DISCRETE SEMICONDUCTORS DATA SHEET 2N3553 Silicon planar epitaxial overlay transistor Product specification Supersedes data of October 1981 File under Discrete Semiconductors, SC08a 1995 Oct 27 Philips Semiconductors Product specification Silicon planar epitaxial overlay transistor 2N3553 APPLICATIONS DESCRIPTION • The 2N3553 is intended for use in VHF and UHF transmitting applications. The device is a silicon NPN overlay transistor in a TO-39 metal package with the collector connected to the case. PINNING - TO-39/3 PIN DESCRIPTION 1 emitter 2 base 3 1 2 handbook, halfpage collector MBB199 3 Fig.1 Simplified outline. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MAX. UNIT VCEX collector-emitter voltage IC ≤ 200 mA; VBE = −1.5 V 65 V VCEO collector-emitter voltage open base; IC ≤ 200 mA 40 V ICM peak collector current 1.0 A Ptot total power dissipation up to Tmb = 25 °C 7.0 W Tj junction temperature 200 °C fT transition frequency IC = 125 mA; VCE = 28 V 500 − RF performance f (MHz) VCE (V) Po (W) Gp (dB) η (%) 175 28 2.5 >10 >50 WARNING Product and environmental safety - toxic materials This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste. 1995 Oct 27 2 Philips Semiconductors Product specification Silicon planar epitaxial overlay transistor 2N3553 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter − 65 V VCEX collector-emitter voltage IC ≤ 200 mA; VBE = −1.5 V − 65 V VCEO collector-emitter voltage open base; IC ≤ 200 mA − 40 V open collector VEBO emitter-base voltage − 4 V IC collector current (DC) − 0.35 A ICM peak collector current − 1 A Ptot total power dissipation − 7 W Tstg storage temperature −65 +200 °C Tj junction temperature − 200 °C up to Tmb = 25 °C THERMAL CHARACTERISTICS SYMBOL Rth j-mb PARAMETER VALUE thermal resistance from junction to mounting base MGC928 10 25 UNIT K/W MGC927 10 handbook, halfpage handbook, halfpage Ptot (W) IC (A) 1 (2) 5 10-1 (1) (3) 10-2 0 1 10 VCE (V) 102 0 100 Tmb (oC) (1) All frequencies, including DC. (2) f ≥ 1 MHz. (3) Allowed during switching off, provided the transistor is cut-off with VBB ≤ −1.5 V; RBE ≥ 33 Ω; IC ≤ 200 mA and the transient energy ≤ 0.5 mW. Fig.2 DC SOAR. 1995 Oct 27 Fig.3 Power derating curve. 3 200 Philips Semiconductors Product specification Silicon planar epitaxial overlay transistor 2N3553 CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V(BR)CBO collector-base breakdown voltage open emitter; IC = 0.25 mA 65 − − V V(BR)CEO collector-emitter breakdown voltage open base; IC up to 200 mA; note 1 40 − − V V(BR)CEX collector-emitter breakdown voltage IC up to 200 mA; VBE = −1.5 V; 65 RB = 33 Ω; note 1 − − V V(BR)EBO emitter-base breakdown voltage open collector; IE = 0.25 mA 4 − − V VBE base-emitter voltage IC = 250 mA; VCE = 5 V − − 1.5 V VCEsat collector-emitter saturation voltage IC = 250 mA; IB = 50 mA − − 1.0 V ICEO collector leakage current open base; VCE = 30 V − − 0.1 mA hFE DC current gain VCE = 5 V; IC = 125 mA 15 − 200 VCE = 5 V; IC = 250 mA 10 − 100 fT transition frequency IC = 125 mA; VCE = 28 V − 500 − MHz Rhoie) real part of input impedance IC = 125 mA; VCE = 28 V; f = 200 MHz − − 20 Ω Cc collector capacitance VCB = 28 V; IE = ie = 0; f = 1 MHz − − 10 pF Note 1. Pulsed through an inductor of 25 mH; δ = 0.5; f = 50 Hz. MGC935 60 MGC930 20 handbook, halfpage handbook, halfpage Cc (pF) hFE 15 40 10 20 5 0 0 Fig.4 100 200 300 0 400 500 IC (mA) DC current gain as a function of collector current; typical values. 1995 Oct 27 Fig.5 4 0 20 40 VCB (V) 60 Collector capacitance as a function of collector-base voltage; typical values. Philips Semiconductors Product specification Silicon planar epitaxial overlay transistor 2N3553 APPLICATION INFORMATION RF performance at Tmb = 25 °C. f (MHz) VCE (V) Po (W) Gp (dB) η (%) 175 28 2.5 >10 >50 Ruggedness The transistor is capable of withstanding a load mismatch corresponding to VSWR = 3 : 1 varied through all phases, under the conditions: VCE = 28 V; f = 175 MHz; Tmb = 25 °C; Po = 2.5 W. +VCC handbook, full pagewidth L3 C1 (1) C2 output 50 Ω DUT L1 input 50 Ω C5 C3 L4 C4 L2 MGC926 (1) The length of the external emitter wire is 1.6 mm. Fig.6 Test circuit at 175 MHz. 1995 Oct 27 5 Philips Semiconductors Product specification Silicon planar epitaxial overlay transistor 2N3553 List of components (see Fig.6) COMPONENT DESCRIPTION VALUE DIMENSIONS C1, C2, C3, C4 air trimmer capacitor 4 to 29 pF C5 polyester capacitor 10 nF L1 1 turn 1.0 mm copper wire L2 Ferroxcube choke coil L3 15 turns enamelled 0.7 mm copper wire int. diameter 4 mm; closely wound L4 3 turns enamelled 1.5 mm copper wire int. diameter 12 mm; leads 2 × 20 mm; closely wound CATALOGUE No. int. diameter 10 mm; leads 2 × 10 mm Z = 550 Ω ±20%; f = 175 MHz 4312 020 36640 MGC937 600 MGC929 10 handbook, halfpage handbook, halfpage(1) fT (MHz) (2) Po (W) (3) (1) (2) (3) 400 (4) 5 200 0 100 200 300 (5) 0 400 100 0 IC (mA) Tj = 25 °C. VCE = 28 V; Tmb = 25 °C. (1) VCE = 28 V. (2) VCE = 14 V. (3) VCE = 7 V. (1) Pi = 0.5 W. (2) Pi = 0.375 W. (3) Pi = 0.25 W. Fig.7 Fig.8 Transition frequency as a function of collector current; typical values. 1995 Oct 27 6 200 300 f(MHz) 400 (4) Pi = 0.1 W. (5) Pi = 0.05 W. Output power as a function of frequency; typical values. Philips Semiconductors Product specification Silicon planar epitaxial overlay transistor 2N3553 PACKAGE OUTLINE handbook, full pagewidth 0.86 max 45 o 1 0.51 max 2 8.5 max 1.0 max 3 5.08 6.6 max 9.4 max Dimensions in mm. Fig.9 TO-39. 1995 Oct 27 7 12.7 min MSA241 Philips Semiconductors Product specification Silicon planar epitaxial overlay transistor 2N3553 DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1995 Oct 27 8