INTEGRATED CIRCUITS DATA SHEET TDA4560 Colour transient improvement circuit Product specification File under Integrated Circuits, IC02 March 1985 Philips Semiconductors Product specification Colour transient improvement circuit TDA4560 GENERAL DESCRIPTION The TDA4560 is a monolithic integrated circuit for colour transient improvement (CTI) and luminance delay line in gyrator technique in colour television receivers. Features • Colour transient improvement for colour difference signals (R-Y) and (B-Y) with transient detecting-, storage- and switching stages resulting in high transients of colour difference output signals • A luminance signal path (Y) which substitutes the conventional Y-delay coil with an integrated Y-delay line • Switchable delay time from 720 ns to 1035 ns in steps of 45 ns • Output for the option of velocity modulation QUICK REFERENCE DATA Supply voltage (pin 10) VP = V10-18 typ. 12 V Supply current (pin 10) IP = I10 typ. 35 mA (R-Y) and (B-Y) attenuation αcd typ. 0 dB (R-Y) and (B-Y) output transient time ttr typ. 150 ns Adjustable Y-delay time td 720 to 1035 ns Y-attenuation αy typ. PACKAGE OUTLINE 18-lead DIL; plastic (SOT102); SOT102-1; 1996 November 27. March 1985 2 7 dB Philips Semiconductors Product specification TDA4560 Fig.1 Block diagram. Colour transient improvement circuit March 1985 3 Philips Semiconductors Product specification Colour transient improvement circuit TDA4560 FUNCTIONAL DESCRIPTION The IC consists of two colour difference channels (B-Y) and (R-Y) and a luminance signal path (Y) as shown in Fig.1. Colour difference channels The (B-Y) and (R-Y) colour difference channels consist of a buffer amplifier at the input, a switching stage and an output amplifier. The switching stages, which are controlled by transient detecting stages (differentiators), switch to a value that has been stored at the beginning of the transients. The differentiating stages get their signal direct from the colour difference detecting signal (pins 1 and 2). Two parallel storage stages are incorporated in which the colour difference signals are stored during the transient time of the signal. After a time of about 600 ns they are switched immediately (transient time of 150 ns) to the outputs. The colour difference channels are not attenuated. Y-signal path The Y-signal input (pin 17) is capacitively coupled to an input clamping circuit. Gyrator delay cells provide a maximum delay of 1035 ns including an additional delay of 45 ns via the fine adjustment switch (S1) at pin 13. Three delay cells are switched with two interstage switches dependent on the voltage at pin 15. Thus three switchable delay times of 90 ns, 180 ns or 270 ns less than the maximum delay time are available. A tuning compensation circuit ensures accuracy of delay time despite process tolerances. The Y-signal path has a 7 dB attenuation as a normal Y-delay coil and can replace this completely. The output is fed to pin 12 via a buffer amplifier. An additional output stage provides a signal of 90 ns less delay at pin 11 for the option of velocity modulation. