PHILIPS TDA4651WP

INTEGRATED CIRCUITS
DATA SHEET
TDA4651
Multistandard colour decoder with
negative colour difference output
signals
Preliminary specification
File under Integrated Circuits, IC02
August 1993
Philips Semiconductors
Preliminary specification
Multistandard colour decoder with negative
colour difference output signals
TDA4651
FEATURES
GENERAL DESCRIPTION
Identifies and demodulates PAL,
SECAM, NTSC 3.58 and NTSC 4.43
chrominance signals with:
The TDA4651 is a monolithic integrated multistandard colour decoder for PAL,
SECAM and NTSC (3.58 and 4.43 MHz) with negative colour difference output
signals. The colour difference output signals are fed to the TDA4661, switched
capacitor delay line.
• Gain controlled chrominance
amplifier
• ACC demodulation controlled by
system scanning
• Internal colour difference signal
output filters to remove the residual
subcarrier
QUICK REFERENCE DATA
SYMBOL
PARAMETER
VP
MIN.
TYP.
positive
supply voltage
(pin 13)
10.8
12
13.2
V
IP
supply current
(pin 13)
−
60
−
mA
Vi(p-p)
chrominance
input voltage
(pin 15)
(peak-to-peak
value)
20
200
400
mV
• PAL / NTSC demodulation
– H (burst) and V blanking
– PAL switch (disabled for NTSC)
– NTSC phase shift (disabled for
PAL)
– PLL-controlled reference
oscillator
– two reference oscillator crystals
on separate pins with automatic
switching
V1(p-p)
V3(p-p)
– limiter amplifier
– quadrature demodulator with a
single external reference tuned
circuit
– alternate line blanking, H and V
blanking
– de-emphasis
see note 1
MAX.
UNIT
Colour difference output signals (see note 2)
– quadrature demodulator with
subcarrier reference
• SECAM demodulation
CONDITIONS
−(R−Y) output
(peak-to-peak
value)
PAL
442
525
624
mV
NTSC
370
440
523
mV
SECAM
883
1050 1248
mV
−(B−Y) output
(peak-to-peak
value)
PAL
559
665
791
mV
NTSC
468
557
662
mV
SECAM
1119
1330 1581
mV
Notes to quick reference data
1. Within 3 dB output voltage deviation.
2. Burst key width for PAL 4.3 µs, for NTSC 3.6 µs
Burst width for PAL and NTSC 2.25 µs, ratio burst-chrominance-amplitude
1/2.2.
• Identification
– automatic standard identification
by sequential inquiry
ORDERING INFORMATION
PACKAGE
– secure SECAM identification at
50 Hz only, with PAL priority
EXTENDED
TYPE NUMBER
PINS
MATERIAL
CODE
– four switched outputs for
chrominance filter selection and
display control
PIN
POSITION
TDA4651
28
DIL
plastic
SOT117(1)
TDA4651WP
28
PLCC
plastic
SOT261CG(2)
– external service switch for
oscillator adjustment
Note
1. SOT117-1; 1996 November 25.
2. SOT261-2; 1996 November 25.
August 1993
2
Philips Semiconductors
Preliminary specification
TDA4651
Fig.1 Block diagram.
Multistandard colour decoder with negative
colour difference output signals
August 1993
3
Philips Semiconductors
Preliminary specification
Multistandard colour decoder with negative
colour difference output signals
TDA4651
PINNING
SYMBOL
PIN
DESCRIPTION
CHR1
15
chrominance input
−(R−Y)o
1
−(R−Y) output
CACC
16
automatic colour control
−(R−Y)DE
2
(R−Y) de-emphasis
HUE
17
hue control
−(B−Y)o
3
−(B−Y) output
PLL
18
PLL time constant
−(B−Y)DE
4
(B−Y) de-emphasis
OSC1
19
input for 7.15 MHz oscillator
−(B−Y)CL
5
(B−Y) clamping
CPLL
20
PLL DC reference
−(R−Y)CL
6
(R−Y) clamping
OSC2
21
input for 8.86 MHz oscillator
SECAM reference tuned circuit
NIDENT
22
NTSC identification
8
PIDENT
23
PAL/SECAM identification
9
SSC
24
super sandcastle pulse input
10
N01
25
NTSC (4.43 MHz) identification
SECREF
7
GND
11
ground
N02
26
NTSC (3.58 MHz) identification
CHR2
12
DC for ACC
SEC0
27
SECAM identification
PAL0
28
PAL identification
VP
13
supply voltage
CDC
14
DC feedback
Fig.3 Pin configuration for PLCC package.
