Final Product/Process Change Notification Document # : FPCN20461X Issue Date: 26 November 2015 Title of Change: Qualification of ON Semiconductor’s Trench IGBT fab in Niigita (Japan) for 600V/650V and ON Semiconductor Vietnam (OSV) Assembly-Test operations of TO247 package IGBTs for Co-pack dual die. Proposed first ship date: 4 March 2016 Contact information: Contact your local ON Semiconductor Sales Office or <[email protected]>; <[email protected]> Samples: Contact your local ON Semiconductor Sales Office Additional Reliability Data: Contact your local ON Semiconductor Sales Office or <[email protected]>; <[email protected] > Type of notification: This is a Final Product/Process Change Notification (FPCN) sent to customers. FPCNs are issued 90 days prior to implementation of the change. ON Semiconductor will consider this change accepted, unless an inquiry is made in writing within 30 days of delivery of this notice. To do so, contact <[email protected]>. Change Part Identification: VN site code on the marking, effective NH08G product may be sourced from either fab. Change category: ☒ Wafer Fab Change ☒ Assembly Change Change Sub-Category(s): ☒ Manufacturing Site Change/Addition ☐ Manufacturing Process Change Sites Affected: ☐ All site(s) ☐ not applicable ☒ Test Change ☐ Other _______________ ☐ Material Change ☐ Product specific change ☐ Datasheet/Product Doc change ☐ Shipping/Packaging/Marking ☐ Other: _______________________ ☒ ON Semiconductor site(s) : ☐ External Foundry/Subcon site(s) ON Dong Nai Province, Vietnam ON Niigata, Japan Description and Purpose: This FPCN announces the planned capacity expansion of ON Semiconductor’s TIGBT fab and assembly/test operations of TO247 package IGBTs Co-pack dual die. Wafer fabrication of the 600V/650V devices are sourced from ON Semiconductor at Czech Republic (CZ4). ON Semiconductor Niigata, Japan is added as additional fabrication site. Upon the expiration of this FPCN, 600V and 650V TIGBT devices will be produced in either of the two locations, ON Semiconductor at Czech Republic (CZ4) or On Semiconductor Niigata (JPF) effective February 2016. These products have been qualified to industrial requirements. Currently, assembly and test of these devices is performed at Nantong Fujitsu Microelectronics (NMFE), China. ON Semiconductor Vietnam (OSV) is being added as an additional assembly and test site. Upon the expiration of this FPCN, TO247 packaged IGBTs Co-pack dual die for the affected devices will be produced in either of the two locations, Nantong Fujitsu Microelectronics (NMFE) or On Semiconductor Vietnam (OSV). These products have been qualified to industrial requirements. These products will be Pb-free, Halide free and RoHS compliant. TEM001092 Rev. F Page 1 of 4 Final Product/Process Change Notification Document # : FPCN20461X Issue Date: 26 November 2015 Reliability Data Summary for Assembly Expansion: QV DEVICE NAME: NGTB75N65FL2WG PACKAGE: TO247 Test Specification Condition Interval Results HTRB JESD22-A108 Ta = 145°C, 80% max rated V 1008 hrs 0/240 HTGB JESD22-A108 Ta = 150°C, 100% max rated Vgss 1008 hrs 0/240 HTSL JESD22-A103 Ta = 175°C 1008 hrs 0/240 IOL MIL-STD-750 (M1037) AEC-Q101 Ta = +25°C, delta Tj=100°C On/off = 5 min 6000 cyc 0/240 TC JESD22-A104 Ta = -55°C to +150°C 1000 cyc 0/240 H3TRB JESD22-A101 85°C, 85% RH, 18.8psig, bias 1008 hrs 0/240 uHAST