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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 16721
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Issue Date: 09-Sep-2011
TITLE: VHVIC 2nd Source Qualification to Gresham FAB – Phase 2
PROPOSED FIRST SHIP DATE: 09-Dec-2011
AFFECTED CHANGE CATEGORY(S): Wafer Fab location
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor Sales Office or Scott Brow<[email protected]>
SAMPLES: Contact your local ON Semiconductor Sales Office
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Office or Ken Fergus<[email protected]>
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers.
implementation of the change.
FPCNs are issued at least 90 days prior to
ON Semiconductor will consider this change approved unless specific conditions of acceptance are
provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>.
DESCRIPTION AND PURPOSE:
The purpose of this final PCN is to notify customers of the qualification of a second source for the
devices listed in this FPCN at ON Semiconductor’s wafer fabrication facilities in Gresham, Oregon.
This qualification is being made to increase the capacity for these devices. This technology is
currently produced out of ON Semiconductor’s wafer fabrication facilities in Aizu, Japan.
These devices are being duplicated at the Gresham wafer FAB. No die design changes have
occurred. No changes to the device performance, data sheets or packaging have been made.
Issue Date: 09-Sep-2011
Rev. 06-Jan-2010
Page 1 of 3
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 16721
RELIABILITY DATA SUMMARY:
Reliability Test Results:
NCP1271D65R2G
#
Test
Test Conditions
1
HTBB
TA=125C, 450V Bias
2
HVTHB
TA=85C, 60%RH, 450V Bias
3
HTOL
TA=125C, 100V Bias
4
HTSL
TA=150C
5
TC-PC
-65C to +150C
6
AC-PC
TA=121C, RH=100%, PSI=15
7 UHAST-PC TA=130C, RH=85%, PSI=18.8 no Bias
8 HAST-PC
TA=130C, RH=85%, PSI=18.8 Bias
9
SAT-PC
Post MSL3 260C
Read Points
Test @ 1008hrs
Test @ 168hrs
Test @ 1008hrs
Test @ 1008hrs
Test @ 500 Cycles
Test @ 96hrs
Test @ 1008hrs
Test @ 1008hrs
Pre and Post PC
Sample Size
3 lots x 80 units
3 lots x 80 units
3 lots x 80 units
3 lots x 80 units
3 lots x 80 units
3 lots x 80 units
3 lots x 80 units
3 lots x 80 units
3 lot x 5 units
Results
0/240
0/240
0/240
0/240
0/240
0/240
0/240
0/240
0/15
Read Points
Test @ 1008hrs
Test @ 1008hrs
Test @ 1008hrs
Test @ 500 Cycles
Test @ 96hrs
Test @ 1008hrs
Test @ 1008hrs
Pre and Post PC
Sample Size
3 lots x 80 units
3 lots x 80 units
3 lots x 80 units
3 lots x 80 units
3 lots x 80 units
3 lots x 80 units
3 lots x 80 units
3 lot x 5 units
Results
0/239*
0/240
0/240
0/240
0/240
0/240
0/240
0/15
Test Conditions
TA=125C, 500V Bias
TA=125C, 380V Bias
TA=150C
-65C to +150C
Read Points
Test @ 1008hrs
Test @ 1008hrs
Test @ 1008hrs
Test @ 500 Cycles
Sample Size
3 lots x 80 units
3 lots x 80 units
3 lots x 80 units
3 lots x 80 units
Results
0/240
0/240
0/240
0/240
SCY991900DWR2G
#
Test
Test Conditions
1
HTOL
TA=125C, 600V Bias
2
TC-PC
-65C to +150C
* (1) EOS failure after 504hrs
Read Points
Test @ 1008hrs
Test @ 500 Cycles
Sample Size
1 lot x 80 units
1 lot x 80 units
Results
0/79*
0/80
Read Points
Test @ 1008hrs
Test @ 500 Cycles
Sample Size
1 lot x 80 units
1 lot x 80 units
Results
0/80
0/80
NCP1396ADR2G
#
Test
Test Conditions
1
HTBB
TA=125C, 600V Bias
2
HTOL
TA=125C, 600V Bias
3
HTSL
TA=150C
4
TC-PC
-65C to +150C
5
AC-PC
TA=121C, RH=100%, PSI=15
6 UHAST-PC TA=130C, RH=85%, PSI=18.8 no Bias
7 HAST-PC
TA=130C, RH=85%, PSI=18.8 Bias
8
SAT-PC
Post MSL3 260C
* (1) EOS failure after 504hrs
NCP1237AD65R2G
#
Test
1
HTBB
3
HTOL
4
HTSL
5
TC-PC
NCP1380BDR2G
#
Test
1
HTOL
2
TC-PC
NCP4303ADR2G
#
Test
1
HTOL
Issue Date: 09-Sep-2011
Test Conditions
TA=125C, 30V Bias
-65C to +150C
Test Conditions
TA = 125C, 200V Bias
Rev. 06-Jan-2010
Read Points
Test @ 1008hrs
Sample Size
1 lot x 80 units
Results
0/80
Page 2 of 3
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION # 16721
ELECTRICAL CHARACTERISTIC SUMMARY:
There is no change in the electrical performance. Datasheet specifications remain unchanged.
CHANGED PART IDENTIFICATION:
Affected products with date code WW36-2011 and greater may be sourced from either Gresham or
Aizu wafer Fabrication site.
List of affected General Parts:
NCP4303ADR2G
NCP4303BDR2G
NCP4303AMNTWG
NCP4303BMNTWG
Issue Date: 09-Sep-2011
Rev. 06-Jan-2010
Page 3 of 3