 ˚C 150 Tj 14 2003-06-02 TLE 6365 Current Consumption vs. Junction Temperature Oscillator Frequency vs. Resistor between R and GNDr AED02940 3 mA AED02982 1000 kHz fOSC I Boost 500 2.5 Boost ON Buck ON I BO boost = 0 mA I CC = 0 mA 2 200 @ Tj = 25 ˚C 100 1.5 50 1 20 0.5 -50 -25 0 10 25 50 75 100 ˚C 150 5 10 20 50 100 200 Tj Efficiency Buck vs. Load η kΩ 1000 RR Buck ON Resistance vs. Junction Temperature AED02942 90 % 1000 RON mΩ 800 85 RT, HT 700 CT 80 600 500 400 75 RBUON @ IBUO = 600 mA 300 200 70 100 65 0 50 150 mA 250 -50 Data Sheet Rev. 1.7 -25 0 25 50 75 100 °C 150 Tj I LOAD 15 2003-06-02 TLE 6365 5 Package Outlines Edition 6.99 Data Sheet Rev. 1.7 16 2003-06-02 TLE 6365 Published by Infineon Technologies AG i. Gr., Bereichs Kommunikation, St.-Martin-Strasse 53 D-81541 München © Infineon Technologies AG1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologiesis an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Data Sheet Rev. 1.7 17 2003-06-02