PHILIPS TEA5768HL

INTEGRATED CIRCUITS
DATA SHEET
TEA5768HL
Low-power FM stereo radio for
handheld applications
Product specification
Supersedes data of 2003 Nov 06
2004 Sep 13
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
CONTENTS
1
FEATURES
2
GENERAL DESCRIPTION
3
ORDERING INFORMATION
4
QUICK REFERENCE DATA
5
BLOCK DIAGRAM
6
PINNING
7
FUNCTIONAL DESCRIPTION
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
Low-noise RF amplifier
FM mixer
VCO
Crystal oscillator
PLL tuning system
RF AGC
IF filter
FM demodulator
Level voltage generator and analog-to-digital
converter
IF counter
Soft mute
MPX decoder
Signal dependent mono to stereo blend
Signal dependent AF response
Software programmable ports
7.10
7.11
7.12
7.13
7.14
7.15
8
I2C-BUS AND BUS-CONTROLLED
FUNCTIONS
8.1
8.1.1
8.1.2
8.2
8.3
8.4
8.5
I2C-bus specification
Data transfer
Power-on reset
I2C-bus protocol
Writing data
Reading data
Bus timing
2004 Sep 13
9
LIMITING VALUES
10
THERMAL CHARACTERISTICS
11
DC CHARACTERISTICS
12
AC CHARACTERISTICS
13
INTERNAL PIN CONFIGURATION
14
APPLICATION INFORMATION
15
PACKAGE OUTLINE
16
SOLDERING
16.1
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
16.2
16.3
16.4
16.5
2
17
DATA SHEET STATUS
18
DEFINITIONS
19
DISCLAIMERS
20
PURCHASE OF PHILIPS I2C COMPONENTS
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
1
TEA5768HL
FEATURES
• High sensitivity due to integrated low-noise RF input
amplifier
• FM mixer for conversion to IF of the US/Europe
(87.5 MHz to 108 MHz) and Japanese
(76 MHz to 91 MHz) FM band
• Soft mute, SNC and HCC can be switched off via the
I2C-bus
• Preset tuning to receive Japanese TV audio up to
108 MHz
• Adjustment-free stereo decoder
• RF Automatic Gain Control (AGC) circuit
• Autonomous search tuning function
• LC tuner oscillator operating with low cost fixed chip
inductors
• Standby mode
• Two software programmable ports
• FM IF selectivity performed internally
• Bus enable line to switch the bus input and output lines
into 3-state mode.
• No external discriminator needed due to fully integrated
FM demodulator
• Crystal reference frequency oscillator; the oscillator
operates with a 32.768 kHz clock crystal or with a
13 MHz crystal and with an externally applied 6.5 MHz
reference frequency
2
GENERAL DESCRIPTION
The TEA5768HL is a single-chip electronically tuned FM
stereo radio for low-voltage applications with fully
integrated IF selectivity and demodulation. The radio is
completely adjustment-free and only requires a minimum
of small and low cost external components. The radio can
be tuned to the European, US and Japanese FM bands.
• PLL synthesizer tuning system
• I2C-bus
• 7-bit IF counter output via the I2C-bus
• 4-bit level information output via the I2C-bus
• Soft mute
• Signal dependent mono to stereo blend [Stereo Noise
Cancelling (SNC)]
• Signal dependent High Cut Control (HCC)
3
ORDERING INFORMATION
TYPE
NUMBER
TEA5768HL
2004 Sep 13
PACKAGE
NAME
LQFP32
DESCRIPTION
plastic low profile quad flat package; 32 leads; body 7 × 7 × 1.4 mm
3
VERSION
SOT358-1
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
4 QUICK REFERENCE DATA
VCCA = VCC(VCO) = VCCD.
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
VCCA
analog supply voltage
2.5
3.0
5.0
V
VCC(VCO)
voltage controlled oscillator
supply voltage
2.5
3.0
5.0
V
VCCD
digital supply voltage
2.5
3.0
5.0
V
ICCA
analog supply current
operating; VCCA = 3 V
6.0
8.4
10.5
mA
standby mode; VCCA = 3 V
−
3
6
µA
ICC(VCO)
voltage controlled oscillator
supply current
operating; VVCOTANK1 = VVCOTANK2 = 3 V
560
750
940
µA
standby mode; VVCOTANK1 = VVCOTANK2 = 3 V
−
1
2
µA
ICCD
digital supply current
operating; VCCD = 3 V
2.1
3.0
3.9
mA
standby mode; VCCD = 3 V
fFM(ant)
FM input frequency
Tamb
ambient temperature
bus enable line HIGH
30
56
80
µA
bus enable line LOW
11
19
26
µA
76
−
108
MHz
VCCA = VCC(VCO) = VCCD = 2.5 V to 5 V
−10
−
+75
°C
fRF = 76 MHz to 108 MHz; ∆f = 22.5 kHz;
fmod = 1 kHz; (S+N)/N = 26 dB;
de-emphasis = 75 µs; L = R;
BAF = 300 Hz to 15 kHz
−
2
3.5
µV
FM overall system parameters; see Fig.5
VRF
RF sensitivity input voltage
S−200
LOW side 200 kHz selectivity ∆f = −200 kHz; fRF = 76 MHz to 108 MHz;
note 1
32
36
−
dB
S+200
HIGH side 200 kHz
selectivity
∆f = +200 kHz; fRF = 76 MHz to 108 MHz;
note 1
39
43
−
dB
VAFL; VAFR left and right audio frequency VRF = 1 mV; L = R; ∆f = 22.5 kHz;
output voltage
fmod = 1 kHz; de-emphasis = 75 µs
60
75
90
mV
(S+N)/N
maximum signal plus
noise-to-noise ratio
VRF = 1 mV; L = R; ∆f = 22.5 kHz;
fmod = 1 kHz; de-emphasis = 75 µs;
BAF = 300 Hz to 15 kHz
54
60
−
dB
αcs(stereo)
stereo channel separation
VRF = 1 mV; R = L = 0 or R = 0 and L = 1
24
including 9 % pilot; ∆f = 75 kHz; fmod = 1 kHz;
