INTEGRATED CIRCUITS DATA SHEET TSA5522 1.4 GHz I2C-bus controlled synthesizer Product specification Supersedes data of 1995 Mar 22 File under Integrated Circuits, IC02 1996 Jan 23 Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer TSA5522 FEATURES • Complete 1.4 GHz single chip system • Three PNP band switch buffers (20 mA) • Four bus-controlled bidirectional ports (NPN open-collector outputs); only one port in 16-pin version • 33 V tuning voltage output APPLICATIONS • In-lock detector • TV tuners and front-ends • 5-step ADC • VCR tuners. • Mixer-Oscillator (M/O) band switch output • 15-bit programmable divider • Programmable reference divider ratio (512, 640 or 1024) • Programmable charge-pump current (50 or 250 µA) • Varicap drive disable • I2C-bus format – address plus 4 data bytes transmission (write mode) – address plus 1 status byte transmission (read mode) – three independent addresses • Low power and low radiation. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TSA5522M SSOP20 TSA5522T SO16 1996 Jan 23 DESCRIPTION VERSION plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 2 Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer TSA5522 QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCC1 supply voltage (+5 V) 4.5 − 5.5 V VCC2 band switch supply voltage (+12 V) VCC1 12 13.5 V ICC1 supply current − 22 30 mA ICC2 band switch supply current fRF RF input frequency Vi(RF) RF input voltage − 27 32 mA 64 − 1400 MHz fi = 80 to 150 MHz − 25 − 3 dBm fi = 150 to 1000 MHz − 28 − 3 dBm note 1 − 26 − 3 dBm fxtal crystal oscillator input frequency − 4 − MHz Io(PNP) PNP band switch buffers output current − 20 25 mA Io(NPN) NPN open-collector output current − 20 25 mA Tamb operating ambient temperature −20 − +85 °C Tstg storage temperature (IC) −40 − +150 °C fi = 1000 to 1400 MHz Note 1. One band switch buffer ON; Io = 20 mA. The ADC is available for digital AFC control. The ADC code is read during a read operation on the I2C-bus. The ADC input is combined with the port P6. In the TEST mode, this port is also used as a TEST output for fref and 1⁄ f 2 div (see Table 4). GENERAL DESCRIPTION (see Fig.1) The device is a single chip PLL frequency synthesizer designed for TV and VCR tuning systems. The circuit consists of a divide-by-eight prescaler with its own preamplifier, a 15-bit programmable divider, a crystal oscillator and its programmable reference divider and a phase/frequency detector combined with a charge-pump which drives the tuning amplifier, including 33 V output. Three high-current PNP band switch buffers are provided for band switching together with four open-collector NPN outputs (only one open-collector output on 16-pin devices). These ports can also be used as input ports [one Analog-to Digital Converter (ADC) and three general purpose I/O ports (not available on 16-pin devices)]. An output is provided to control a Philips mixer/oscillator IC in combination with the PNP buffers state. I2C-bus format Five serial bytes (including address byte) are required to address the device, select the VCO frequency, program the ports, set the charge-pump current and the reference divider ratio. The device has three independent I2C-bus addresses selected by applying a specific voltage on AS input (see Table 3). The general address C2 is always valid. Depending on the reference divider ratio (512, 640 or 1024), the phase comparator operates at 3.90625 kHz, 6.25 kHz or 7.8125 kHz with a 4 MHz crystal. The LOCK detector bit FL is set to logic 1 when the loop is locked and is read on the SDA line (status byte) during a read operation. 