PHILIPS TDA3664

INTEGRATED CIRCUITS
DATA SHEET
TDA3664
Very low dropout voltage/quiescent
current 5 V voltage regulator
Preliminary specification
Supersedes data of 1999 Aug 11
File under Integrated Circuits, IC01
1999 Sep 01
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent
current 5 V voltage regulator
TDA3664
• Able to withstand voltages up to 18 V at the output
(supply line may be short-circuited)
FEATURES
General
• ESD protection on all pins
• Fixed 5 V, 100 mA regulator
• Supply voltage range up to +33 V (45 V)
• DC short-circuit safe to ground and VP of regulator
output
• Very low quiescent current (typically 15 µA)
• Temperature protection (Tj > 150 °C).
• Very low dropout voltage
• High ripple rejection
GENERAL DESCRIPTION
• Very high stability
The TDA3664 is a fixed 5 V voltage regulator with very low
dropout voltage/quiescent current, which operates over a
wide supply voltage range.
– Electrolytic capacitors: ESR (Equivalent Series
resistance) < 38 Ω at IREG ≤ 25 mA
– Other capacitors: 100 nF at 200 µA ≤ IREG ≤ 100 mA
see Fig.5 and Fig.6
The regulator is available as:
• TDA3664T: SO8 package (non-automotive)
• Pin compatible family TDA3662 up to TDA3666.
• TDA3664AT: SO8 package (automotive)
Protections
• TDA3664: SOT223 package (automotive).
• Reverse polarity safe (down to −25 V without high
reverse current)
Automotive: VP ≤ 50P V, −40 °C ≤ Tamb ≤ +125 °C.
Non-automotive: VP ≤ 22V, −40 °C ≤ Tamb ≤ +85 °C.
• Negative transient of 50 V (RS = 10 Ω, t < 100 ms)
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
supply voltage
VP
Iq(tot)
TDA3664
regulator on
3
14.4
45
V
TDA3664AT
regulator on
3
14.4
45
V
TDA3664T
regulator on
3
14.4
33
V
VP = 14.4 V; no load
−
15
30
µA
total quiescent supply current
(all versions)
Voltage regulator
VREG
regulator output voltage
TDA3664T
8 V ≤ VP ≤ 22 V
4.8
5.0
5.2
V
TDA3664 and TDA3664AT
6 V ≤ VP ≤ 45 V
4.75
5.0
5.25
V
IREG
regulator output current
0.5 mA ≤ IREG ≤ 100 mA
4.75
5.0
5.25
V
VREG(drop)
dropout voltage
IREG = 50 mA
−
0.18
0.3
V
ORDERING INFORMATION
TYPE
NUMBER
TDA3664
PACKAGE
NAME
DESCRIPTION
−
VERSION
plastic surface mounted package; collector pad for good heat transfer; 4 leads
SOT223
TDA3664T
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
TDA3664AT
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
1999 Sep 01
2
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent
current 5 V voltage regulator
TDA3664
BLOCK DIAGRAM
handbook, halfpage 1 (8)
V
P
3 (1)
REGULATOR
REG
BANDGAP
TDA3664
THERMAL
PROTECTION
2, 4 (3)
MGL809
GND
Pins between brackets are for the SO8 version.
Fig.1 Block diagram for SOT223.
PINNING
PIN
SYMBOL
DESCRIPTION
SOT223
SO8
1
8
supply voltage
GND
2 and 4
3
ground
REG
3
1
regulator output
n.c.
−
2, 4, 5, 6 and 7
VP
not connected
GND
handbook, halfpage
handbook, halfpage
4
REG
1
n.c.
2
8
VP
7
n.c.
TDA3664
1
2
3
VP
GND
REG
GND
3
6
n.c.
n.c.
4
5
n.c.
MDA959
MGL810
Fig.2 Pin configuration of SOT223.
1999 Sep 01
Fig.3 Pin configuration of SO8.
3
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent
current 5 V voltage regulator
TDA3664
FUNCTIONAL DESCRIPTION
A temperature protection is included, which switches the
regulator output off at IC temperatures above 150 °C.
The TDA3664 is a fixed 5 V regulator which can deliver
output currents up to 100 mA. The regulator is available in
SO8 and SOT223 packages. The regulator is intended for
portable, mains, telephone and automotive applications.