Fig.2 Pin configuration for DIL
package.
August 1993
4
Philips Semiconductors
Preliminary specification
Multistandard colour decoder with negative
colour difference output signals
TDA4651
FUNCTIONAL DESCRIPTION
Reference oscillator
Clamp
The IC (see block diagram Fig.1)
contains all functions required for the
identification and demodulation of
PAL, SECAM, NTSC 4.43 MHz and
NTSC 3.58 MHz signals. When an
unknown signal is fed into the input,
the circuit has to identify the standard
of the signal; to achieve this it has to
switch on successively the
appropriate input filter, crystal (8.8 or
7.2 MHz) and demodulator and
finally, after having identified the
signal, it has to switch on the colour
and, in the event of NTSC reception,
the hue control. The two colour
difference signals −(R−Y) and −(B−Y)
are available at the outputs. The
identification circuit is able to
discriminate between NTSC signals
with colour carrier frequencies of
3.58 MHz or 4.43 MHz.
The reference oscillator for PAL and
NTSC operates at twice the colour
carrier frequency. It is followed by a
divider stage, providing the (R−Y) and
(B−Y) reference signal with the
correct phase relation to the
PAL/NTSC demodulator and the
identification part.
Behind the demodulators the signals
are being filtered and the black level
is clamped to a constant DC-level
during the burst gate pulse. For the
SECAM signals this happens every
second line, when the appropriate
artificial black level is present.
Chrominance amplifier
The chrominance amplifier has an
asymmetrical input. The input signal
has to be AC coupled (pin 15). The
differential amplifier stage at the input
is followed by the gain control stage
and a differential amplifier with lateral
PNP transistors having the function of
a level shifter. The gain control stage
consists of two ACC-rectifier circuits.
One rectifier circuit is switched on
during SECAM reception respectively
during the SECAM part of the
system-control-scanning (it is
switched on during part of the burst
gate pulse and it is disabled during
the prolonged frame flyback); the
other rectifier is switched on during
the burst, when PAL or NTSC signals
are received respectively during the
PAL and NTSC parts of the system
control scanning. The DC-potential of
the symmetrical signal connections to
the demodulators is kept at the same
level by means of a working point
control stage.
August 1993
De-emphasis and output-buffer
Demodulators
The demodulation of the colour signal
requires three demodulators. Two are
common for PAL and NTSC and one
for the SECAM signals. In the event of
NTSC reception, the symmetrical
signal is fed into two differential
amplifier stages with the correct gain
and from there the signal is fed into
two demodulators each consisting of
four transistors. During NTSC
reception the PAL switch between the
differential amplifier of the (R-Y)
channel and the corresponding
demodulator is disabled. These
transistors are switched on and off by
the appropriate reference signals. In
the event of PAL reception, the
symmetrical signal is fed into the
same differential amplifiers and the
PAL switch is active.
The SECAM demodulator is a
combined demodulator for −(B−Y)
and −(R−Y) with artificial black level
being inserted alternately every
second line and during line and field
flyback. The load resistors of the
demodulator are connected to two
differential amplifiers, one for −(B−Y)
and one for −(R−Y). The unwanted
signals occurring every second line
((R−Y) in the −(B−Y) channel and
(B−Y) in the −(R−Y) channel) are
blanked.
5
Behind the clamping stages is the
de-emphasis for the SECAM signals
and just in front of the output stages
are the colour killer and blanking
stages. The blanking level is the
same as the clamping level and the
black level.
Identification
The identification part contains three
demodulators.
The first is demodulating during PAL
and NTSC identification or reception.
It is active during the burst clamping
only. The reference signal has the
(R-Y)-phase. The second
demodulator is demodulating during
the SECAM identification or reception
and is active during part of the burst
clamping time. It uses the same
signals as the SECAM demodulator
that is not active during field flyback.
These two demodulators are followed
by a H/2 switch ‘rectifying’ the
demodulated signal. The result is an
identification signal (PIDENT) that is
positive for a PAL signal during the
PAL part of the scanning, for a
SECAM signal during the SECAM
part of the scanning and for a PAL
signal during the NTSC 4.43 part of
the scanning. If the PIDENT is positive
during the SECAM part of the
scanning, the scanner switches back
to the PAL part of the scanning in
order to prevent that a PAL signal is
erroneously identified as a SECAM
signal (PAL priority).