data byte 3 bit 3 = 0; data byte 4 bit 1 = 1
30
−
dB
THD
total harmonic distortion
VRF = 1 mV; L = R; ∆f = 75 kHz; fmod = 1 kHz; −
de-emphasis = 75 µs
0.4
1
%
Note
1. LOW side and HIGH side selectivity can be switched by changing the mixer from HIGH side to LOW side LO injection.
2004 Sep 13
4
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33 nF
33 nF
TIFC
Vref
MPXO
TMUTE
VAFR
VAFL
23
22
21
20
19
18
17
Igain 25
R1
GAIN
STABILIZATION
POWER
SUPPLY
AGND 26
22 nF
VCCA
22 µF
VCCA 27
RESONANCE
AMPLIFIER
4.7 Ω
DEMODULATOR
SOFT
MUTE
LIMITER
SDS
I/Q-MIXER
1st FM
FM antenna
N1
RFI1 28
27 pF
RFGND 29
47 pF
RFI2 30
1 nF
16 PILFIL
MPX
DECODER
IF CENTRE
FREQUENCY
ADJUST
100 pF
L1
IF
COUNTER
LEVEL
ADC
÷2
22 nF
33 kΩ
22 nF
15
Iref
PHASEFIL
AGC
Ccomp(1)
14 XTAL2
TEA5768HL
TAGC 31
CRYSTAL
OSCILLATOR
13 XTAL1
Cpull(1)
5
4.7 nF
programmable divider output
LOOPSW 32
TUNING SYSTEM
MUX
reference frequency divider output
SOFTWARE
PROGRAMMABLE
PORT
Low-power FM stereo radio for
handheld applications
BLOCK DIAGRAM
24
47 nF
LIMDEC1
Philips Semiconductors
5
2004 Sep 13
47 nF
47 nF
LIMDEC2
32.768 kHz
or
13 MHz
12 SWPORT2 10 kΩ
11 SWPORT1
VCCA
10 kΩ
pilot
mono
VCO
1
I2C-BUS
2
3
CPOUT VCOTANK1
VCOTANK2
4
VCC(VCO)
9 BUSMODE
5
6
7
8
DGND
VCCD
DATA
CLOCK
mhc275
12 Ω
10 nF
39 nF
10 BUSENABLE
D1
D2
VCCD
22 nF
10 kΩ
L3
L2
100 kΩ
VCC(VCO)
The component list is given Chapter 14.
(1) Ccomp and Cpull data depends on crystal specification.
Fig.1 Block diagram.
Product specification
22 nF
TEA5768HL
47 Ω
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
6
TEA5768HL
PINNING
SYMBOL
PIN
DESCRIPTION
CPOUT
1
charge pump output of synthesizer PLL
VCOTANK1
2
voltage controlled oscillator tuned circuit output 1
VCOTANK2
3
voltage controlled oscillator tuned circuit output 2
VCC(VCO)
4
voltage controlled oscillator supply voltage
DGND
5
digital ground
VCCD
6
digital supply voltage
DATA
7
bus data line input/output
CLOCK
8
bus clock line input
BUSMODE
9
bus mode select input
BUSENABLE
10
bus enable input
SWPORT1
11
software programmable port 1
SWPORT2
12
software programmable port 2
XTAL1
13
crystal oscillator input 1
XTAL2
14
crystal oscillator input 2
PHASEFIL
15
phase detector loop filter
PILFIL
16
pilot detector low-pass filter
VAFL
17
left audio frequency output voltage
VAFR
18
right audio frequency output voltage
TMUTE
19
time constant for soft mute
MPXO
20
FM demodulator MPX signal output
Vref
21
reference voltage
TIFC
22
time constant for IF centre adjust
LIMDEC1
23
decoupling IF limiter 1
LIMDEC2
24
decoupling IF limiter 2
Igain
25
gain control current for IF filter
AGND
26
analog ground
VCCA
27
analog supply voltage
RFI1
28
RF input 1
RFGND
29
RF ground
RFI2
30
RF input 2
TAGC
31
time constant RF AGC
LOOPSW
32
switch output of synthesizer PLL loop filter
2004 Sep 13
6
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
25 Igain
26 AGND
27 VCCA
28 RFI1
29 RFGND
30 RFI2
31 TAGC
32 LOOPSW
TEA5768HL
CPOUT
1
24 LIMDEC2
VCOTANK1
2
23 LIMDEC1
VCOTANK2
3
22 TIFC
VCC(VCO)
4
DGND
5
VCCD
6
19 TMUTE
DATA
7
18 VAFR
CLOCK
8
17 VAFL
21 Vref
PILFIL 16
20 MPXO
PHASEFIL 15
XTAL2 14
XTAL1 13
SWPORT2 12
SWPORT1 11
9
BUSMODE
BUSENABLE 10
TEA5768HL
001aab494
Fig.2 Pin configuration.
7
7.1
FUNCTIONAL DESCRIPTION
The PLL synthesizer can be clocked externally with a
32.768 kHz, a 6.5 MHz or a 13 MHz signal via pin XTAL2.
Low-noise RF amplifier
The crystal oscillator generates the reference frequency
for:
The LNA input impedance together with the LC RF input
circuit defines an FM band filter. The gain of the LNA is
controlled by the RF AGC circuit.
• The reference frequency divider for the synthesizer PLL
• The timing for the IF counter
7.2
FM mixer
• The free-running frequency adjustment of the stereo
decoder VCO
The FM quadrature mixer converts the FM RF
(76 MHz to 108 MHz) to an IF of 225 kHz.
7.3
• The centre frequency adjustment of the IF filters.
VCO
7.5
The varactor tuned LC VCO provides the Local Oscillator
(LO) signal for the FM quadrature mixer. The VCO
frequency range is 150 MHz to 217 MHz.
7.4
The PLL synthesizer tuning system is suitable to operate
with a 32.768 kHz or a 13 MHz reference frequency
generated by the crystal oscillator or applied to the IC from
an external source. The synthesizer can also be clocked
via pin XTAL2 at 6.5 MHz. The PLL tuning system can
perform an autonomous search tuning function.
Crystal oscillator
The crystal oscillator can operate with a 32.768 kHz clock
crystal or a 13 MHz crystal. The temperature drift of
standard 32.768 kHz clock crystals limits the operational
temperature range from −10 °C to +60 °C.
2004 Sep 13
PLL tuning system
7.6
RF AGC
The RF AGC prevents overloading and limits the amount
of intermodulation products created by strong adjacent
channels.
7
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
7.7
TEA5768HL
IF filter
8
I2C-BUS AND BUS-CONTROLLED FUNCTIONS
Fully integrated IF filter.
8.1
7.8
Information about the I2C-bus can be found in the brochure
“The I2C-bus and how to use it” (order number
9398 393 40011).
