INTEGRATED CIRCUITS DATA SHEET TDA4510 PAL decoder Product specification File under Integrated Circuits, IC02 March 1986 Philips Semiconductors Product specification PAL decoder TDA4510 GENERAL DESCRIPTION The TDA4510 is a colour decoder for the PAL standard, which is pin sequent compatible with multistandard decoder TDA4555 and also pin compatible with NTSC decoder TDA4570. It incorporates the following functions: Chrominance part • Gain controlled chrominance amplifier with operating point control stage • Chrominance output stage for driving the 64 µs delay line • Blanking circuit for the colour burst signal • Automatic chrominance control (ACC) with sampled rectifier during burst-key Oscillator and control voltage part • Reference oscillator for double subcarrier frequency • Gated phase comparison • Identification demodulator and automatic colour killer • Sandcastle pulse detector • Service switch Demodulator part • Two synchronous demodulators for the (B-Y) and (R-Y) signals • PAL flip-flop and PAL switch • Colour switching stages • Separate colour switching output • (B-Y) and (R-Y) signal output stages • Internal filtering of residual carrier QUICK REFERENCE DATA Supply voltage VP = V7-3 typ. 12 V Supply current IP = I7 typ. 50 mA Chrominance input signal (peak-to-peak) V9-3(p-p) 10 to 400 mV Chrominance output signal (peak-to-peak) V6-3(p-p) typ. 1,6 V −(R-Y) signal V1-3(p-p) typ. 1,05 V ± 2 dB −(B-Y) signal V2-3(p-p) typ. 1,33 V ± 2 dB burst gating level V15-3 typ. 7,7 V horizontal pulse separation V15-3 typ. 4,5 V vertical and horizontal pulse separation V15-3 typ. 2,5 V Colour difference output signals (peak-to-peak values) Sandcastle pulse, required amplitude for PACKAGE OUTLINE 16-lead DIL; plastic (SOT38); SOT38-1; 1996 November 26. March 1986 2 External capacitors in Fig.1 C1 filter capacitor for control voltage (pin 10) C2 filter capacitor for identification signal (pin 14) Fig.1 Block diagram. Philips Semiconductors March 1986 Product specification PAL decoder TDA4510 3 Philips Semiconductors Product specification PAL decoder TDA4510 FUNCTIONAL DESCRIPTION DIVIDER STAGES The divider stages provide −(R-Y) and −(B-Y) reference signals with the correct 90 degrees relation for the demodulators. PHASE COMPARATOR The phase comparator compares the −(R-Y) reference signal with the burst pulse and controls the frequency and phase of the reference oscillator. IDENTIFICATION DEMODULATOR The identification demodulator delivers a positive going identification signal for PAL-signals at pin 14, also used for the automatic colour-killer. SERVICE SWITCH The service switch has two functions. The first position (V14-3 < 1 V) allows the adjustment of the reference oscillator. Therefore the colour is switched on and the burst for the oscillator PLL is switched off. The second position (V14-3 > 5 V) switches the colour on and the output signals can be observed. SANDCASTLE PULSE DETECTOR Sandcastle pulse detector for burst-gate, line and blanking (horizontal and vertical) pulse detection. The vertical part of the sandcastle pulse is needed for the internal colour-on and colour-off delay. PULSE PROCESSING PART Pulse processing part which shall prevent a premature switching on of the colour. The colour-on delay, two or three field periods after identification of the PAL signal, is achieved by a counter. The colour is switched off immediately or at the latest one field period after disappearance of the identification voltage. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) VP = V7-3 10,8 to 13,2 V at pins 1 and 2 −I1,2 max. 5 mA at pin 6 −I6 max. 15 mA at pin 16 −I16 max. 5 mA Total power dissipation Ptot max. 800 mW Storage temperature Tstg −25 to + 150 °C Operating ambient temperature Tamb 0 to + 70 Supply voltage range Currents March 1986 4 °C Philips Semiconductors Product specification PAL decoder TDA4510 CHARACTERISTICS VP = 12 V; Tamb = 25 °C; measured in Fig.2 unless otherwise specified PARAMETER Supply current SYMBOL MIN. TYP. MAX. UNIT I7 − 50 − mA V9-3(p-p) 10 − 400 mV Chrominance part Input voltage range (peak-to-peak value) Nominal input voltage (peak-to-peak value) V9-3(p-p) − 100 − mV Input impedance Z9-3 − 3,3 − kΩ Input capacitance C9-3 − 4 − pF with 75% colour bar signal V6-3(p-p) − 1,6 − V d.c. voltage at chrominance output V6-3 − 8,2 − V Oscillator frequency fo − 8,8 − MHz Input resistance R13-3 − 350 − Ω f ±400 − − Hz without burst signal V14-3 − 6,0 − V colour on switching threshold V14-3 − 6,6 − V hysteresis of colour switching V14-3 − 150 − mV flip-flop correction (FFC) voltage V14-3 − 5,5 − V hysteresis of FFC V14-3 − 170 − mV Colour-on delay 2 − 3 f.p.(1) Colour-off delay 0 − 1 f.p.(1) with 75% colour bar signal Colour ON Chrominance output voltage (peak-to-peak) Oscillator and control voltage part Catching range (depending on RC-network at pin 12) Control voltage First service position (PLL is inactive for oscillator adjustment, colour on) V11-3 0 − 1 V second service position (colour on) V11-3 5 − − V −I16 − − 5 mA colour-on voltage V16-3 − 6 − V colour-off voltage V16-3 − 0 − V Colour switching output (open npn emitter) output current March 1986 5 Philips Semiconductors Product specification PAL decoder PARAMETER TDA4510 SYMBOL MIN. TYP. MAX. UNIT V4-3(p-p) − 200 − mV −(R-Y) signal V1-3(p-p) 0,84 1,05 1,32 V −(B-Y) signal V2-3(p-p) 1,06 1,33 1,67 V V1-3/V2-3 0,71 0,79 0,87 V V1; 2-3 − 7,7 − V 1 × subcarrier frequency (4,4 MHz) V1,2-3(p-p) − − 20 mV 2 × subcarrier frequency (8,8 MHz) V1,2-3(p-p) − − 20 mV V15-3 1,3 1,6 1,9 V Required pulse amplitude V15-3 2,0 2,5 3,0 V Line pulse separation; pulse ON V15-3 3,3 3,6 3,9 V Required pulse amplitude V15-3 4,1 4,5 4,9 V Burst pulse separation; pulse ON V15-3 6,6 7,1 7,6 V Required pulse amplitude V15-3 7,7 − − V Input voltage during horizontal scanning V15-3 − − 1,1 V Input current −I15 − − 100 µA Demodulator part Delayed chrominance input signal (peak-to-peak value) with 75% colour bar signal Colour difference output signals (peak-to-peak value) Ratio of colour difference output signals (R-Y)/(B-Y) D.C. voltage at colour difference outputs Residual carrier voltage at colour difference outputs Sandcastle pulse detector Thresholds: Field- and line-pulse separation pulse ON Note 1. f.p. is shortening for field periods in this case. March 1986 6 Philips Semiconductors Product specification PAL decoder TDA4510 C4 = 5 to 27 pF, X = 8,8 MHz; nominal frequency 8,867 238 MHz; resonance resistance 60 Ω, load capacitance 20 pF, dynamic capacitance 22 fF and static capacitance 5,5 pF. Fig.2 Application information and test circuit. March 1986 7 Philips Semiconductors Product specification PAL decoder TDA4510 PACKAGE OUTLINE DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE March 1986 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 8 Philips Semiconductors Product specification PAL decoder TDA4510 with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. March 1986 9