1996 Jan 23 3 1996 Jan 23 4 AS SDA SCL XTAL RF2 RF1 19 18 17 28 3 2 handbook, full pagewidth ADC 15-BIT PROGRAMMABLE DIVIDER 6 V CC2 7 n.c. P1 P2 8 P6 P4 P5 P7 13 16 15 14 GATE f ref f div TSA5522 BAND SWITCH T2,T1,T0 CP CHARGE PUMP T2,T1,T0 7-BIT CONTROL REGISTER RSA,RSB LOCK IN-LOCK DETECTOR DIGITAL PHASE COMPARATOR OS LOGIC AMP MLD226 4 5 1 12 11 BS VEE VCC1 V tune CP 1.4 GHz I2C-bus controlled synthesizer Fig.1 Block diagram (SSOP20). P0 10 9 PNP BUFFERS 7-BIT PORTS REGISTER 15-BIT FREQUENCY REGISTER RSB DIVIDER 512/640/1024 RSA COMPARATORS TRANSCEIVER I2 C -BUS POWER-ON RESET XTAL OSCILLATOR PRESCALER DIVIDE-BY-8 Philips Semiconductors Product specification TSA5522 BLOCK DIAGRAM Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer TSA5522 PINNING SYMBOL SO16 SSOP20 DESCRIPTION VCC1 1 1 voltage supply (+5 V) RF1 2 2 RF signal input 1 RF2 3 3 RF signal input 2 BS 4 4 band switch output to mixer/oscillator drive VEE 5 5 ground VCC2 6 6 voltage supply (+12 V) n.c. − 7 not connected P2 7 8 PNP band switch buffer output 2 P1 8 9 PNP band switch buffer output 1 P0 9 10 PNP band switch buffer output 0 CP 10 11 charge-pump output Vtune 11 12 tuning voltage output P6 12 13 NPN open-collector output/ADC input P7 − 14 NPN open-collector output/comparator input P5 − 15 NPN open-collector output/comparator input P4 − 16 NPN open-collector output/comparator input SCL 13 17 serial clock input SDA 14 18 serial data input/output AS 15 19 address selection input XTAL 16 20 crystal oscillator input handbook, halfpage V CC1 1 20 XTAL 16 XTAL RF1 2 19 AS RF1 2 15 AS RF2 3 18 SDA RF2 3 14 SDA BS 4 17 SCL 13 SCL V EE 5 V CC2 6 15 P5 n.c. 7 14 P7 handbook, halfpage V CC1 1 BS 4 TSA5522T V EE 5 12 P6 V CC2 6 11 V tune 16 P4 TSA5522M P2 7 10 CP P2 8 13 P6 P1 8 9 PO P1 9 12 V tune P0 10 MLD225 11 CP MLD230 Fig.2 Pin configuration (SO16). 1996 Jan 23 Fig.3 Pin configuration (SSOP20). 5 Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer TSA5522 byte transmitted indicates whether frequency data (first bit = 0) or control and ports data (first bit = 1) will follow. Until an I2C-bus STOP command is sent by the controller, additional data bytes can be entered without the need to re-address the device. The frequency register is loaded after the 8th clock pulse of the second divider byte (DB2), the control register is loaded after the 8th clock pulse of the control byte (CB) and the ports register is loaded after the 8th clock pulse of the ports byte (PB). FUNCTIONAL DESCRIPTION I2C-bus. The device is controlled via the two-wire For programming, there is one module address (7 bits) and the R/W bit for selecting the READ or the WRITE mode. I2C-bus mode WRITE MODE (R/W = 0); see Table 1 Data bytes can be sent to the device after the address transmission (first byte). Four data bytes are required to fully program the device. The bus transceiver has an auto-increment facility which permits the programming of the device within one single transmission (address + 4 data bytes). I2C-BUS ADDRESS SELECTION The module address contains programmable address bits (MA1 and MA0) which offer the possibility of having several synthesizers (up to 3) in one system by applying a specific voltage on the AS input. The device can also be partially programmed providing that the first data byte following the address is divider byte 1 (DB1) or control byte (CB). The bits in the data bytes are defined in Table 1. The first bit of the first data The relationship between MA1 and MA0 and the input voltage on the AS input is given in Table 3. I2C-bus data format Table 1 BYTE MSB DATA BYTE LSB COMMAND Address byte (ADB) 1 1 0 0 0 MA1 MA0 0 A Divider byte 1 (DB1) 0 N14 N13 N12 N11 N10 N9 N8 A Divider byte 2 (DB2) N7 N6 N5 N4 N3 N2 N1 N0 A 1 CP T2 T1 T0 RSA RSB OS A P7(1) P6 P5(1) P4(1) X P2 P1 P0 A Control byte (CB) Ports byte (PB) Note 1. Not available on 16-pin devices. Table 2 Description of Table 1 SYMBOL DESCRIPTION MA1, MA0 programmable address bits (see Table 3) N14 to N0 programmable divider bits N = N14 × 214 + N13 × 213 + ... + N1 × 2 + N0 CP charge-pump current; CP = 0 = 50 µA; CP = 1 = 250 µA T2 to T0 test bits (see Table 4). For normal operation T2 = 0; T1 = 0; T0 = 1 RSA, RSB reference divider ratio select bits (see Table 5) OS tuning amplifier control bit; for normal operation OS = 0 and tuning voltage is ON; when OS = 1 tuning voltage is OFF (high impedance) P2 to P0 PNP band switch buffers control bits P7 to P4 NPN open collector control