FM demodulator
The FM quadrature demodulator has an integrated
resonator to perform the phase shift of the IF signal.
7.9
I2C-bus specification
The standard I2C-bus specification is expanded by the
following definitions.
Level voltage generator and analog-to-digital
converter
IC address C0: 1100000.
The FM IF analog level voltage is converted to 4 bits digital
data and output via the I2C-bus.
Structure of the I2C-bus logic: slave transceiver.
7.10
The maximum LOW-level input and the minimum
HIGH-level input are specified to 0.2VCCD and 0.45VCCD
respectively.
The IF counter outputs a 7-bit count result via the
7.11
Subaddresses are not used.
IF counter
I2C-bus.
Soft mute
The pin BUSMODE must be connected to ground.
The low-pass filtered level voltage drives the soft mute
attenuator at low RF input levels. The soft mute function
can be switched off via the I2C-bus.
7.12
Before any READ or WRITE operation the pin
BUSENABLE has to be HIGH for at least 10 µs.
Note: The bus operates at a maximum clock frequency of
400 kHz. It is not allowed to connect the IC to a bus
operating at a higher clock rate.
MPX decoder
The PLL stereo decoder is adjustment-free. The stereo
decoder can be switched to mono via the I2C-bus.
7.13
8.1.1
Data sequence: address, byte 1, byte 2, byte 3, byte 4 and
byte 5 (the data transfer has to be in this order). The
LSB = 0 of the address indicates a WRITE operation to the
TEA5768HL.
Signal dependent mono to stereo blend
With a decreasing RF input level the MPX decoder blends
from stereo to mono to limit the output noise. The
continuous mono to stereo blend can also be programmed
via the I2C-bus to an RF level depending switched mono to
stereo transition. Stereo Noise Cancelling (SNC) can be
switched off via the I2C-bus.
7.14
DATA TRANSFER
Bit 7 of each byte is considered as the MSB and has to be
transferred as the first bit of the byte.
The data becomes valid bitwise at the appropriate falling
edge of the clock. A STOP condition after any byte can
shorten transmission times.
Signal dependent AF response
The audio bandwidth will be reduced with a decreasing RF
input level. This function can be switched off via the
I2C-bus.
When writing to the transceiver by using the STOP
condition before completion of the whole transfer:
7.15
• If the transfer of a byte is not completed, the new bits will
be used, but a new tuning cycle will not be started.
• The remaining bytes will contain the old information
Software programmable ports
Two software programmable ports (open-collector) can be
addressed via the I2C-bus.
The IC can be switched into a low current standby mode
with the standby bit; the bus is then still active. The
standby current can be reduced by deactivating the bus
interface (pin BUSENABLE LOW). If the bus interface is
deactivated (pin BUSENABLE LOW) without the standby
mode being programmed, the IC maintains normal
operation, but is isolated from the bus lines.
The port 1 (pin SWPORT1) function can be changed with
write data byte 4 bit 0 (see Table 13). Pin SWPORT1 is
then output for the ready flag of read byte 1.
2004 Sep 13
8
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
The software programmable output (SWPORT1) can be
programmed to operate as a tuning indicator output.
As long as the IC has not completed a tuning action,
pin SWPORT1 remains LOW. The pin becomes HIGH,
when a preset or search tuning is completed or when a
band limit is reached.
8.1.2
POWER-ON RESET
At Power-on reset the mute is set, all other bits are set to
LOW. To initialize the IC all bytes have to be transferred.
The reference frequency divider of the synthesizer PLL is
changed when the MSB in byte 5 is set to logic 1. The
tuning system can then be clocked via pin XTAL2 at
6.5 MHz.
I2C-bus protocol
8.2
Table 1
Write mode
S(1)
address (write)
A(2)
address (read)
A(2)
data byte(s)
A(2)
P(3)
Notes
1. S = START condition.
2. A = acknowledge.
3. P = STOP condition.
Table 2
Read mode
S(1)
data byte 1
Notes
1. S = START condition.
2. A = acknowledge.
Table 3
IC address byte
IC ADDRESS
1
1
0
0
0
Note
1. Read or write mode:
a) 0 = write operation to the TEA5768HL
b) 1 = read operation from the TEA5768HL.
2004 Sep 13
MODE
9
0
0
R/W(1)
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
8.3
TEA5768HL
Writing data
Table 4
Write mode
DATA BYTE 1
Table 5
DATA BYTE 2
DATA BYTE 3
DATA BYTE 4
DATA BYTE 5
Format of 1st data byte
BIT 7 (MSB)
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0 (LSB)
MUTE
SM
PLL13
PLL12
PLL11
PLL10
PLL9
PLL8
Table 6
Description of 1st data byte bits
BIT
SYMBOL
7
MUTE
6
SM
5 to 0
PLL[13:8]
Table 7
DESCRIPTION
if MUTE = 1 then L and R audio are muted; if MUTE = 0 then L and R audio are not
muted
Search Mode: if SM = 1 then in search mode; if SM = 0 then not in search mode
setting of synthesizer programmable counter for search or preset
Format of 2nd data byte
BIT 7 (MSB)
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0 (LSB)
PLL7
PLL6
PLL5
PLL4
PLL3
PLL2
PLL1
PLL0
Table 8
Description of 2nd data byte bits
BIT
SYMBOL
7 to 0
PLL[7:0]
Table 9
DESCRIPTION