JESD22-A102 121°C, 100% RH, 15psig, unbiased 96 hrs 0/240 RSH JESD22- B106 Ta = 265°C, 10 sec 0/90 SD JSTD002 Ta = 245°C, 10 sec 0/45 QV DEVICE NAME: NGTB50N120FL2WG PACKAGE: TO247 Test Specification Condition Interval Results HTRB JESD22-A108 Ta = 145°C, 80% max rated V 1008 hrs 0/240 HTGB JESD22-A108 Ta = 150°C, 100% max rated Vgss 1008 hrs 0/240 HTSL JESD22-A103 Ta = 175°C 1008 hrs 0/240 IOL MIL-STD-750 (M1037) AEC-Q101 Ta = +25°C, delta Tj=100°C On/off = 5 min 6000 cyc 0/240 TC JESD22-A104 Ta = -55°C to +150°C 1000 cyc 0/240 H3TRB JESD22-A101 85°C, 85% RH, 18.8psig, bias 1008 hrs 0/240 uHAST JESD22-A102 121°C, 100% RH, 15psig, unbiased 96 hrs 0/240 RSH JESD22- B106 Ta = 265°C, 10 sec 0/90 SD JSTD002 Ta = 245°C, 10 sec 0/45 TEM001092 Rev. F Page 2 of 4 Final Product/Process Change Notification Document # : FPCN20461X Issue Date: 26 November 2015 Niigata Fab 600V/650V Trench IGBT Reliability Data Summary: QV DEVICE NAME: NGTB75N60FL2WG PACKAGE: TO247 Test Specification Condition Interval Results HTRB JESD22-A108 Ta = 145°C, 80% max rated V 1008 hrs 0/240 HTGB JESD22-A108 Ta = 175°C, 100% max rated Vgss 1008 hrs 0/240 HTSL JESD22-A103 Ta = 150°C 1008 hrs 0/240 IOL MIL-STD-750 (M1037) AEC-Q101 Ta = +25°C, delta Tj=100°C On/off = 5 min 6000 cyc 0/240 TC JESD22-A104 Ta = -55°C to +150°C 1000 cyc 0/240 H3TRB JESD22-A101 85°C, 85% RH, 18.8psig, bias 1008 hrs 0/240 uHAST JESD22-A102 121°C, 100% RH, 15psig, unbiased 96 hrs 0/240 RSH JESD22- B106 Ta = 265°C, 10 sec 0/90 SD JSTD002 Ta = 245°C, 10 sec 0/45 Electrical Characteristic Summary: Electrical characteristics are not impacted. List of Affected Standard Parts: (Trench IGBT Copack 1200V) TEM001092 Rev. F Part Number Qualification Vehicle NGTB15N120FL2WG NGTB50N120FL2WG NGTB25N120FL2WG NGTB50N120FL2WG NGTB25N120SWG NGTB50N120FL2WG NGTB30N120FL2WG NGTB50N120FL2WG NGTB30N120L2WG NGTB50N120FL2WG NGTB40N120FL2WG NGTB50N120FL2WG NGTB40N120SWG NGTB50N120FL2WG NGTB50N120FL2WG NGTB50N120FL2WG Page 3 of 4 Final Product/Process Change Notification Document # : FPCN20461X Issue Date: 26 November 2015 List of Affected Standard Parts: (Trench IGBT Copack 600V/650V) Part Number TEM001092 Rev. F Qualification Vehicle NGTB30N60IHLWG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB30N65IHL2WG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB35N60FL2WG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB35N65FL2WG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB40N60IHLWG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB40N60L2WG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB40N65IHL2WG NGTB45N60S1WG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB45N60S2WG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB45N60SWG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB50N60FL2WG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB50N60L2WG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB50N60S1WG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB50N60SWG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB50N65FL2WG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB75N60FL2WG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB75N60SWG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB75N65FL2WG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB40N60FL2WG NGTB75N65FL2WG, NGTB75N60FL2WG NGTB40N65FL2WG NGTB75N65FL2WG, NGTB75N60FL2WG Page 4 of 4