bits when Pn = 0 output n is OFF; when Pn = 1 output n is ON X don’t care 1996 Jan 23 6 Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer Table 3 Address selection READ MODE; R/W = 1 (see Table 7) VOLTAGE APPLIED ON AS INPUT MA1 MA2 0 to 0.1VCC1 0 0 Always valid 0 1 0.4VCC1 to 0.6VCC1 1 0 0.9VCC1 to VCC1 1 1 Table 4 T2 T1 0 0 1 normal mode 0 1 X charge-pump is OFF 1 1 0 charge-pump is sinking current 1 1 1 charge-pump is sourcing current 1 0 0 fref is available at LOCK output 1 0 1 1⁄ f 2 div Table 5 DEVICE OPERATION is available at LOCK output RSB REFERENCE DIVIDER X 0 640 0 1 1024 1 1 512 A built-in ADC is available at pin P6. This converter can be used to apply AFC information to the microcontroller from the IF section of the television. The relationship between the bits A2 to A0 is given in Table 8. Band switch output levels P2 P1 P0 VOLTAGE ON BS OUTPUT PHILIPS M/O BAND 0 1 0 0.25 V band A 1 0 0 0.4VCC1 band B 0 0 1 0.8VCC1 band C Table 7 The bits I2, to I0 represent the status of the I/O ports P7, P5 and P4 respectively. A logic 0 indicates a LOW level and a logic 1 indicates a HIGH level (see “Characteristics”). Ratio select bits RSA Table 6 Data can be read from the device by setting the R/W bit to logic 1. After the slave address has been recognized, the device generates an acknowledge pulse and the first data byte (status byte) is transferred on the SDA line (MSB first). Data is valid on the SDA line during a HIGH level of the SCL clock signal. A second data byte can be read from the device if the microcontroller generates an acknowledge on the SDA line (master acknowledge). End of transmission will occur if no master acknowledge occurs. The device will then release the data line to allow the microcontroller to generate a STOP condition. When ports P4 to P7 are used as inputs, the corresponding bits must be logic 0 (high impedance state). The POR flag is set to logic 1 at power-on. The flag is reset when an end-of-data is detected by the device (end of a read sequence). Control of the loop is made possible with the in-lock flag (FL) which indicates when the loop is locked (FL = 1). Test bits T0 TSA5522 READ data format BYTE MSB Address byte (ADB) 1 1 0 0 0 MA1 POR(2) FL(3) I2(4) I1(4) I0(4) A2(5) Status byte (SB) DATA BYTE Notes 1. A = acknowledge. 2. POR = power-on-reset (POR = 1 at power-on). 3. FL = in-lock flag (FL = 1 when loop is locked). 4. I2 to I0 = digital levels for I/O ports P7, P5 and P4 respectively. 5. A2 to A0 = digital outputs of the 5-level ADC. 1996 Jan 23 7 LSB COMMAND MA0 1 A(1) A1(5) A0(5) − Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer Table 8 TSA5522 ADC levels VOLTAGE APPLIED ON PORT P6(1) A2 A1 A0 0.6VCC1 to 13.5V 1 0 0 0.45VCC1 to 0.6VCC1 0 1 1 0.3VCC1 to 0.45VCC1 0 1 0 0.15VCC1 to 0.3VCC1 0 0 1 0 to 0.15VCC1 0 0 0 Note 1. Accuracy is 0.02VCC1. LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER MIN. MAX UNIT VCC1 supply voltage +5 V −0.3 6.0 V VCC2 supply voltage + 12 V −0.3 16 V Vi(RF) prescaler input voltage −0.3 VCC1 V Vo(BS) band switch output voltage −0.3 VCC1 V Vo(PNP) PNP band switch buffer output voltage − 0.3 VCC2 V Io(PNP) PNP band switch buffers output current −1 25 mA VNPN NPN open-collector output voltage −0.3 16 V INPN NPN open-collector output current −1 25 mA Vo(CP) charge-pump output voltage −0.3 VCC1 V Vo(tune) output tuning voltage −0.3 35 V Vi(SCL) serial clock input voltage −0.3 6.0 V Vi/o(SDA) serial data input/output voltage −0.3 6.0 V Io(SDA) serial data output current −1 5 mA Vi(AS) address selection input voltage −0.3 VCC1 V Vi(xtal) crystal oscillator input voltage −0.3 VCC1 V Tstg storage temperature range (IC) −40 +150 °C Tj maximum junction temperature − +150 °C tsc short circuit time; every pin to VCC1 or GND − 10 s HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling bipolar devices. Every pin withstands the ESD test in accordance with MIL-STD-883C category B (2000 V). Every pin withstands the ESD test in accordance with Philips Semiconductors Machine Model 0 Ω, 200 pF (200 V). 