INTEGRATED CIRCUITS DATA SHEET TDA9830 TV sound AM-demodulator and audio source switch Product specification File under Integrated Circuits, IC02 June 1994 Philips Semiconductors Product specification TV sound AM-demodulator and audio source switch TDA9830 FEATURES • Adjustment free wideband synchronous AM demodulator • Audio source-mute switch (low noise) • Audio level according EN50049 • 5 to 8 V power supply or 12 V alternative • Low power consumption. GENERAL DESCRIPTION The TDA9830, a monolithic integrated circuit, is designed for AM-sound demodulation used in L- and L’-standard. The IC provides an audio source selector and also mute switch. QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT 8.8 V V14 positive supply voltage 4.5 5.0 V11 supply voltage (alternative) 10.8 12.0 13.2 V I14,11 supply current 24 30 36 mA V1−16 IF sensitivity (RMS value) (for −3 dB AF-signal) − 60 100 µV Gv gain control 60 66 − dB V6 AF output signal (m = 54%) (RMS value) 400 500 600 mV V6 S/N ratio acc. CCIR468-3 (IF-signal 10 mVRMS) 47 53 − dB V7,9 AF input signal (for THD < 1.5%) (RMS value) − − 1.2 V V8 crosstalk and mute attenuation 80 90 − dB Tamb operating ambient temperature 0 − +70 °C ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER PINS PIN POSITION MATERIAL CODE TDA9830 16 DIL plastic SOT38GG(1) TDA9830T 16 SO plastic SOT109(2) Note 1. SOT38-1; 1996 November 20. 2. SOT109-1; 1996 November 20. June 1994 2 Philips Semiconductors Product specification TDA9830 Fig.1 Block diagram. TV sound AM-demodulator and audio source switch June 1994 3 Philips Semiconductors Product specification TV sound AM-demodulator and audio source switch TDA9830 PINNING SYMBOL PIN DESCRIPTION IFIN 1 sound IF differential input signal n.c. 2 not connected CAGC 3 AGC capacitor CREF 4 REF voltage filtering capacitor n.c. 5 not connected AMOUT 6 AM demodulator output AMIN 7 input signal (from AM) to audio switch AFOUT 8 output signal from audio switch EXTIN 9 input signal (from external) to audio switch SWITCH 10 switch input select control Vp2 11 supply voltage +12 V (alternative) MUTE 12 mute control GND 13 ground (0 V) Vp1 14 supply voltage +5 to +8 V n.c. 15 not connected IFIN 16 sound IF differential input signal FUNCTIONAL DESCRIPTION Sound IF input The sound IF amplifier consists of three AC-coupled differential amplifier stages each with approximately 20 dB gain. At the output of each stage is a multiplier for gain controlling (→ current distribution gain control). The overall control range is approximately −6 to +60 dB and the frequency response (−3 dB) of the IF amplifier is approximately 6 to 70 MHz. The steepness of gain control is approximately 10 mV/dB. IF AGC The automatic gain control voltage to maintain the AM demodulator output signal at a constant level is generated by a mean level detector. This AGC-detector charges and discharges the capacitor at pin 3 controlled by the output signal of the AM-demodulator compared to an internal reference voltage. The June 1994 Fig.2 Pin configuration. maximum charge/discharge current is approximately 5 µA. This value in combination with the value of the AGC capacitor and the AGC steepness determines the lower cut-off audio frequency and the THD-figure at low modulation frequency of the whole AM-demodulator. Therefore a large time constant has to be chosen which leads to slow AGC reaction at IF level change. To speed up the AGC in case of IF signal jump from low to high level, there is an additional comparator built in, which can provide additional discharge current from the AGC capacitor up to 5 mA in a case of overloading the AM demodulator by the internal IF signal. AM-demodulator The IF amplifier output signal is fed to a limiting amplifier (two stages) and to a multiplier circuit. However the limiter output signal (which is not any more AM modulated) is also fed to the multiplier, which provides AM 4 demodulation (in phase demodulation). After lowpass filtering (fg ≈ 400 kHz) for carrier rejection and buffering, the demodulator output signal is present at pin 6. The AM demodulator operates over a wide frequency range, so that in