If then the PIDENT is not positive, the
scanner returns to SECAM part and
remains there until the PIDENT is
Philips Semiconductors
Preliminary specification
Multistandard colour decoder with negative
colour difference output signals
positive again. In the event of a field
frequency of 60 Hz the signal cannot
be identified as a SECAM signal,
even if the PIDENT is positive. If the
H/2 signal is of the wrong polarity, the
identification signal is negative and
the H/2 flip-flop is set to the correct
phase.
The third demodulator is
demodulating during NTSC
identification or reception only. It is
active during the burst clamping time.
The resulting identification signal
(NIDENT) is positive for PAL and NTSC
4.43 MHz signal during the NTSC
4.43 part of the scanning and for
NTSC 3.58 MHz signal during the
TDA4651
NTSC 3.58 part of the scanning. The
reference signal has the (B-Y) phase.
The two identification signals allow an
unequivocal identification of the
received signal. If a signal has been
identified, the scanning is stopped
and after a delay time the colour is
switched on.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VP
supply voltage (pin 13)
−
13.2
V
VI
input voltage range at pins 1, 3, 17 and 24 to 28
0
VP
V
IO
output current (pins 1 and 3)
−
−5
mA
II/O
input/output current (pin 25 to 28)
−
−5
µA
Tamb
operating ambient temperature range
0
+70
°C
Tstg
storage temperature range
−25
+150
°C
Ptot
total power dissipation
SOT117
−
1.4
W
SOT261CG
−
1.1
W
THERMAL RESISTANCE
SYMBOL
Rth j-a
August 1993
PARAMETER
THERMAL RESISTANCE
from junction to ambient in free air
SOT117
37 K/W
SOT261CG
70 K/W
6
Philips Semiconductors
Preliminary specification
Multistandard colour decoder with negative
colour difference output signals
TDA4651
CHARACTERISTICS
All voltages are measured to GND (pin 11); VP = 12 V; chrominance input signal V15(p−p) = 200 mV (with 75% colour bar
signal); Tamb = +25 °C; measured in test circuit of Fig.1; unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VP
positive supply voltage
10.8
12
13.2
V
IP
supply current
50
60
80
mA
20
200
400
mV
Chrominance part
Vi(p−p)
input signal range (pin 15)
(peak-to-peak value)
RI
input resistance (pin 15)
8.5
10
11.5
kΩ
CI
input capacitance (pin 15)
−
4
5
pF
see note 1
Demodulator part (PAL/NTSC)
V1(p−p)
V3(p−p)
colour difference −(R−Y) output signal
(peak-to-peak value)
colour difference −(B−Y) output signal
(peak-to-peak value)
see note 2
PAL
442
525
624
mV
NTSC
370
440
523
mV
see note 2
PAL
559
665
791
mV
NTSC
468
557
662
mV
V1/V3
spread of ratio of colour difference
signals (R-Y)/(B-Y)
at nominal phase of
hue control
−
−
±5
%
V1/V1
spread of signal ratio PAL/NTSC
at nominal phase of
hue control
−
−
±1
dB
m
signal linearity
V1(p−p) = 0.8 V −(R−Y)
0.8
−
−
V3(p−p) = 1.0 V −(B−Y)
0.8
−
−
DC output level
proportional to VP
6.3
6.8
7.3
V
H/2 ripple at CD outputs
without colour bars
−
−
10
mV
V1, 3(p−p)
residual carrier at CD outputs
(peak-to-peak value)
4.43 MHz
−
−
10
mV
8.87 MHz
−
−
30
mV
Z1,3
output impedance
−
−
200
Ω
V1,3
Demodulator part (SECAM) (see note 3)
V1(p−p)
colour difference −(R−Y) output signal
(peak-to-peak value)
every second line
blanked
0.88
1.05
1.25
V
V3(p−p)
colour difference −(B−Y) output signal
(peak-to-peak value)
every second line
blanked
1.12
1.33
1.58
V
V1, 3
DC output level
proportional to VP
6.3
6.8
7.3
V
H/2 ripple at CD outputs
without colour bars;
every second line
blanked
−
−
10
mV
residual carrier at CD outputs
(peak-to-peak value)
4.43 MHz
−
−
30
mV
8.87 MHz
−
−
30
mV
V1,3(p-p)
∆V1,3/∆VP
∆V1/∆T
shift of demodulated fo levels relative to
blanking level
with supply voltage
−
−
3
mV/V
with temperature
−
0.16
−
mV/K
−
−0.25
−
mV/K
∆V3/∆T
August 1993
7
Philips Semiconductors
Preliminary specification
Multistandard colour decoder with negative
colour difference output signals
SYMBOL
PARAMETER
CONDITIONS
TDA4651
MIN.