setting of synthesizer programmable counter for search or preset
Format of 3rd data byte
BIT 7 (MSB)
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0 (LSB)
SUD
SSL1
SSL0
HLSI
MS
MR
ML
SWP1
Table 10 Description of 3rd data byte bits
BIT
SYMBOL
7
SUD
6 and 5
SSL[1:0]
4
HLSI
3
MS
Mono to Stereo: if MS = 1 then forced mono; if MS = 0 then stereo ON
2
MR
Mute Right: if MR = 1 then the right audio channel is muted and forced mono; if MR = 0
then the right audio channel is not muted
1
ML
Mute Left: if ML = 1 then the left audio channel is muted and forced mono; if ML = 0
then the left audio channel is not muted
0
SWP1
Software programmable port 1: if SWP1 = 1 then port 1 is HIGH; if SWP1 = 0 then
port 1 is LOW
2004 Sep 13
DESCRIPTION
Search Up/Down: if SUD = 1 then search up; if SUD = 0 then search down
Search Stop Level: see Table 11
HIGH/LOW Side Injection: if HLSI = 1 then HIGH side LO injection; if HLSI = 0 then
LOW side LO injection
10
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
Table 11 Search stop level setting
SSL1
SSL0
SEARCH STOP LEVEL
0
0
not allowed in search mode
0
1
low; level ADC output = 5
1
0
mid; level ADC output = 7
1
1
high; level ADC output = 10
Table 12 Format of 4th data byte
BIT 7 (MSB)
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0 (LSB)
SWP2
STBY
BL
XTAL
SMUTE
HCC
SNC
SI
Table 13 Description of 4th data byte bits
BIT
SYMBOL
DESCRIPTION
7
SWP2
Software programmable port 2: if SWP2 = 1 then port 2 is HIGH; if SWP2 = 0 then
port 2 is LOW
6
STBY
Standby: if STBY = 1 then in standby mode; if STBY = 0 then not in standby mode
5
BL
Band Limits: if BL = 1 then Japanese FM band; if BL = 0 then US/Europe FM band
4
XTAL
3
SMUTE
2
HCC
High Cut Control: if HCC = 1 then high cut control is ON; if HCC = 0 then high cut
control is OFF
1
SNC
Stereo Noise Cancelling: if SNC = 1 then stereo noise cancelling is ON; if SNC = 0
then stereo noise cancelling is OFF
0
SI
if XTAL = 1 then fxtal = 32.768 kHz; if XTAL = 0 then fxtal = 13 MHz
Soft MUTE: if SMUTE = 1 then soft mute is ON; if SMUTE = 0 then soft mute is OFF
Search Indicator: if SI = 1 then pin SWPORT1 is output for the ready flag; if SI = 0 then
pin SWPORT1 is software programmable port 1
Table 14 Format of 5th data byte
BIT 7 (MSB)
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0 (LSB)
PLLREF
DTC
−
−
−
−
−
−
Table 15 Description of 5th data byte bits
BIT
SYMBOL
7
PLLREF
if PLLREF = 1 then the 6.5 MHz reference frequency for the PLL is enabled;
if PLLREF = 0 then the 6.5 MHz reference frequency for the PLL is disabled
6
DTC
if DTC = 1 then the de-emphasis time constant is 75 µs; if DTC = 0 then the
de-emphasis time constant is 50 µs
5 to 0
−
2004 Sep 13
DESCRIPTION
not used; position is don’t care
11
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
8.4
TEA5768HL
Reading data
Table 16 Read mode
DATA BYTE 1
DATA BYTE 2
DATA BYTE 3
DATA BYTE 4
DATA BYTE 5
Table 17 Format of 1st data byte
BIT 7 (MSB)
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0 (LSB)
RF
BLF
PLL13
PLL12
PLL11
PLL10
PLL9
PLL8
Table 18 Description of 1st data byte bits
BIT
SYMBOL
DESCRIPTION
7
RF
Ready Flag: if RF = 1 then a station has been found or the band limit has been
reached; if RF = 0 then no station has been found
6
BLF
Band Limit Flag: if BLF = 1 then the band limit has been reached; if BLF = 0 then the
band limit has not been reached
5 to 0
PLL[13:8]
setting of synthesizer programmable counter after search or preset
Table 19 Format of 2nd data byte
BIT 7 (MSB)
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0 (LSB)
PLL7
PLL6
PLL5
PLL4
PLL3
PLL2
PLL1
PLL0
Table 20 Description of 2nd data byte bits
BIT
SYMBOL
7 to 0
PLL[7:0]
DESCRIPTION
setting of synthesizer programmable counter after search or preset
Table 21 Format of 3rd data byte
BIT 7 (MSB)
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0 (LSB)
STEREO
IF6
IF5
IF4
IF3
IF2
IF1
IF0
Table 22 Description of 3rd data byte bits
BIT
SYMBOL
7
STEREO
Stereo indication: if STEREO = 1 then stereo reception; if STEREO = 0 then mono
reception
6 to 0
PLL[13:8]
IF counter result
2004 Sep 13
DESCRIPTION
12
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
Table 23 Format of 4th data byte
BIT 7 (MSB)
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0 (LSB)
LEV3
LEV2
LEV1
LEV0
CI3
CI2
CI1
0
Table 24 Description of 4th data byte bits
BIT
SYMBOL
7 to 4
LEV[3:0]
3 to 1
CI[3:1]
0
−
DESCRIPTION
level ADC output
Chip Identification: these bits have to be set to logic 0
this bit is internally set to logic 0
Table 25 Format of 5th data byte
BIT 7 (MSB)
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0 (LSB)
0
0
0
0
0
0
0
0
Table 26 Description of 5th data byte bits
BIT
SYMBOL
7 to 0
−
8.5
DESCRIPTION
reserved for future extensions; these bits are internally set to logic 0
Bus timing
Table 27 Digital levels and timing
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Digital inputs
VIH
HIGH-level input voltage
0.45VCCD
−
V
VIL
LOW-level input voltage
−
0.2VCCD
V
500
−
µA
−
450
mV
Digital outputs
Isink(L)
LOW-level sink current
VOL
LOW-level output voltage
IOL = 500 µA
Timing (I2C-bus enabled)