combination with the frequency response of the IF amplifier applications in a frequency range from approximately 6 MHz up to 70 MHz are possible. Audio switch This circuit is an operational amplifier with three input stages and internal feedback network determining gain (0 dB) and frequency response (fg ≈ 700 kHz). Two of the input stages are connected to pin 7 and pin 9, the third input stage to an internal reference voltage. Controlled by the switching pins 10 and 12, one of the three input stages can be activated and a choice made between two different AF signals or mute state. The selected signal is present at Philips Semiconductors Product specification TV sound AM-demodulator and audio source switch pin 8. The decoupling capacitors at the input pins are needed, because the internally generated bias voltage for the input stages must not be influenced by the application in order to avoid DC-plop in case of switching. Reference circuit This circuit is a band gap stabilizer in combination with a voltage regulation amplifier, which provides an internal reference voltage of about 3.6 V nearly independent from supply voltage and temperature. This reference voltage is filtered by the capacitor at pin 4 in order to reduce noise. It is used as a reference to generate all important voltages and currents of the circuit. The AM demodulator output is designed to provide almost the same DC voltage as the input bias voltage of the audio switch. But there may be spread between both voltages. Therefore it is possible to connect pin 6 directly to pin 7 (without a decoupling capacitor), but in this event the DC-plop for switching can increase up to 100 mV. TDA9830 Darlington transistor in order to reduce the supply voltage for all IC function blocks to approximately 6 V. This is necessary because of use of modern high frequency IC technology, where most of the used integrated components are only allowed to operate at maximum 9 V supply voltage. For application in 12 V power supply concepts, there is an internal voltage divider in combination with a LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC134). SYMBOL PARAMETER MIN. MAX. UNIT V14−13 supply voltage VP1 −0.5 +8.9 V V11−13 supply voltage VP2 −0.5 +13.3 V V10, 12−13 switching voltage −0.5 VP + 0.5 V Tamb operating ambient temperature 0 +70 °C Tstg storage temperature −25 +150 °C Note to the limiting values 1. To avoid an inadmissible increase of ambient temperature, it is not allowed to short-circuit pin 11 for more than 10 seconds to ground. THERMAL RESISTANCE SYMBOL Rth j-a June 1994 PARAMETER THERMAL RESISTANCE from junction to ambient in free air SOT38 74 K/W SOT109 100 K/W 5 Philips Semiconductors Product specification TV sound AM-demodulator and audio source switch TDA9830 CHARACTERISTICS VP1 = 5.0 V at pin 14; Tamb = +25 °C; sound carrier fSC = 32.4 MHz modulated with f = 1 kHz and modulation depth m = 54%. IF input signal (sound carrier): V1-16 10 mVRMS; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V14−13 positive supply voltage VP1 note 1 4.5 5.0 8.8 V V11−13 positive supply voltage VP2 note 1 10.8 12.0 13.2 V I11/I14 current consumption 24 30 36 mA 1.75 2.2 2.65 kΩ IF amplifier and gain control R1−16 input resistance C1−16 input capacitance 1.0 1.5 2.2 pF V1−16 minimum IF input signal (RMS value) note 2 − 60 100 µV V1−16 maximum IF input signal (RMS value) note 3 70 120 − mV Gv gain control 60 66 − dB I3 maximum AGC charging/discharging current 3.5 5 7 µA I3 fast AGC discharging current − − 5 mA V3 − V13 gain control voltage (Gmin − Gmax) B −3 dB IF bandwidth V1/16−13 1.5 − 2.8 V upper cut-off frequency 50 70 − MHz lower cut-off frequency − 6 10 MHz − 1.7 − V 400 500 600 mV upper cut-off frequency 100 − − kHz lower cut-off frequency; note 7 − − 20 Hz DC potential AM-Demodulator V6−13 AF output signal (RMS value) B −3 dB AF bandwidth V6−13 THD − 0.8 2 % V6−13 S/N (weighted acc. CCIR 468-3) 47 53 − dB V6−13 DC potential 2.00 2.15 2.30 V R6 output resistance (emitter follower with 0.5 mA bias current) − 300 − Ω I6abs allowable AC output current − − 0.3 mA I6 allowable DC output current − − −0.5 mA − − 1.2 V