PHILIPS PZTM1102

DISCRETE SEMICONDUCTORS
DATA SHEET
handbook, halfpage
M3D087
PZTM1102
PNP transistor/Schottky-diode
module
Product specification
File under Discrete Semiconductors, SC01
1996 May 09
Philips Semiconductors
Product specification
PNP transistor/Schottky-diode module
PZTM1102
FEATURES
DESCRIPTION
• Low output capacitance
Combination of a PNP transistor and a Schottky barrier diode in a plastic
SOT223 package. NPN complement: PZTM1101.
• Fast switching time
• Integrated Schottky protection
diode.
1
4
handbook, halfpage
APPLICATIONS
• High-speed switching for industrial
applications.
4
2
PINNING
1
PIN
DESCRIPTION
1
cathode Schottky
2
base
3
emitter
4
collector, anode Schottky
2
3
Top view
3
MAM237
Marking code: TM1102.
Fig.1 Simplified outline (SOT223) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
PNP transistor
VCBO
collector-base voltage
open emitter
−
−40
V
VCES
collector-emitter voltage
VBE = 0
−
−40
V
VEBO
emitter-base voltage
open collector
−
−6
V
IC
collector current (DC)
−
−200
mA
Schottky barrier diode
VR
continuous reverse voltage
−
40
V
IF
forward current (DC)
−
1
A
IF(AV)
average forward current
−
1
A
P
power dissipation
up to Tamb = 25 °C; note 1
−
0.5
W
Tj
junction temperature
reverse current applied
−
125
°C
forward current applied
−
150
°C
up to Tamb = 25 °C; note 2
−
1.2
W
Combined device
Ptot
total power dissipation
Tamb
operating ambient temperature
−55
+150
°C
Tstg
storage temperature
−55
+150
°C
Tj
junction temperature
−
150
°C
Notes
1. An additional copper area of >20 mm2 is required for pin 1, if power dissipation in the Schottky die is >0.5 W.
2. It is not allowed to dissipate the total power of 1.2 W in the Schottky die only.
1996 May 09
2
Philips Semiconductors
Product specification
PNP transistor/Schottky-diode module
PZTM1102
ELECTRICAL CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
NPN transistor
V(BR)CBO
collector-base breakdown
voltage
open emitter; IC = −10 µA; IE = 0;
Tamb = −55 to +150 °C; note 1
−40
−
V
V(BR)CES
collector-emitter
breakdown voltage
open base; IC = −1 mA; VBE = 0;
Tamb = −55 to +150 °C; note 1
−40
−
V
V(BR)EBO
emitter-base breakdown
voltage
open collector; IE = −10 µA; IC = 0;
Tamb = −55 to +150 °C; note 1
−6
−
V
ICES
collector-emitter cut-off
current
VCE = −20 V; VBE = 0
−
100
nA
50
µA
−
50
nA
−
10
µA
IC = −10 mA; IB = −1 mA
−
−200
mV
IC = −50 mA; IB = −3.2 mA
−
−300
mV
IC = −10 mA; IB = −1 mA
−
−250
mV
IC = −50 mA; IB = −3.2 mA
−
−350
mV
IC = −10 mA; IB = −1 mA
−
−850
mV
IC = −50 mA; IB = −5 mA
−
−950
mV
−
−1.0
V
IEBO
VCE = −20 V; VBE = 0; Tamb = −55 to +150 °C −
emitter-base cut-off current VEB = −6 V; IC = 0
VEB = −6 V; IC = 0; Tamb = −55 to +150 °C
VCEsat
VCEsat
VBEsat
collector-emitter saturation
voltage
collector-emitter saturation
voltage
base-emitter saturation
voltage
note 1
Tamb = −55 to +150 °C; note 1
note 1
base-emitter saturation
voltage
Tamb = −55 to +150 °C; note 1
−
−1.1
V
Cob
output capacitance
IE = ie = 0; VCB = −5 V; f = 1 MHz
−
4.5
pF
Cib
input capacitance
IC = ic = 0; VEB = −0.5 V; f = 1 MHz
−
10
pF
fT
transition frequency
IC = −10 mA; VCE = −20 V; f = 100 MHz
250
−
MHz
hFE
DC current gain
VCE = −1 V; note 1
IC = −0.1 mA
40
−
IC = −1 mA
70
−
IC = −10 mA
100
300
IC = −100 mA
30
−
IC = −10 mA
60
500
IC = −100 mA
15
−
VBEsat
IC = −10 mA; IB = −1 mA
IC = −50 mA; IB = −5 mA
hFE
DC current gain
VCE = −1 V; Tamb = −55 to +150 °C; note 1
SWITCHING TIMES (see Figs 2 and 3)
td
delay time
VCC = 5 V
3
7
ns
tr
rise time
IC = 50 mA
13
23
ns
ts
storage time
Vi = 0 to 5 V
tf
fall time
1996 May 09
3
200
380
ns
50
80
ns
Philips Semiconductors
Product specification
PNP transistor/Schottky-diode module
SYMBOL
PARAMETER
PZTM1102
CONDITIONS
MIN.