fclk
clock input frequency
−
400
kHz
tHIGH
clock HIGH time
1
−
µs
tLOW
clock LOW time
1
−
µs
2004 Sep 13
13
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
9 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VVCOTANK1
VCO tuned circuit output voltage 1
−0.3
+8
V
VVCOTANK2
VCO tuned circuit output voltage 2
−0.3
+8
V
VCCD
digital supply voltage
−0.3
+5
V
VCCA
analog supply voltage
−0.3
+8
V
Tstg
storage temperature
−55
+150
°C
Tamb
ambient temperature
−10
+75
°C
Ves
electrostatic handling voltage
note 1
−200
+200
V
note 2
−2000
+2000
V
note 1
−150
+200
V
note 2
−2000
+2000
V
for all pins except pin DATA
for pin DATA
Notes
1. Machine model (R = 0 Ω, C = 200 pF).
2. Human body model (R = 1.5 kΩ, C = 100 pF).
10 THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
2004 Sep 13
PARAMETER
CONDITIONS
thermal resistance from junction to ambient in free air
14
VALUE
UNIT
80
K/W
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
11 DC CHARACTERISTICS
VCCA = VVCOTANK1 = VVCOTANK2 = VCCD = 2.7 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply voltages; note 1
VCCA
analog supply voltage
2.5
3.0
5.0
V
VCC(VCO)
voltage controlled
oscillator supply voltage
2.5
3.0
5.0
V
VCCD
digital supply voltage
2.5
3.0
5.0
V
VCCA = 3 V
6.0
8.4
10.5
mA
VCCA = 5 V
6.2
8.6
10.7
mA
VCCA = 3 V
−
3
6
µA
VCCA = 5 V
−
3.2
6.2
µA
VVCOTANK1 = VVCOTANK2 = 3 V 560
750
940
µA
VVCOTANK1 = VVCOTANK2 = 5 V 570
760
950
µA
VVCOTANK1 = VVCOTANK2 = 3 V −
1
2
µA
VVCOTANK1 = VVCOTANK2 = 5 V −
1.2
2.2
µA
Supply currents
ICCA
analog supply current
operating
standby mode
ICC(VCO)
voltage controlled
oscillator supply current
operating
standby mode
ICCD
digital supply current
operating
VCCD = 3 V
2.1
3.0
3.9
mA
VCCD = 5 V
2.25
3.15
4.05
mA
bus enable line HIGH
30
56
80
µA
bus enable line LOW
11
19
26
µA
bus enable line HIGH
50
78
105
µA
bus enable line LOW
20
33
45
µA
standby mode; VCCD = 3 V
standby mode; VCCD = 5 V
2004 Sep 13
15
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
SYMBOL
PARAMETER
TEA5768HL
CONDITIONS
MIN.
TYP.
MAX.
UNIT
DC operating points
VCPOUT
VXTAL1
VXTAL2
0.1
−
VCC(VCO) − 0.1 V
data byte 4 bit 4 = 1
1.64
1.72
1.8
V
data byte 4 bit 4 = 0
1.68
1.75
1.82
V
data byte 4 bit 4 = 1
1.64
1.72
1.8
V
data byte 4 bit 4 = 0
1.68
1.75
1.82
V
0.4
1.2
VCCA − 0.4
V
unloaded DC voltage
VPHASEFIL
VPILFIL
0.65
0.9
1.3
V
VVAFL
fRF = 98 MHz; VRF = 1 mV
720
850
940
mV
VVAFR
fRF = 98 MHz; VRF = 1 mV
720
850
940
mV
VTMUTE
VRF = 0 V
1.5
1.65
1.8
V
VMPXO
fRF = 98 MHz; VRF = 1 mV
680
815
950
mV
VVref
1.45
1.55
1.65
V
VTIFC
1.34
1.44
1.54
V
VLIMDEC1
1.86
1.98
2.1
V
VLIMDEC2
1.86
1.98
2.1
V
VIgain
480
530
580
mV
VRFI1
0.93
1.03
1.13
V
VRFI2
0.93
1.03
1.13
V
1
1.57
2
V
VTAGC
VRF = 0 V
Note
1. VCCA, VCC(VCO) and VCCD must not differ more than 200 mV.
2004 Sep 13
16
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
12 AC CHARACTERISTICS
VCCA = VVCOTANK1 = VVCOTANK2 = VCCD = 2.7 V; Tamb = 25 °C; measured in the circuit of Fig.5; all AC values are given
in RMS; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Voltage controlled oscillator
fosc
150
−
217
MHz
140
−
350
mV
data byte 4 bit 4 = 0
2
3
4
kΩ
data byte 4 bit 4 = 1
230
330
430
kΩ
data byte 4 bit 4 = 0
3.9
5.6
7.3
pF
data byte 4 bit 4 = 1
5
6
7
pF
oscillator frequency
Crystal oscillator
CIRCUIT INPUT: PIN XTAL2
Vi(osc)
oscillator input voltage
oscillator externally clocked
Ri
input resistance
oscillator externally clocked
Ci
input capacitance
oscillator externally clocked
CRYSTAL: 32.768 kHz
fr
series resonance frequency data byte 4 bit 4 = 1
−
∆f/fr
frequency deviation
−20 ×
C0
shunt capacitance
−
RS
series resistance
−
∆fr/fr(25 °C)
temperature drift
−10 °C < Tamb < +60 °C
−50 ×
32.768 −
10−6
10−6
−
+20 ×
−
3.5
−
80
−
+50 ×
13
−
kHz
10−6
pF
kΩ
10−6
CRYSTAL: 13 MHz
fr
series resonance frequency data byte 4 bit 4 = 0
−
10−6
MHz
10−6
∆f/fr
frequency deviation
−30 ×
−
+30 ×
C0
shunt capacitance
−
−
4.5
pF
Cmot
motional capacitance
1.5
−
3.0
fF
RS
series resistance
−
−
100
Ω
∆fr/fr(25 °C)
temperature drift
−40 °C < Tamb < +85 °C
−30 × 10−6 −
+30 × 10−6
data byte 1 = XX111111;
data byte 2 = 11111110
−
−
8191
data byte 1 = XX010000;
data byte 2 = 00000000
2048
−
−
−
1
−
data byte 4 bit 4 = 0
−
260
−
data byte 5 bit 7 = 1;
data byte 4 bit 4 = 0
−
130
−
data byte 4 bit 4 = 1
−
1
−
Synthesizer
PROGRAMMABLE DIVIDER; note 1
Nprog
∆Nstep
programmable divider ratio
programmable divider step
size
REFERENCE FREQUENCY DIVIDER
Nref
2004 Sep 13
crystal oscillator divider
ratio
17
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
SYMBOL
PARAMETER
TEA5768HL
CONDITIONS
MIN.
TYP.
MAX.