1996 Jan 23 8 Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer TSA5522 THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER MAX UNIT SO16 110 K/W SSOP20 120 K/W thermal resistance from junction to ambient in free air CHARACTERISTICS VCC1 = 4.5 to 5.5 V; VCC2 = VCC1 to 13.2 V; Tamb = −20 to 85 °C; unless otherwise specified; see note 1 SYMBOL PARAMETER CONDITIONS MIN. VCC1 supply voltage (+5 V) 4.5 TYP. − MAX 5.5 UNIT V VCC2 supply voltage (+12 V) VCC1 − 13.5 V ICC1 supply current − 22 30 mA ICC2 supply current − 27 32 mA fRF RF input frequency DR divider ratio One band switch buffer is ON; Isource = 20 mA 64 − 1400 MHz 15-bit frequency word 256 − 32767 MHz Rxtal = 25 to 300 Ω 3.2 4 4.48 MHz Crystal oscillator fxtal crystal oscillator input frequency Zxtal crystal oscillator input fi = 4 MHz impedance (absolute value) 600 1200 − Ω RF input level VCC1 = 4.5 to 5.5 V; see Fig.4; fi = 80 to 150 MHz −25 − 3 dB VCC1 = 4.5 to 5.5 V; see Fig.4; fi = 150 to 1000 MHz −28 − 3 dB VCC1 = 4.5 to 5.5 V; see Fig.4; fi = 1000 to 1400 MHz −26 − 3 dB Prescaler Vi(RF) PNP band switch buffers outputs |ILO| output leakage current VCC2 = 13.5 V; Vo = 0 V −10 − − µA Vo(sat) output saturation voltage Isource = 20 mA; note 1 - 0.2 0.5 V NPN open-collector outputs P4, P5, P6 and P7; see note 2 |ILO| output leakage current VCC1 = 5.5 V; Vo = 13.5 V − − 10 µA Vo(sat) output saturation voltage Isink = 20 mA; note 3 − 0.2 0.5 V COL allowed capacitive loading on output pins VOL = 13.5 V 10 nF Input ports P7, P5 and P4; see note 2 VIL LOW level input voltage − − 1.5 V VIH HIGH level input voltage 3 − − V − − 50 µA AS input (Address Selection) IIH(AS) 1996 Jan 23 HIGH level input current VAS = VCC1 9 Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer SYMBOL IIL(AS) PARAMETER LOW level input current TSA5522 CONDITIONS VAS = 0 V MIN. TYP. MAX UNIT −50 − − µA SCL and SDA inputs VIL LOW level input voltage − − 1.5 V VIH HIGH level input voltage 3.0 − 5.5 V IIH HIGH level input current IIL LOW level input current fclk input clock frequency VIH = 5.5 V; VCC1 = 0 V − − 10 µA VIH = 5.5 V; VCC1 = 5.5 V − − 10 µA VIL = 0 V; VCC1 = 5.5 V −10 − − µA − 100 400 kHz SDA output (I2C bus mode) IILO output leakage current VO = 5.5 V − − 10 µA Vo output voltage Isink = 3 mA − − 0.4 µA band A; Isource = 20 µA − 0.25 0.5 V band B; Isource = 20 µA 0.36VCC1 0.4VCC1 0.43VCC1 V band C; Isource = 20 µA 0.7VCC1 0.8VCC1 0.9VCC1 V band C; Isource = 50 µA 3.1 − − V BS output (M/O band selection) Vo(BS) output voltage Charge-pump output CP IICPH HIGH charge pump current (absolute value) CP = 1 − 250 − µA IICPL LOW charge pump current (absolute value) CP = 0 − 50 − µA Vo(CP) output voltage in-lock; Tamb = +25 °C − 1.95 − V ILI(off) off-state leakage current T2 = 0; T1 = 1 −5 1 15 nA − − 10 µA − 32.6 V − 30 mV Tuning voltage output Vtune ILO(off) leakage current when switched-off OS = 1; Vtune = 33 V Vo output voltage when the loop is closed OS = 0; T2 = 0; T1 = 0; T0 = 1; 0.4 RL = 27 k Ω; Vtune = 33 V Vripple(p-p) acceptable ripple voltage on VCC1 (peak-to-peak value) fripple = 300 Hz to 300 kHz − Notes 1. A single PNP band switch buffer is ON. 2. P4, P5 and P7 I/O ports are not available in 16-pin package. In 20-pin package, when a port is active, the collector voltage must not exceed 6 V. 3. A single NPN open-collector output is ON. 1996 Jan 23 10 Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer TSA5522 MLD227 12 handbook, full pagewidth power (dBm) 0 12 24 36 48 0 200 400 600 800 1000 Fig.4 Prescaler typical input sensitivity curve. 1996 Jan 23 11 1200 1400 f i (MHz) 1600 Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer TSA5522 INTERNAL PIN CONFIGURATION handbook, full pagewidth VCC1 3 kΩ V CC1 XTAL 300 µF VCC1 to presscaler divider V CC1 1 kΩ AS RF1 Vref AS V CC1 V CC1 1 kΩ RF2 SDA V CC1 V CC1 1 kΩ SCL V CC1 BS V CC1 V CC1 P4 V EE V CC1 VCC1 TSA5522 P5 VCC2 VCC2 n.c. V CC1 V CC1 P7 P2 V CC1 V CC1 VCC2 P6 X4 P1 Vtune control VCC2 V CC1 down CP P0 up MLD228 Fig.5 Internal pin configuration. 