INTEGRATED CIRCUITS DATA SHEET TDA4566 Colour transient improvement circuit Preliminary specification File under Integrated Circuits, IC02 March 1991 Philips Semiconductors Preliminary specification Colour transient improvement circuit TDA4566 GENERAL DESCRIPTION The TDA4566 is a monolithic integrated circuit for colour-transient improvement (CTI) and luminance delay line in gyrator technique in colour television receivers. Features • Colour transient improvement for colour difference signals (R-Y) and (B-Y) with transient detecting-, storage- and switching stages resulting in high transients of colour difference output signals • A luminance signal path (Y) which substitutes the conventional Y-delay coil with an integrated Y-delay line • Switchable delay time from 550 ns to 820 ns in steps of 90 ns and additional fine adjustment of 37 ns • Two Y output signals; one of 180 ns less delay QUICK REFERENCE DATA PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply voltage (pin 10) VP 10.8 12 13.2 V Supply current (pin 10) IP − 35 50 mA Y-signal delay at pin 12 S1 open; R14-18 = 1.2 kΩ; note 1 V15-18 = 0 to 2.5 V t17-12 490 550 610 ns V15-18 = 3.5 to 5.5 V t17-12 580 640 700 ns V15-18 = 6.5 to 8.5 V t17-12 670 730 790 ns t17-12 760 820 880 ns αY 0 1 2 dB attenuation αcd −1 0 +1 dB output transient time ttr − 100 200 ns V15-18 = 9.5 to12 V Y-signal amplification 0.5 MHz (R-Y) and (B-Y) signal Note 1. Delay time is proportional to resistor R14-18. R14-18 also influences the bandwidth; a value of 1.2 kΩ results in a bandwidth of 5 MHz (typ.). PACKAGE OUTLINE 18-lead DIL; plastic (SOT102); SOT102-1; 1996 November 27. March 1991 2 Philips Semiconductors Preliminary specification TDA4566 Fig.1 Block diagram. Colour transient improvement circuit March 1991 3 Philips Semiconductors Preliminary specification TDA4566 Fig.2 Internal pin circuit diagram. Colour transient improvement circuit March 1991 4 Philips Semiconductors Preliminary specification Colour transient improvement circuit TDA4566 RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER SYMBOL MIN. MAX. UNIT VP = V10-18 0 13.2 V Vn-18 0 VP V at pin 11 V11-18 0 (VP−3 V) V at pin 17 V17-18 0 7 V at pin 7 to pin 6 V7-6 0 5 V at pin 8 to pin 9 V8-9 0 5 V at pins 6, 9 I6, 9 −10 +10 mA at pins 7, 8, 11 and 12 I7, 8, 11, 12 Supply voltage range (pin 10) Voltage ranges to pin 18 (ground) at pins 1, 2, 12 and 15 Voltage ranges Currents internally limited Total power dissipation (Tj = 150 °C; Tamb = 70 °C Ptot − 1.1 W Storage temperature range Tstg −25 + 150 °C Operating ambient temperature range Tamb 0 + 70 °C THERMAL RESISTANCE From junction to ambient (in free air) Rth j−a Note 1. Pins 3, 4, 5, 6, 9, 13 and 14 DC potential not published. March 1991 5 = 70 K/W Philips Semiconductors Preliminary specification Colour transient improvement circuit TDA4566 CHARACTERISTICS VP = V10-18 = 12 V; Tamb = 25 °C; measured in application circuit Fig.3; unless otherwise specified PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply (pin 10) Supply voltage VP 10.8 12 13.2 V Supply current IP − 35 50 mA V1(p-p) − 0.63 1.5 V V2(p-p) − 0.8 1.9 V (R-Y) R1-18 8 12 16 kΩ (B-Y) R2-18 8 12 16 kΩ (R-Y) V1-18 3.8 4.3 4.8 V (B-Y) V1-18 3.8 4.3 4.8 V (R-Y) V8 / V1 −1 0 +1 dB (B-Y) V7 / V2 −1 0 +1 dB ttr − 100 200 ns (B-Y) R7-18 − 100 − Ω (R-Y) R8-18 − 100 − Ω (B-Y) V7-18 3.8 4.3 4.8 V (R-Y) V8-18 3.8 4.3 4.8 V source I7, 8 0.4 − − mA sink −I7, 8 1.0 − − mA Colour difference paths (R-Y) input voltage (75% colour bar signal) (peak-to-peak value) (B-Y) input voltage (75% colour bar signal) (peak-to-peak value) Input resistance Internal bias voltage Signal attenuation Output transient time note 1 Output resistance DC output voltage Output current March 1991 note 2 6 Philips Semiconductors Preliminary specification Colour