UNIT
CHARGE PUMP: PIN CPOUT
Isink
charge pump peak sink
current
0.2 V < VCPOUT
< VVCOTANK2 − 0.2 V;
fVCO > fref × Nprog
−
0.5
−
µA
Isource
charge pump peak source
current
0.2 V < VCPOUT
< VVCOTANK2 − 0.2 V;
fVCO < fref × Nprog
−
−0.5
−
µA
IF counter
VRF
RF input voltage for correct
IF count
−
12
18
µV
NIF
IF counter length
−
7
−
bit
Nprecount
IF counter prescaler ratio
−
Tcount(IF)
IF counter period
REScount(IF) IF counter resolution
IFcount
IF counter result for search
tuning stop
−
64
fxtal = 32.768 kHz
−
15.625 −
ms
fxtal = 13 MHz
−
15.754 −
ms
fxtal = 32.768 kHz
−
4.096
−
kHz
fxtal = 13 MHz
−
4.0625 −
kHz
fxtal = 32.768 kHz
31
−
3E
HEX
fxtal = 13 MHz
32
−
3D
HEX
10
−
−
MΩ
Pins DATA, CLOCK, BUSMODE and BUSENABLE
Ri
input resistance
Software programmable ports
PIN SWPORT1
Isink(max)
maximum sink current
data byte 3 bit 0 = 0;
data byte 4 bit 0 = 0;
VSWPORT1 < 0.5 V
500
−
−
µA
Ileak(max)
maximum leakage current
data byte 3 bit 0 = 1;
VSWPORT1 < 5 V
−1
−
+1
µA
PIN SWPORT2
Isink(max)
maximum sink current
data byte 4 bit 7 = 0;
VSWPORT1 < 0.5 V
500
−
−
µA
Ileak(max)
maximum leakage current
data byte 4 bit 7 = 1;
VSWPORT1 < 5 V
−1
−
+1
µA
FM signal channel
FM RF INPUT
Ri
input resistance at pins
RFI1 and RFI2 to RFGND
75
100
125
Ω
Ci
input capacitance at pins
RFI1 and RFI2 to RFGND
2.5
4
6
pF
2004 Sep 13
18
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
SYMBOL
PARAMETER
TEA5768HL
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VRF
RF sensitivity input voltage
fRF = 76 MHz to 108 MHz;
∆f = 22.5 kHz; fmod = 1 kHz;
(S+N)/N = 26 dB;
de-emphasis = 75 µs;
BAF = 300 Hz to 15 kHz
−
2
3.5
µV
IP3in
in-band 3rd-order intercept
point related to VRFI1-RFI2
(peak value)
∆f1 = 200 kHz; ∆f2 = 400 kHz;
ftune = 76 MHz to 108 MHz
81
84
−
dBµV
IP3out
out-band 3rd-order
intercept point related to
VRFI1-RFI2 (peak value)
∆f1 = 4 MHz; ∆f2 = 8 Hz;
ftune = 76 MHz to 108 MHz
82
85
−
dBµV
RF input voltage for start of
AGC
fRF1 = 93 MHz; fRF2 = 98 MHz;
VRF2 = 50 dBµV;
66
72
78
dBµV
RF AGC
VRF1
∆V TMUTE
14 mV
- ; note 2
----------------------- < ------------------3 dBµV
V RF1
IF filter
fIF
IF filter centre frequency
215
225
235
kHz
BIF
IF filter bandwidth
85
94
102
kHz
S+200
HIGH side 200 kHz
selectivity
∆f = +200 kHz;
ftune = 76 MHz to 108 MHz;
note 3
39
43
−
dB
S−200
LOW side 200 kHz
selectivity
∆f = −200 kHz;
ftune = 76 MHz to 108 MHz;
note 3
32
36
−
dB
S+100
HIGH side 100 kHz
selectivity
∆f = +100 kHz;
ftune = 76 MHz to 108 MHz;
note 3
8
12
−
dB
S−100
LOW side 100 kHz
selectivity
∆f = −100 kHz;
ftune = 76 MHz to 108 MHz;
note 3
8
12
−
dB
IR
image rejection
ftune = 76 MHz to 108 MHz;
VRF = 50 dBµV
24
30
−
dB
read mode data byte 4 bit 4 = 1 2
3
5
µV
2
3
5
dB
VRF = 0 µV
1.55
1.65
1.80
V
VRF = 3 µV
1.60
1.70
1.85
V
VRF = 10 µV to 500 µV
150
165
180
mV
--------------20 dB
280
400
520
kΩ
FM IF level detector and mute voltage
VRF
RF input voltage for start of
level ADC
∆Vstep
level ADC step size
PIN TMUTE
Vlevel
level output DC voltage
Vlevel(slope)
slope of level voltage
Ro
output resistance
2004 Sep 13
19
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
SYMBOL
PARAMETER
TEA5768HL
CONDITIONS
MIN.
TYP.
MAX.
UNIT
FM demodulator: pin MPXO
VMPXO
demodulator output voltage
VRF = 1 mV; L = R;
∆f = 22.5 kHz; fmod = 1 kHz;
de-emphasis = 75 µs;
BAF = 300 Hz to 15 kHz
60
75
90
mV
(S+N)/N
maximum signal plus
noise-to-noise ratio
VRF = 1 mV; L = R;
∆f = 22.5 kHz; fmod = 1 kHz;
de-emphasis = 75 µs;
BAF = 300 Hz to 15 kHz
54
60
−
dB
THD
total harmonic distortion
VRF = 1 mV; L = R; ∆f = 75 kHz; −
fmod = 1 kHz;
de-emphasis = 75 µs
0.5
1.5
%
αAM
AM suppression
VRF = 300 µV; L = R;
∆f = 22.5 kHz; fmod = 1 kHz;
m = 0.3; de-emphasis = 75 µs;
BAF = 300 Hz to 15 kHz
40
−
−
dB
Ro
demodulator output
resistance
−
−
500
Ω
Isink
demodulator output sink
current
−
−
30
µA
Soft mute
VRF
RF input voltage for soft
mute start
αmute = 3 dB; data byte 4
bit 3 = 1
3
5
10
µV
αmute
mute attenuation
VRF = 1 µV; L = R;
∆f = 22.5 kHz; fmod = 1 kHz
de-emphasis = 75 µs;
BAF = 300 Hz to 15 kHz;
data byte 4 bit 3 = 1
10
20
30
dB
VRF = 1 mV; L = R;
∆f = 22.5 kHz; fmod = 1 kHz;
de-emphasis = 75 µs
60
75
90
mV
MPX decoder
VAFL; VAFR
left and right audio
frequency output voltage
RAFL; RAFR
left and right audio
frequency output resistance
−
−
50
Ω
Isink(AFL);
Isink(AFR)
left and right audio
frequency output sink
current
170
−
−
µA
4
−
−
dB
VMPXIN(max) input overdrive margin
THD < 3 %
VAFL/VAFR
left and right audio
frequency output voltage
difference
VRF = 1 mV; L = R; ∆f = 75 kHz; −1
fmod = 1 kHz;
de-emphasis = 75 µs
−
+1
dB
αcs(stereo)
stereo channel separation
VRF = 1 mV; R = L = 0 or R = 0
and L = 1 including 9 % pilot;
∆f = 75 kHz; fmod = 1 kHz;
data byte 3 bit 3 = 0;
data byte 4 bit 1 = 1
30
−
dB
2004 Sep 13
20
24
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
SYMBOL
PARAMETER
TEA5768HL
CONDITIONS
MIN.