1996 Jan 23 12 Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer TSA5522 APPLICATION INFORMATION Crystal oscillator Tuning amplifier The crystal oscillator uses a 4 MHz crystal connected in series with an 18 pF capacitor thereby operating in the series resonance mode. Connecting the oscillator to the supply voltage is preferred, but it can, however, also be connected to ground. The tuning amplifier is capable of driving the varicap voltage without an external transistor. The tuning voltage output must be connected to an external load of 27 kΩ which is connected to the tuning voltage supply rail. Figure 6 shows a possible loop filter. The component values depend on the oscillator characteristics and the selected reference frequency. V tune handbook, full pagewidth 27 kΩ 33 V UHF 39 nF P0 P1 VHF1 CP P2 VHF3 180 nF 22 kΩ VCC2 V tune P6 SCL P6 TSA5522T 12 V V EE BS BS SCL 1 nF SDA AS SDA RF2 AS RF1 V CC1 XTAL RF RF 1 nF 5V 10 nF MLD229 4 MHz 18 pF Fig.6 Typical application (SO16). 1996 Jan 23 13 Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer TSA5522 Flock flag (FL) definition When the LOCK output is LOW the maximum frequency deviation (∆f) from stable frequency can be expressed as K VCO ( C1 + C2 ) follows: ∆f = ± -------------- × I CP × ----------------------------( C1 × C2 ) KO where: Kvco = oscillator slope Hz/V C2 handbook, halfpage C1 ICP = charge-pump current (A) KO = 4 × 10E6 R MBE331 C1, C2 = loop filter capacitors. In the application: KVCO = 16 MHz/V (UHF band) ICP = 250 µA C1 = 180 nF, C2 = 39 nF Fig.7 Loop filter. ∆f = ±31.2 kHz. Table 9 LOCK output / FL flag setting DESCRIPTION CONDITION Time span between actual phase lock and LOCK bit is LOW RSA = 1; RSB = 1 (or FL flag = 1) RSA = 1; RSB = 1 RSB = 0 Time span between the loop losing lock and LOCK bit is HIGH or (FL flag = 0) 1996 Jan 23 14 MIN. MAX. UNIT 1024 1152 µs 2048 2304 µs 1280 1440 µs 0 300 µs Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer TSA5522 PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0098 0.39 0.014 0.0075 0.38 0.16 0.15 0.050 0.24 0.23 0.041 0.039 0.016 0.028 0.020 0.01 0.01 0.004 0.028 0.012 inches 0.069 0.0098 0.057 0.0039 0.049 θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07S MS-012AC 1996 Jan 23 EIAJ EUROPEAN PROJECTION ISSUE DATE 91-08-13 95-01-23 15 o 8 0o Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer TSA5522 SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 1.5 0.15 0 1.4 1.2 0.25 0.32 0.20 0.20 0.13 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.45 0.65 0.45 0.2 0.13 0.1 0.48 0.18 10 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 90-04-05 95-02-25 SOT266-1 1996 Jan 23 EUROPEAN PROJECTION 16 o Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer TSA5522 SOLDERING SSOP Introduction Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. If wave soldering cannot be avoided, the following conditions must be observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). • The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Reflow soldering Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). Reflow soldering techniques are suitable for all SO and SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. METHOD (SO AND SSOP) During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering SO Repairing soldered joints Wave soldering techniques can be used for all SO packages if the following conditions are observed: Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. 1996 Jan 23 17 Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer TSA5522 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1996 Jan 23 18 Philips Semiconductors Product specification 1.4 GHz I2C-bus controlled synthesizer NOTES 1996 Jan 23 19 TSA5522 Philips Semiconductors – a worldwide company Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40-2783749, Fax. (31)40-2788399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SÃO PAULO-SP, Brazil, P.O. Box 7383 (01064-970), Tel. (011)821-2333, Fax. 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