To increase the lifetime of batteries, a specially built-in
clamp circuit keeps the quiescent current of this regulator
very low, also in dropout and full load conditions.
A new output structure guarantees the stability of the
regulator with an ESR up to 38 Ω. This is very attractive as
the ESR of an electrolytic capacitor increases strongly at
low temperatures (no expensive tantalum capacitor
required).
The regulator remains operational down to very low supply
voltages, below which it switches off.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
supply voltage
VP
TDA3664T
−
22
V
TDA3664
−
45
V
−
45
V
−
−25
V
SO8
−
0.8
W
SOT223
−
5
W
−55
+150
°C
TDA3664T
−40
+85
°C
TDA3664
−40
+125
°C
TDA3664AT
−40
+125
°C
−40
+150
°C
TDA3664AT
VP(rp)
reverse polarity supply voltage
non-operating
Ptot
total power dissipation
Tamb = 25 °C
Tstg
storage temperature
non-operating
Tamb
ambient temperature range
operating
Tj
junction temperature
operating
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
thermal resistance from junction to ambient
SOT223
thermal resistance from junction to case (SOT223)
UNIT
155
K/W
100
K/W
25
K/W
in free air, soldered in
SO8
Rth(j-c)
VALUE
in free air
QUALITY SPECIFICATION
In accordance with “SNW-FQ-611E”. The number of the quality specification can be found in the “Quality Reference
Handbook”.
1999 Sep 01
4
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent
current 5 V voltage regulator
TDA3664
CHARACTERISTICS
VP = 14.4 V; Tamb = 25 °C; see Fig.4; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply voltage
VP
Iq
supply voltage
TDA3664
regulator operating; note 1
3
14.4
45
V
TDA3664AT
regulator operating; note 1
3
14.4
45
V
TDA3664T
regulator operating; note 1
3
14.4
33
V
VP = 4.5 V; IREG = 0
−
10
−
µA
VP = 14.4 V; IREG = 0
−
15
30
µA
6 V ≤ VP ≤ 22 V; IREG = 10 mA
−
0.2
0.5
mA
6 V ≤ VP ≤ 22 V; IREG = 50 mA
−
1.4
2.5
mA
5.0
5.2
V
quiescent current
Regulator output: on pin REG (IREG = 0.5 mA), −40 °C ≤ Tamb ≤ 125 °C; note 2
VREG
regulated output voltage
IREG = 0.5 mA,
4.8
8 V ≤ VP ≤ 22 V, Tamb = 25 °C
∆VREG(line)
line regulation voltage
IREG = 0.5 mA, 8 V ≤ VP ≤ 22 V 4.75
5.0
5.25
V
0.5 mA ≤ IREG ≤ 100 mA
4.75
5.0
5.25
V
6 V ≤ VP ≤ 45 V; note 2
4.75
5.0
5.25
V
8 V ≤ VP ≤ 16 V, Tamb = 25 °C
−
1
10
mV
7 V ≤ VP ≤ 22 V, Tamb = 25 °C
−
1
30
mV
7 V ≤ VP ≤ 45 V; note 2
−
1
50
mV
0.5 mA ≤ IREG ≤ 50 mA
−
10
50
mV
∆VREG(load)
load regulation voltage
SVRR
supply voltage ripple rejection
fi = 120 Hz; Vripple = 1 Vrms
50
60
−
dB
VREG(drop)
dropout voltage
IREG = 50 mA; VP = 4.5 V;
Tamb ≤ 85 °C
−
0.18
0.3
V
IREG(crl)
current limit
VREG > 4.5 V
0.17
0.25
−
A
VREG(stab)
long-term stability
−
20
−
mV/1000 h
ILO(rp)
output leakage current
−
1
500
µA
with reverse polarity input
VP = −15 V, VREG ≤ 0.3 V
Notes
1. The regulator output will follow VP if VP < VREG + VREG(drop)
2. TDA3664T: VP ≤ 22 V; −40 °C ≤ Tamb ≤ 85 °C.
1999 Sep 01
5
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent
current 5 V voltage regulator
TDA3664
TEST AND APPLICATION INFORMATION
Application information
Test information
NOISE
The output noise is determined by the value of the output
capacitor, see Table 1.