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC) VP = V10−18 max. 13,2 V at pins 1,2,12,15 Vn-18 0 to VP V at pin 11 V11-18 0 to (VP−3V) V at pin 17 V17-18 0 to 7 V Supply voltage (pin 10) Voltage ranges to pin 18 (ground) Voltage ranges at pin 7 to pin 6 V7-6 0 to 5 V at pin 8 to pin 9 V8−9 0 to 5 V Currents ±I6,9 at pins 6,9 at I7, I8, I11, I12 max. 15 mA internally limited Total power dissipation Ptot max. 1,1 W Storage temperature range Tstg -25 to +150 °C Operating ambient temperature range Tamb 0 to +70 °C Note 1. Pins 3, 4, 5, 6, 9, 13 and 14 d.c. potential not published. March 1985 4 Philips Semiconductors Product specification Colour transient improvement circuit TDA4560 CHARACTERISTICS VP = V10-18 = 12 V; Tamb = 25 °C; measured in application circuit Fig.2; unless otherwise specified PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply (pin 10) Supply voltage VP = V10-18 10,8 12 13,2 V Supply current IP = I10 − 35 50 mA V1-18 − 1,05 − V Colour difference channels (pins 1 and 2); (R-Y) input voltage (peak-to-peak value) 75% colour bar signal (B-Y) input voltage (peak-to-peak value) V2-18 − 1,33 − V Input resistance R1, 2-18 − 12 − kΩ Internal bias (input) V1, 2-18 − 4,3 − V V8 V7 (B-Y), (R-Y) signal attenuation ------, -----V1 V2 αcd − 0 − dB Output voltage (d.c.) V7, 8-18 − 4,4 − V −I7,8 − 1,2 − mA ttr − 150 − ns V17-18(p-p) − 1 − V V17-18 − 1,5 − V during picture content I17 − 8 − µA during synchronizing pulse −I17 − 100 − µA V 11 Y-signal attenuation --------V 17 αY − 8 − dB V 12 Y-signal attenuation --------V 17 αY − 7 − dB Output voltage (d.c.) V11-18 − 2,3 − V Output voltage (d.c.) V12-18 − 10,3 − V −I11,12 − 1,2 − mA f12-17 − 5 − MHz 75% colour bar signal Output current (emitter follower with constant current source 0,65 mA) (R-Y) and (B-Y) output signal transient time Y-signal path (pin 17) Y-input voltage (composite signal) (peak-to-peak value) Internal bias voltage (during clamping) Input current Output current (emitter follower with constant current source 0,45 mA) Frequency response (note 1) R14−18 = 1,2 kΩ; V15−18 = 12 V March 1985 5 Philips Semiconductors Product specification Colour transient improvement circuit PARAMETER TDA4560 SYMBOL MIN. TYP. MAX. UNIT Y-signal path (pin 17) Adjustable delay (note 2) (switch open) at V15-18 = 0 to 2,5 V; R14-18 = 1,2 kΩ td − 720 − ns at V15-18 = 3,5 to 5,5 V; R14-18 = 1,2 kΩ td − 810 − ns at V15-18 = 6,5 to 8,5 V; R14-18 = 1,2 kΩ td − 900 − ns at V15-18 = 9,5 to12 V; R14-18 = 1,2 kΩ td − 990 − ns ∆td − 45 − ns 70 K/W Fine adjustment delay (switch S1 closed) at V13-18 = 0 V Signal delay for velocity modulation (pin 11) td − 90 ns t Thermal resistance From junction to ambient (in free air) − Rth j-a Notes 1. R14-18 influences the bandwidth. 2. Delay time is proportional to resistor R14-18. March 1985 6 − Philips Semiconductors Product specification Colour transient improvement circuit TDA4560 (1) Residual carrier reduced to 20 mV peak-to-peak (R = 1 kΩ, C = 100 pF). (2) Switching sequence for delay times shown in Table 1. Fig.2 Application diagram and test circuit. Table 1 Switching sequence for delay times. CONNECTION (2) VOLTAGE AT PIN 15 (A) (B) DELAY TIME (ns) (1) (C) O O O 0 to 2,5 V 720 O O X 3,5 to 5,5 V 810 O X X 6,5 to 8,5 V 900 X X X 9,5 to 12 V 990 Note 1. When switch (S1) is closed the delay time is increased by 45 ns. 2. Where: X = connection closed; O = connection open. March 1985 7 Philips Semiconductors Product specification Colour transient improvement circuit TDA4560 PACKAGE OUTLINE DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 1.40 1.14 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 0.85 inches 0.19 0.020 0.15 0.055 0.044 0.021 0.015 0.055 0.044 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.033 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 93-10-14 95-01-23 SOT102-1 March 1985 EUROPEAN PROJECTION 8 Philips Semiconductors Product specification Colour transient improvement circuit TDA4560 with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. March 1985 9