MAX.
UNIT
Schottky barrier diode
VF
IR
IR
Cj
forward voltage
reverse current
reverse current
junction capacitance
IF = 100 mA; note 1
−
330
mV
IF = 100 mA; Tamb = −55 to +150 °C; note 1
−
400
mV
IF = 1 A; note 1
−
500
mV
IF = 1 A; Tamb = −55 to +150 °C; note 1
−
560
mV
VR = 40 V; note 1
−
300
µA
VR = 40 V; Tj = 125 °C;
Tamb = −55 to +150 °C; note 1
−
35(2)
mA
VR = 10 V; note 1
−
40
µA
VR = 10 V; Tj = 125 °C;
Tamb = −55 to +150 °C; note 1
−
15(2)
mA
VR = 0 V; f = 1 MHz
−
250
pF
Notes
1. Measured under pulsed conditions: tp ≤ 300 µs; δ ≤ 0.01.
2. Limiting value for Tj = 125 °C; Tj = 150 °C with reverse current applied is not allowed as this may cause thermal
runaway leading to thermal destruction of the diode. A peak junction temperature of Tj = 150 °C is only allowed with
forward voltage applied.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient (for the transistor)
note 1
100
K/W
Rth j-a
thermal resistance from junction to ambient (for the Schottky diode) note 1
250
K/W
Note
1. Refer to SOT223 standard mounting conditions.
1996 May 09
4
Philips Semiconductors
Product specification
PNP transistor/Schottky-diode module
PZTM1102
GRAPHICAL DATA
5V
handbook, halfpage
VCC = 5 V DC
handbook, halfpage
7.5 kΩ
(5%)
INPUT
Vi
5.23 Ω
(1%)
0V
tp
Vo
5V
Vi
0V
825 Ω
(1%)
10%
90%
DUT
OUTPUT
Vo (pin 4)
90 Ω
(1%)
10%
90%
td
tf
tr
MBH222
ton
ts
toff
tr < 5 ns (10% to 90%); tp = 1 µs; δ = 0.02; Zi = 50 Ω.
ton = td + tr; toff = ts + tf.
Fig.2 Switching times test circuit.
1996 May 09
Fig.3 Input and output waveforms.
5
MBH223
Philips Semiconductors
Product specification
PNP transistor/Schottky-diode module
PZTM1102
PACKAGE OUTLINE
0.95
0.85
handbook, full pagewidth
S
0.1 S
seating plane
0.32
0.24
6.7
6.3
3.1
2.9
B
4
A
0.10
0.01
16 o
max
16
3.7
3.3
1
2
10
max
0.80
0.60
2.3
4.6
Dimensions in mm.
Fig.4 SOT223.
1996 May 09
7.3
6.7
o
o
1.80
max
0.2 M A
6
3
0.1 M B
(4x)
MSA035 - 1
Philips Semiconductors
Product specification
PNP transistor/Schottky-diode module
PZTM1102
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 May 09
7