TYP.
MAX.
UNIT
Hue control part
φ
V17
R17
phase shift of reference carrier relative to
phase at V17 = 3 V
V17 = 2 V
−30
−40
−
deg
phase shift of reference carrier
V17 = 3 V
−
0
±5
deg
phase shift of reference carrier relative to
phase at V17 = 3 V
V17 = 4 V
30
40
−
deg
internal bias voltage
see note 4
−
3
−
V
switching voltage for oscillator adjustment
burst OFF; colour ON
0
−
0.5
V
switching voltage for forced colour ON
hue OFF; colour ON
5.5
−
VP
V
4.25
5.0
5.75
kΩ
−
350
−
Ω
input resistance
Reference oscillator (PLL) (see note 5)
R19,21
input resistance
C19,21
input capacitance
fc
catching range
−
−
10
pF
at 4.43 MHz
±400
−
−
Hz
at 3.57 MHz
±330
−
−
Hz
control voltage OFF
state
−
0.05
0.5
V
control voltage ON
state; during scanning
2.35
2.45
2.55
V
control voltage ON
state; internal forced
5.6
5.8
6.0
V
control voltage ON
state; external forced
9.0
−
VP
V
Identification part (see note 6)
V25 to 28
switching voltages
I25 to 28
output currents
−
−
−3
mA
td
delay time for system hold
2
−
3
cycles
delay time for colour ON
2
−
3
cycles
delay time for colour OFF
0
−
1
cycles
−
4
−
cycles
7.7
−
VP
V
ts
scanning time for each standard
see note 7
Super sandcastle pulse detector (see note 8)
V24
input pulse amplitude
input voltage pulse levels to separate
V and H blanking pulses
pulse ON
1.3
1.6
1.9
V
pulse OFF
1.1
1.4
1.7
V
2.0
2.5
3.0
V
voltage pulse amplitude
input voltage pulse levels to separate
H blanking pulse
pulse ON
3.3
3.6
3.9
V
pulse OFF
3.1
3.4
3.7
V
4.1
4.5
4.9
V
6.6
7.0
V
voltage pulse amplitude
I24
August 1993
input voltage pulse levels to separate
burst gating pulse
pulse ON
6.2
pulse OFF
6.0
6.4
6.8
V
input voltage
during line scan
−
−
1.0
V
input current
during line scan
−
−
−100
µA
8
Philips Semiconductors
Preliminary specification
Multistandard colour decoder with negative
colour difference output signals
TDA4651
Notes to the characteristics
1. With 20 mV, 3 dB decrease of the output signal is allowed. The level shift at demodulated f0 relative to blanking level
is less than 5 mV.
2. Burst key width for PAL 4.3 µs, for NTSC 3.6 µs
Burst width for PAL and NTSC 2.25 µs, ratio burst chrominance amplitude 1/2.2.
3. For the SEC+AM standard, amplitude and H/2 ripple content of the CD signals (R−Y) and (B−Y) depend on the
characteristics of the external tuned circuit at pins 7 to 10. The resonant frequency of the external tuned circuit must
be adjusted such that the demodulated fo voltage level is zero in the −(B−Y) output channel at pin 3.
Now it is possible to adjust the quality of the external circuit such that the demodulated fo voltage level is zero in the
−(R−Y) output channel at pin 1. If necessary, the fo voltage level in the −(B−Y) output channel must be readjusted to
zero by the coil of the tuned circuit.
The external capacitors at pins 2 and 4 (each 220 pF) are matched to the internal resistances of the de-emphasis
network such that every alternate scanned line is blanked.
4. Pin 17 open-circuit; proportional to supply voltage.
5. The fo frequencies of the 8.8 MHz crystal at pin 21, and the 7.2 MHz crystal at pin 19, can be adjusted when the
voltage at pin 17 is less than 0.5 V (burst OFF), thus providing double subcarrier frequencies of the chrominance
signal.
6. Switching voltages for chrominance filters and crystals:
at pin 28 for PAL
at pin 27 for SECAM
at pin 26 for NTSC (3.58 MHz)
at pin 25 for NTSC (4.43 MHz).
7. The inquiry sequence for the standard is: PAL - SECAM - NTSC (3.58 MHz) - NTSC (4.43 MHz). PAL has priority
with respect to SECAM, etc.
8. The super sandcastle pulse is compared with three internal threshold levels which are proportional to VP.
Table 1
Specification of quartz crystals in HC-49/U13 holder; standard application.
