VS O5 6 SOT190-1 plastic very small outline package; 56 leads 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code VSO56 Package type industry code VSO56 Package style descriptive code VSO (very thin small outline) Package style suffix code NA (not applicable) Package body material type P (plastic) Mounting method type S (surface mount) Issue date 19-2-2003 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 21.35 - 21.5 21.65 mm E package width 11 - 11 11.1 mm A seated height [tbd] - 3.3 3.3 mm A2 package height 2.8 - 2.85 3 mm n2 actual quantity of termination - - 56 - SOT190-1 NXP Semiconductors plastic very small outline package; 56 leads 2. Package outline VSO56: plastic very small outline package; 56 leads SOT190-1 D E A X c y HE v M A Z 56 29 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 detail X 28 w M bp e 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 3.3 0.3 0.1 3.0 2.8 0.25 0.42 0.30 0.22 0.14 21.65 21.35 11.1 11.0 0.75 15.8 15.2 2.25 1.6 1.4 1.45 1.30 0.2 0.1 0.1 0.90 0.55 inches 0.13 0.012 0.004 0.12 0.11 0.01 0.017 0.0087 0.85 0.012 0.0055 0.84 0.44 0.62 0.0295 0.43 0.60 0.089 0.063 0.055 0.057 0.035 0.008 0.004 0.004 0.051 0.022 θ 7o 0o Notes 1. Plastic or metal protrusions of 0.3 mm (0.012 inch) maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 97-08-11 03-02-19 SOT190-1 Fig. 1. Package outline VSO56 (SOT190-1) SOT190-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/6 SOT190-1 NXP Semiconductors plastic very small outline package; 56 leads 3. Soldering Footprint information for reflow soldering of VSO56 package SOT190-1 Hx Gx P2 (0.125) Hy (0.125) Gy By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 0.750 P2 Ay By 0.825 16.200 11.900 C D1 D2 2.150 0.450 Gx Gy Hx Hy 0.600 21.250 11.600 22.100 16.450 sot190-1_fr Fig. 2. Reflow soldering footprint for VSO56 (SOT190-1) SOT190-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/6 SOT190-1 NXP Semiconductors plastic very small outline package; 56 leads 1/2 D1 P((N- 2)x) solder lands H C solder resist occupied area solder thief A E B THS F 4.00 H D2 (4x) board direction D1 G1 G2 MLC747 Fig. 3. Wave soldering footprint for VSO56 (SOT190-1) SOT190-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/6 SOT190-1 NXP Semiconductors plastic very small outline package; 56 leads 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT190-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/6 SOT190-1 NXP Semiconductors plastic very small outline package; 56 leads 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 5 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 February 2016 SOT190-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 6/6