Audio-switch V7,9−13 AF-input-signal for THD < 1.5% (RMS value) V8−13 S/N ratio of audio switch (in accordance with CCIR 468-3) reference signal at pin 7/9 is 0.5 VRMS 70 80 − dB B −3 dB AF bandwidth upper limit 100 − − kHz V8−13 THD at 1 VRMS input signal at pin 7 or 9 − 0.1 1.0 % June 1994 6 Philips Semiconductors Product specification TV sound AM-demodulator and audio source switch SYMBOL PARAMETER V8−13 crosstalk and mute attenuation CONDITIONS 20 Hz to 20 kHz TDA9830 MIN. 80 TYP. 90 MAX. − UNIT dB V7,8,9−13 DC-potential 2.00 2.15 2.30 V R7,9−13 input resistance 40 50 60 kΩ G7,9−8 gain of audio switch −0.5 0 +0.5 dB 0 − 0.8 V 1.5 − VP V 0 − 0.8 V 1.5 − VP V −110 −145 −185 µA − 5 10 mV 70 100 150 Ω AF signal output: αRR = Vripple on VP / Vripple on Vout 26 30 − dB AF signal output with AF signal from external source 40 44 − dB V10−13 audio switching voltage to activate pin 7 V10−13 audio switching voltage to activate pin 9 V12−13 input voltage for MUTE-ON input voltage for MUTE-OFF I10, 12 output current of switching-pins at V10, 12-13 = 0 V V8-13 DC-plop at AF output pin with switching from internal to external audio signal or to mute-state or vice-versa R8 output resistance note 4 note 4 note 5 Ripple rejection note 6 RR Notes to the characteristics 1. In the power supply voltage range VP1 = 5.0 V up to 8.0 V the performance will not change essentially. With power supply from VP2 = 12.0 V the performance will be comparable with the performance at VP1 = 5.0 V up to 8.0 V. The unused power supply pin must be not connected. 2. Start of gain control (low IF input signal) at −3 dB AF signal reduction at pin 6. 3. End of gain control (high IF input signal) at +1 dB AF signal expansion at pin 6. 4. This state is also valid for pin left open-circuit. 5. If a DC-plop of about maximum 100 mV is acceptable when switching from internal to external audio-signal or from internal to mute state or vice versa, the capacitor between pin 6 and 7 can be omitted and pin 6 can be connected to pin 7. 6. Measured with Vripple = 200 mV(p-p) at 70 Hz superimposed on supply voltage VP. 7. Dependent on value of AGC capacitor. June 1994 7 Philips Semiconductors Product specification TDA9830 Fig.3 Internal circuits. TV sound AM-demodulator and audio source switch June 1994 8 Philips Semiconductors Product specification TV sound AM-demodulator and audio source switch Fig.4 Test circuit 5 to 8 V supply. Fig.5 Test circuit 12 V supply. June 1994 9 TDA9830 Philips Semiconductors Product specification TV sound AM-demodulator and audio source switch Fig.6 S/N figure as a function of the IF input signal. Fig.7 Frequency response at pin 6. Fig.8 THD at pin 6. June 1994 10 TDA9830 Product specification TDA9830 With an IF filter according to this proposal, the video buzz suppression on the audio output is better than 50 dB (in accordance with CCIR468−3, m = 54%) for the worst case video modulation with 6 kHz sinewave black-to-white. Philips Semiconductors 11 TV sound AM-demodulator and audio source switch June 1994 Fig.9 Proposed tolerance scheme IF filter for standard L. Philips Semiconductors Product specification TV sound AM-demodulator and audio source switch TDA9830 PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE June 1994 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 12 Philips Semiconductors Product specification TV sound AM-demodulator and audio source switch TDA9830 SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.16 0.15 0.244 0.050 0.041 0.228 0.039 0.016 0.028 0.020 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07S MS-012AC June 1994 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 13 o 8 0o Philips Semiconductors Product specification TV sound AM-demodulator and audio source switch to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. SOLDERING Introduction Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: DIP • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied June 1994 TDA9830 14 Philips Semiconductors Product specification TV sound AM-demodulator and audio source switch TDA9830 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. June 1994 15