Table 1
handbook, halfpage
VP
1
C1(1)
1 µF
REG(3)
3
C2(2)
TDA3664
Noise figures
NOISE FIGURE (µV)(1)
OUTPUT
CURRENT
IO (mA)
CO = 10 µF
CO = 47 µF
CO = 100 µF
0.5
550
320
300
50
650
400
400
2, 4
MDA960
Note
1. Measured at a bandwidth of 10 Hz to 100 kHz.
STABILITY
(1) C1 is optional (to minimize supply noise only).
(2) C2 = 10 µF.
(3) VREG = 5 V.
The regulator is stabilized with an external capacitor on the
output. The value of this capacitor can be selected using
the diagrams shown in Fig.5 and Fig.6. The four examples
on the next page show the effects of the stabilization circuit
using different values for the output capacitor.
Fig.4 Test circuit (SOT223).
MDA961
102
handbook, halfpage
MDA962
103
handbook, halfpage
ESR
(Ω)
ESR
(Ω)
(1)
102
10
22
10
stable region
1
stable region
1
(2)
10−1
10−1
10−1
1
10
C2 (µF)
102
1
10
102
IREG (mA)
103
(1) Maximum ESR (Equivalent Series resistance)
at 200 µA ≤ IREG ≤ 100 mA.
(2) Minimum ESR only when IREG ≤ 200 µA.
Fig.5
Curve for selecting the value of the output
capacitor.
1999 Sep 01
Fig.6
6
ESR dependency due to IREG for selecting
the right type of output capacitor.
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent
current 5 V voltage regulator
TDA3664
Example 1
The total thermal resistance of the TDA3664 (SOT223
package) can be decreased to lower values when pin 4
and body of the package are soldered to the printed-circuit
board.
The regulator is stabilized with an electrolytic output
capacitor of 68 µF (ESR = 0.5 Ω). At −40 °C, the capacitor
value is decreased to 22 µF and the ESR is increased to
3.5 Ω. The regulator will remain stable at a temperature of
−40 °C.
Application circuit with backup function
Sometimes, a backup function is needed to supply, for
example, a microprocessor for a short period of time when
the supply voltage spikes to 0 V (or even −1 V).
Example 2
The regulator is stabilized with an electrolytic output
capacitor of 10 µF (ESR = 3.3 Ω). At −40 °C, the capacitor
value is decreased to 3 µF and the ESR is increased to
20 Ω. The regulator will remain stable at a temperature of
−40 °C.
This function can be easily built with the TDA3664 by using
a large output capacitor. When the supply voltage is 0 V
(or −1 V), no large current will flow into the output pin out
of this large output capacitor (only a few µA).
The application circuit is given in Fig.7.
Example 3
The regulator is stabilized with a 100 nF MKT capacitor on
the output. Full stability is guaranteed when the output
current is over 200 µA.
Because the thermal influence on this capacitor value is
almost zero, the regulator will remain stable at a
temperature of −40 °C.
handbook, halfpage
VP
C1(1)
1 µF
Example 4
1
3
TDA3664
REG(3)
C2(2)
2, 4
The regulator is stabilized with a 100 nF capacitor in
parallel with a electrolytic capacitor of 10 µF on the output.
MDA960
The regulator is now stable under all conditions and
independent of:
• The ESR of the electrolytic capacitor
• The output current.
(1) C1 is optional (to minimize supply noise only).
(2) C2 ≤ 4700 µF.
(3) VREG = 5 V.
APPLICATION CIRCUITS
Fig.7
• The value of the electrolytic capacitor
The maximum output current of the regulator equals:
150 – T amb
150 – T amb
I o ( max ) = ----------------------------------------------------- = ------------------------------------- (mA)
100 × ( V P – 5 )
R th(j-a) × ( V P – V REG )
When Tamb = 21 °C, the maximum output current equals
140 mA at VP =14 V.
1999 Sep 01
7
Application circuit with backup functionality
(SOT223 version).
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent
current 5 V voltage regulator
TDA3664
ADDITIONAL APPLICATION INFORMATION
This section gives typical curves for various parameters measured on the TDA3664AT. Standard test conditions are:
VP = 14.4 V; Tamb = 25 °C.
MDA947
25
MDA949
4
handbook, halfpage
handbook, halfpage
Iq
(µA)
Iq
(mA)
20
3
15
2
10
1
5
0
0
0
Fig.8
20
10
VP (V)
0
30
Quiescent current as a function of supply
voltage (no load).