transient improvement circuit PARAMETER TDA4566 CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Y-signal path Y-input voltage (composite signal) capacitive coupling V17(p-p) − 0.45 0.62 V during clamping V17-18 2.1 2.4 2.7 V I17 − 8 12 µA −I17 − 100 150 µA at V15−18 = 0 to 2.5 V t17-18 490 550 610 ns at V15-18 = 3.5 to 5.5 V t17-18 580 640 700 ns at V15−18 = 6.5 to 8.5 V t17-18 670 730 790 ns at V15-18 = 9.5 to12 V t17-18 760 820 880 ns S1 closed t17-12 − 37 − ns S1 open t11-12 160 180 200 ns on temperature ∆t 17 – 12 -----------------------------t 17 – 12 • ∆T j − 0.001 − K−1 on supply voltage ∆t 17 – 12 ----------------------------t 17 – 12 • ∆V P − −0.03 − V−1 −I15 − 15 25 µA pin 11 from pin 17 V11/V17 −1 0 +1 dB pin 12 from pin 17 V12/V17 0 +1 +2 dB pin 11 V 11 (3 MHz) ------------------------------------V 11 (0.5 MHz) 0 − 3.0 dB pin 12 V 12 (3 MHz) ------------------------------------V 12 (0.5 MHz) 0 − 3.0 dB (peak-to-peak value) Internal bias voltage Input current during picture content during sync. pulse Y-signal delay at pin 12 S1 open; R14 = 1.2 kΩ; notes 3 and 4 Fine adjustment of Y-signal delay for all 4 steps Signal delay between pin 11 and pin 12 Dependency of delay time Input switching current Y-signal attenuation f = 0.5 MHz Frequency response at 3 MHz referred to 0.5 MHz March 1991 note 5 7 Philips Semiconductors Preliminary specification Colour transient improvement circuit PARAMETER TDA4566 CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Frequency response at 5 MHz referred to 0.5 MHz note 5 pin 11 V 11 (5 MHz) ------------------------------------V 11 (0.5 MHz) pin 12 V 12 (5 MHz) ------------------------------------V 12 (0.5 MHz) −3.0 − 2.0 dB −3.0 − 2.0 dB DC output voltage pin 11 V11-18 1.8 2.3 2.6 V pin 12 V12-18 9.8 10.3 10.8 V source I11, 12 − − 0.4 mA sink −I11, 12 − − 1.0 mA Output current note 2 Notes 1. Output signal transient time measured with C6-18 = C9-18 = 220 pF without resistor (see Fig. 3). 2. Output current measured with emitter follower with constant current source of 0.6 mA. 3. R14-18 influences the bandwidth; a value of 1.2 kΩ results in a bandwidth of 5 MHz (typ.). 4. Delay time is proportional to resistor R14-18. Devices with suffix “A” require the value of the resistor to be 1.15 kΩ; a 27 kΩ; resistor connected in parallel with R14-18 = 1.2 kΩ.; 5. Frequency response measured with V15-18 = 9.5 V and switch S1 open. March 1991 8 Philips Semiconductors Preliminary specification Colour transient improvement circuit TDA4566 APPLICATION INFORMATION (1) Residual carrier reduced to 20 mV peak-to-peak (R = 1 kΩ, C = 100 pF). (2) Switching sequence for delay times shown in Table 1. (3) R14−18 = 1.2 kΩ for TDA4566. R14−18 = 1.15 kΩ for TDA4566A (27 kΩ resistor connected in parallel to 1.2 kΩ). Fig.3 Application diagram and test circuit. Table 1 Switching sequence for delay times. CONNECTION (2) VOLTAGE AT PIN 15 (a) (b) DELAY TIME (ns) (1) (c) 0 0 0 0 to 2.5 V 550 0 0 X 3.5 to 5.5 V 640 0 X X 6.5 to 8.5 V 730 X X X 9.5 to 12 V 820 Notes 1. When switch (S1) is closed the delay time is increased by 37 ns. 2. Where: X = connection closed; 0 = connection open. March 1991 9 Philips Semiconductors Preliminary specification Colour transient improvement circuit TDA4566 PACKAGE OUTLINE DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 1.40 1.14 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 0.85 inches 0.19 0.020 0.15 0.055 0.044 0.021 0.015 0.055 0.044 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.033 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 93-10-14 95-01-23 SOT102-1 March 1991 EUROPEAN PROJECTION 10 Philips Semiconductors Preliminary specification Colour transient improvement circuit TDA4566 with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. March 1991 11