UNIT
−
dB
0.4
1
%
40
50
−
dB
bit 7 = 1
−
3.6
5.8
kHz
bit 7 = 0
1
3
−
kHz
VRF = 1 mV
2
−
−
dB
data byte 5 bit 6 = 0
38
50
62
µs
data byte 5 bit 6 = 1
57
75
93
µs
data byte 5 bit 6 = 0
114
150
186
µs
data byte 5 bit 6 = 1
171
225
279
µs
VRF = 45 µV; R = L = 0 or R = 0 4
and L = 1 including 9 % pilot;
∆f = 75 kHz; fmod = 1 kHz;
data byte 3 bit 3 = 0;
data byte 4 bit 1 = 1
10
16
dB
−
−
dB
−
1
dB
maximum signal plus
noise-to-noise ratio
VRF = 1 mV; L = R;
∆f = 22.5 kHz; fmod = 1 kHz;
de-emphasis = 75 µs;
BAF = 300 Hz to 15 kHz
THD
total harmonic distortion
VRF = 1 mV; L = R; ∆f = 75 kHz; −
fmod = 1 kHz;
de-emphasis = 75 µs
αpilot
pilot suppression measured related to ∆f = 75 kHz;
at pins VAFL and VAFR
fmod = 1 kHz;
de-emphasis = 75 µs
∆fpilot
stereo pilot frequency
deviation
pilot switch hysteresis
MAX.
60
(S+N)/N
∆f pilot1
---------------∆f pilot2
TYP.
54
VRF = 1 mV; read mode;
data byte 3
HIGH CUT CONTROL
TCde-em
de-emphasis time constant
VRF = 1 mV
VRF = 1 µV
MONO TO STEREO BLEND CONTROL
αcs(stereo)
stereo channel separation
MONO TO STEREO SWITCHED
αcs(stereo)
stereo channel separation
switching from mono to
stereo with increasing RF
input level
VRF = 1 mV; R = L = 0 or R = 0
and L = 1 including 9 % pilot;
∆f = 75 kHz; fmod = 1 kHz;
data byte 3 bit 3 = 0;
data byte 4 bit 1 = 0
αcs(stereo)
stereo channel separation
switching from stereo to
mono with decreasing RF
input level
VRF = 20 µV; R = L = 0 or R = 0 −
and L = 1 including 9 % pilot;
∆f = 75 kHz; fmod = 1 kHz;
data byte 3 bit 3 = 0;
data byte 4 bit 1 = 0
2004 Sep 13
21
24
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
SYMBOL
PARAMETER
TEA5768HL
CONDITIONS
MIN.
TYP.
MAX.
UNIT
BUS-DRIVEN MUTE FUNCTIONS
Tuning mute
αmute
VAFL and VAFR muting depth data byte 1 bit 7 = 1
−
−
−60
dB
αmute(L)
VAFL muting depth
data byte 3 bit 1 = 1;
fAF = 1 kHz; Rload(L) < 30 kΩ
−
−
−80
dB
αmute(R)
VAFR muting depth
data byte 3 bit 2 = 1;
fAF = 1 kHz; Rload(R) < 30 kΩ
−
−
−80
dB
Notes
1. Calculation of this 14-bit word can be done as follows:
4 × ( f RF – f IF )
4 × ( f RF + f IF )
formula for HIGH side injection: N = --------------------------------- ; formula for LOW side injection: N = ---------------------------------f ref
f ref
where:
N = decimal value of PLL word
fRF = the wanted tuning frequency [Hz]
fIF = the intermediate frequency [Hz] = 225 kHz
fref = the reference frequency [Hz] = 32.768 kHz for the 32.768 kHz crystal; fref = 50 kHz for the 13 MHz crystal or
when externally clocked with 6.5 MHz.
6
3
4 × ( 100 ×10 + 225 ×10 )
Example for receiving a channel at 100 MHz with HIGH side injection: N = ------------------------------------------------------------------ = 12234 .
32768
The PLL word becomes 2FCAH.
2. VRF in Fig.5 is replaced by VRF1 + VRF2. The radio is tuned to 98 MHz (HIGH side injection).
3. LOW side and HIGH side selectivity can be switched by changing the mixer from HIGH side to LOW side LO injection.
2004 Sep 13
22
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
MHC247
10
THD
(%)
4.0
handbook, full pagewidth
VAFL, VAFR
(dB)
0
−10
(1)
(2)
(3)
3.5
−20
3.0
−30
2.5
−40
(4)
2.0
(5)
−50
1.5
−60
1.0
−70
−80
10−3
(1)
(2)
(3)
(4)
(5)
(6)
0.5
(6)
10−2
10−1
1
Mono signal; soft mute on.
Left channel with modulation left; SNC on.
Right channel with modulation left; SNC on.
Noise in mono mode; soft mute on.
Noise in stereo mode; SNC on.
Total harmonic distortion; ∆f = 75 kHz; L = R; fmod = 1 kHz.
Fig.3 FM characteristics 1.
2004 Sep 13
23
10
102
VRF (mV)
0
103
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
MHC309
10
VTMUTE
(V)
2.2
handbook, full pagewidth
VAFL, VAFR
(dB)
0
(1)
−10
−20
2.1
2.0
(2)
−30
1.9
−40
1.8
−50
(3)
1.7
−60
1.6
−70
1.5
−80
10−3
10−2
10−1
1
(1) Mono signal; no soft mute.
(2) Noise in mono mode; no soft mute.
(3) Level voltage; VCCA = 2.7 V.
Fig.4 FM characteristics 2.