Fig.9
10
20
40
30
50
Quiescent current increase at high supply
voltage.
MDA951
2
MDA948
0.48
handbook, halfpage
VP (V)
handbook, halfpage
Iq
(mA)
(1)
Iq
(mA)
1.5
0.44
1
0.40
0.5
(2)
0
−40
0.36
0
40
80
120
160
Tj (°C)
5
10
15
20
VP (V)
25
(1) Iq at 50 mA load.
(2) Iq at 10 mA load.
Fig.10 Quiescent current as a function of
temperature.
1999 Sep 01
Fig.11 Quiescent current as a function of supply
voltage (IO = 10 mA).
8
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent
current 5 V voltage regulator
TDA3664
MDA950
2
MDA952
4
handbook, halfpage
handbook, halfpage
Iq
(mA)
Iq
(mA)
3
1.8
2
1.6
1
0
1.4
5
10
20
15
VP (V)
0
25
Fig.12 Quiescent current as a function of supply
voltage (IO = 50 mA).
60
80
100
IREG (mA)
MDA953
5.10
MDA955
6
handbook, halfpage
VREG
VREG
(V)
(V)
5.05
4
5.00
2
0
50
100
150
0
−50
200
Tj (°C)
Fig.14 Output voltage as a function of temperature
(no load).
1999 Sep 01
40
Fig.13 Quiescent current as a function of load
current.
handbook, halfpage
4.95
−50
20
0
50
100
150
200
Tj (°C)
Fig.15 Output voltage thermal protection
behaviour (no load).
9
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent
current 5 V voltage regulator
TDA3664
MDA957
500
MDA954
6
handbook, halfpage
handbook, halfpage
VREG(drop)
VREG
(V)
(V)
400
4
300
2
200
0
100
0
80
40
IREG (mA)
120
0
Fig.16 Dropout voltage as a function of load
current
handbook, halfpage
(1)
SVRR
(dB)
−40
(2)
−50
(3)
(1)
−60
(2)
−70
10
(3)
102
103
104
f (Hz)
105
(1) SVRR at RL = 10 kΩ.
(2) SVRR at RL = 500 Ω.
(3) SVRR at RL = 100 Ω.
Fig.18 SVRR as a function of frequency at several
load conditions (CO = 10 µF).
1999 Sep 01
200
IREG (mA)
300
Fig.17 Foldback protection mode measured at
VP = 8 V with pulsed load.
MDA956
−30
100
10
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent
current 5 V voltage regulator
TDA3664
PACKAGE OUTLINES
Plastic surface mounted package; collector pad for good heat transfer; 4 leads
D
SOT223
E
B
A
X
c
y
HE
v M A
b1
4
Q
A
A1
1
2
3
Lp
bp
e1
w M B
detail X
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
b1
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.8
1.5
0.10
0.01
0.80
0.60
3.1
2.9
0.32
0.22
6.7
6.3
3.7
3.3
4.6
2.3
7.3
6.7
1.1
0.7
0.95
0.85
0.2
0.1
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
96-11-11
97-02-28
SOT223
1999 Sep 01
EUROPEAN
PROJECTION
11
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent
current 5 V voltage regulator
TDA3664
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.050
0.01
0.01
0.004
0.028
0.012
inches
0.244
0.039 0.028
0.041
0.228
0.016 0.024
θ
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03S
MS-012AA
1999 Sep 01
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04
97-05-22
12
o
8
0o
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent
current 5 V voltage regulator
TDA3664
SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Wave soldering
Manual soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Sep 01
13
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent
current 5 V voltage regulator
TDA3664
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
REFLOW(1)
WAVE
BGA, SQFP
not suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not
PLCC(3), SO, SOJ
suitable
suitable(2)
suitable
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Sep 01
14
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent
current 5 V voltage regulator
TDA3664
NOTES
1999 Sep 01
15
Philips Semiconductors – a worldwide company
Argentina: see South America
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Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
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Belgium: see The Netherlands
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Middle East: see Italy
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Pakistan: see Singapore
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United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
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Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 67
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
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Printed in The Netherlands
545002/02/pp16
Date of release: 1999
Sep 01
Document order number:
9397 750 06347