SYMBOL
PARAMETER
VALUE
UNIT
43221430405 43221430418
fn
nominal frequency
CL
load capacitance
8.867238
∆fn
adjustment tolerance of fn at +25 °C
10−12
10−3
7.159090
MHz
20
pF
±40
ppm
Rdld max
in the drive level range between
W and 1.0 ×
W, the
resonance resistance may not exceed (at +25 °C) the value of
Rdld max
Rn
resonance resistance of unwanted response
C1
motional capacitance (±20%)
22
C0
parallel capacitance (±20%)
5.5
T
operating temperature range
∆fn
frequency tolerance over temperature range
±25
ppm
Rr
maximum resonance resistance over temperature range
60
Ω
August 1993
100
50
2Rr (+25 °C)
Ω
19.5
fF
4.4
−10 to +60
9
Ω
pF
°C
Philips Semiconductors
Preliminary specification
TDA4651
Fig.4 Internal circuits.
Multistandard colour decoder with negative
colour difference output signals
August 1993
10
Philips Semiconductors
Preliminary specification
TDA4651
Fig.5 Application diagram with the switched capacitor delay line TDA4661.
Multistandard colour decoder with negative
colour difference output signals
August 1993
11
Philips Semiconductors
Preliminary specification
Multistandard colour decoder with negative
colour difference output signals
TDA4651
PACKAGE OUTLINES
seating plane
handbook, full
pagewidthdual in-line package; 28 leads (600 mil)
DIP28:
plastic
SOT117-1
ME
D
A2
L
A
A1
c
e
Z
w M
b1
(e 1)
b
MH
15
28
pin 1 index
E
1
14
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
5.1
0.51
4.0
1.7
1.3
0.53
0.38
0.32
0.23
36.0
35.0
14.1
13.7
2.54
15.24
3.9
3.4
15.80
15.24
17.15
15.90
0.25
1.7
inches
0.20
0.020
0.16
0.066
0.051
0.020
0.014
0.013
0.009
1.41
1.34
0.56
0.54
0.10
0.60
0.15
0.13
0.62
0.60
0.68
0.63
0.01
0.067
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT117-1
051G05
MO-015AH
August 1993
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-14
12
Philips Semiconductors
Preliminary specification
Multistandard colour decoder with negative
colour difference output signals
TDA4651
PLCC28: plastic leaded chip carrier; 28 leads
SOT261-2
eE
eE
y
X
A
19
25
18
26
bp
b1
ZE
w M
28
1
E
HE
pin 1 index
e
A
A4 A1
12
4
β
k1
(A 3)
k
5
11
Lp
v M A
ZD
e
detail X
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
k1
max.
Lp
v
w
y
0.51
1.44
1.02
0.18
0.18
0.10
Z D(1) Z E (1)
max. max.
UNIT
A
A1
min.
A3
A4
max.
bp
b1
mm
4.57
4.19
0.51
0.25
3.05
0.53
0.33
0.81
0.66
0.180
0.020 0.01
0.165
0.12
0.430 0.430 0.495 0.495 0.048
0.057
0.021 0.032 0.456 0.456
0.020
0.05
0.007 0.007 0.004 0.085 0.085
0.390 0.390 0.485 0.485 0.042
0.040
0.013 0.026 0.450 0.450
inches
D (1)
E (1)
e
eD
eE
HD
HE
k
11.58 11.58
10.92 10.92 12.57 12.57 1.22
1.27
11.43 11.43
9.91 9.91 12.32 12.32 1.07
2.16
β
2.16
45 o
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
92-11-17
95-02-25
SOT261-2
August 1993
EUROPEAN
PROJECTION
13
Philips Semiconductors
Preliminary specification
Multistandard colour decoder with negative
colour difference output signals
TDA4651
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
WAVE SOLDERING
DIP
Wave soldering techniques can be used for all PLCC
packages if the following conditions are observed:
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
• The package footprint must incorporate solder thieves at
the downstream corners.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
REPAIRING SOLDERED JOINTS
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
PLCC
REPAIRING SOLDERED JOINTS
REFLOW SOLDERING
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering techniques are suitable for all PLCC
packages.
The choice of heating method may be influenced by larger
PLCC packages (44 leads, or more). If infrared or vapour
phase heating is used and the large packages are not
absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our “Quality
Reference Handbook” (order code 9397 750 00192).
August 1993
14
Philips Semiconductors
Preliminary specification
Multistandard colour decoder with negative
colour difference output signals
TDA4651
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
August 1993
15