2004 Sep 13
24
10
102
VRF (mV)
1.4
103
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
13 INTERNAL PIN CONFIGURATION
PIN
1
SYMBOL
EQUIVALENT CIRCUIT
CPOUT
270 Ω
1
2
VCOTANK1
3
VCOTANK2
MHC251
2
3
120 Ω
120 Ω
MHC252
4
VCC(VCO)
5
DGND
6
VCCD
7
DATA
7
5
8
MHC253
CLOCK
270 Ω
8
2004 Sep 13
25
5
MHC254
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
PIN
9
TEA5768HL
SYMBOL
EQUIVALENT CIRCUIT
BUSMODE
270 Ω
10
9
5
10
5
MHC255
BUSENABLE
150 Ω
11
SWPORT1
150 Ω
5
12
SWPORT2
13
XTAL1
14
XTAL2
11
MHC257
150 Ω
5
MHC256
12
MHC258
13
14
MHC259
15
PHASEFIL
15
26
2004 Sep 13
26
MHC260
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
PIN
16
TEA5768HL
SYMBOL
EQUIVALENT CIRCUIT
PILFIL
270 Ω
26
17
16
MHC261
VAFL
10 Ω
17
26
18
MHC262
VAFR
10 Ω
18
26
19
TMUTE
MHC263
19
1 kΩ
26
20
MHC264
MPXO
150 Ω
26
2004 Sep 13
27
20
MHC265
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
PIN
21
TEA5768HL
SYMBOL
EQUIVALENT CIRCUIT
Vref
21
26
MHC266
22
TIFC
40 kΩ
22
MHC267
23
LIMDEC1
270 Ω
23
MHC268
24
LIMDEC2
270 Ω
24
MHC269
25
Igain
25
MHC270
26
AGND
27
VCCA
2004 Sep 13
28
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
PIN
TEA5768HL
SYMBOL
28
RFI1
29
RFGND
30
RFI2
EQUIVALENT CIRCUIT
28
30
MHC271
29
31
TAGC
31
29
32
LOOPSW
MHC272
4
32
MHC273
14 APPLICATION INFORMATION
Table 28 Component list for Figs 1 and 5
COMPONENT
PARAMETER
VALUE TOLERANCE
TYPE
MANUFACTURER
R1
resistor with low temperature coefficient
18 kΩ
±1 %
RC12G
Philips
D1 and D2
varicap for VCO tuning
−
−
BB202
Philips
L1
RF band filter coil
120 nH ±2 %
Qmin = 40
L2 and L3
VCO coil
33 nH
±2 %
Qmin = 40
XTAL13
13 MHz crystal
−
−
NX4025GA
Cpull
pulling capacitor for NX4025GA
10 pF
−
XTAL32.768
32.768 kHz crystal
−
−
2004 Sep 13
29
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24
47 nF
33 nF
33 nF
LIMDEC1
TIFC
Vref
MPXO
TMUTE
VAFR
VAFL
23
22
21
20
19
18
17
Igain 25
R1
GAIN
STABILIZATION
POWER
SUPPLY
AGND 26
22 nF
VCCA
22 µF
27
VCCA
4.7 Ω
RESONANCE
AMPLIFIER
DEMODULATOR
SOFT
MUTE
LIMITER
SDS
I/Q-MIXER
1st FM
RFI1 28
L1
27 pF
RFGND 29
47 pF
RFI2 30
MPX
DECODER
22 nF
33 kΩ
22 nF
15
Iref
PHASEFIL
AGC
Ccomp(1)
14 XTAL2
TEA5768HL
VRF
1 nF
16 PILFIL
IF CENTRE
FREQUENCY
ADJUST
100 pF
40 Ω
IF
COUNTER
LEVEL
ADC
2
N1
TAGC 31
CRYSTAL
OSCILLATOR
13 XTAL1
Cpull(1)
30
4.7 nF
programmable divider output
LOOPSW 32
TUNING SYSTEM
MUX
reference frequency divider output
SOFTWARE
PROGRAMMABLE
PORT
Philips Semiconductors
47 nF
Low-power FM stereo radio for
handheld applications
2004 Sep 13
47 nF
LIMDEC2
32.768 kHz
or
13 MHz
12 SWPORT2 10 kΩ
11 SWPORT1
VCCA
10 kΩ
pilot
mono
VCO
1
I2C-BUS
2
3
CPOUT VCOTANK1
VCOTANK2
4
VCC(VCO)
9 BUSMODE
5
6
7
8
DGND
VCCD
DATA
CLOCK
mhc276
12 Ω
10 nF
39 nF
10 BUSENABLE
D1
D2
VCCD
22 nF
10 kΩ
L3
L2
100 kΩ
(1) Ccomp and Cpull data depends on crystal specification.
Fig.5 Test circuit.
Product specification
VCC(VCO)
TEA5768HL
22 nF
47 Ω
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
15 PACKAGE OUTLINE
LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm
SOT358-1
c
y
X
24
A
17
16
25
ZE
e
E HE
A A2 A
1
(A 3)
wM
θ
bp
Lp
pin 1 index
L
32
9
detail X
1
8
e
ZD
v M A
wM
bp
D
B
HD
v M B
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HD
HE
L
Lp
v
w
y
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.4
0.3
0.18
0.12
7.1
6.9
7.1
6.9
0.8
9.15
8.85
9.15
8.85
1
0.75
0.45
0.2
0.25
0.1
Z D (1) Z E (1)
0.9
0.5
0.9
0.5
θ
o
7
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT358 -1
136E03
MS-026
2004 Sep 13
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
03-02-25
31
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
To overcome these problems the double-wave soldering
method was specifically developed.
16 SOLDERING
16.1
Introduction to soldering surface mount
packages
If wave soldering is used the following conditions must be
observed for optimal results:
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
16.2
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 seconds and 200 seconds
depending on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 °C to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 °C or 265 °C, depending
on solder material applied, SnPb or Pb-free respectively.
• below 225 °C (SnPb process) or below 245 °C (Pb-free
process)
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
– for all BGA, HTSSON..T and SSOP..T packages
16.4
– for packages with a thickness ≥ 2.5 mm
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 seconds to 5 seconds
between 270 °C and 320 °C.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
16.3
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
2004 Sep 13
Manual soldering
32
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
16.5
TEA5768HL
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE
REFLOW(2)
BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA,
VFBGA, XSON
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN, HVSON, SMS
not suitable(4)
suitable
PLCC(5), SO, SOJ
suitable
suitable
not
recommended(5)(6)
suitable
SSOP, TSSOP, VSO, VSSOP
not
recommended(7)
suitable
CWQCCN..L(8), PMFP(9), WQCCN..L(8)
not suitable
LQFP, QFP, TQFP
not suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
9. Hot bar soldering or manual soldering is suitable for PMFP packages.
2004 Sep 13
33
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
17 DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
18 DEFINITIONS
19 DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 Sep 13
34
Philips Semiconductors
Product specification
Low-power FM stereo radio for
handheld applications
TEA5768HL
20 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2004 Sep 13
35
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected].
SCA76
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R30/03/pp36
Date of release: 2004
Sep 13
Document order number:
9397 750 13529