INTEGRATED CIRCUITS DATA SHEET TDA4570 NTSC decoder Product specification File under Integrated Circuits, IC02 August 1986 Philips Semiconductors Product specification NTSC decoder TDA4570 GENERAL DESCRIPTION The TDA4570 is an integrated 3,58 MHz or 4,43 MHz NTSC decoder. It is pin sequence compatible with multi-standard decoder TDA4555 and pin compatible with the PAL decoder TDA4510. Features Chrominance part • Gain controlled amplifier with operating point control stage • ACC (automatic chrominance control) with sampled rectification during burst-key signal • Blanking circuit for the colour burst signal Oscillator and control voltage part • Voltage controlled reference oscillator for double subcarrier frequency • Divider stages which provide the correct 90° phase between −(R-Y) and −(B-Y) reference signals for the demodulators • Phase comparator which controls the frequency and phase of the reference oscillator and compares the (R-Y) reference with the burst pulse • HUE control stage provides phase shifting via the combined service and hue control input (pin 11) • Identification demodulator provides a positive-going identification signal at pin 14 for NTSC signals and acts as the automatic colour killer • Two-function service switch: – position one (V14-3 < 1 V): switches the colour-ON and switches the hue control and burst for the PLL oscillator-OFF, allowing the adjustment of the reference oscillator – position two (V14-3 > 5 V): switches the colour-ON, the hue control OFF and allows the output signal to be observed • Sandcastle pulse detector for burst-gate, horizontal and horizontal/vertical blanking pulse detection. The vertical part of the sandcastle pulse is used for the internal colour-ON and colour-OFF delay • Pulse processing part for the prevention of premature switching ON of the colour. The colour-ON delay, two or three field periods after identification of the NTSC signal, is achieved by a counter. When there is no identification voltage present the colour is switched OFF immediately or, at the most, one field period later. Demodulator part • Two synchronous demodulators for the (R-Y) and (B-Y) signals, which incorporate stages for the blanking during line and field flyback • Internal filtering of the residual carrier in the demodulated colour difference signals • Colour switching stages controlled by the pulse processing part in front of the output stages • The output stages for (R-Y) and (B-Y) signals are low resistance n-p-n emitter followers • Separate colour switching output PACKAGE OUTLINE 16-lead DIL; plastic (SOT38); SOT38-1; 1996 November 28. August 1986 2 Philips Semiconductors Product specification TDA4570 Fig.1 Block diagram. NTSC decoder August 1986 3 Philips Semiconductors Product specification NTSC decoder TDA4570 RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage range VP = V7-3 10,8 to 13,2 V Currents at: pins 1 and 2 −I1, 2 max. 5 mA pin 16 −I16 max. 5 mA Total power dissipation Ptot max. 800 mW Storage temperature range Tstg −25 to 150 °C Operating ambient temperature range Tamb 0 to +70 °C THERMAL RESISTANCE From junction to ambient in free air Rth j-a max. 80 K/W CHARACTERISTICS VP = 12 V; Tamb = 25 °C; measured in Fig.2 unless otherwise specified PARAMETER SYMBOL MIN. TYP. MAX. UNIT IP = I7 − 50 − mA V9-3(p-p) 10 − 400 mV V9-3(p-p) − 100 − mV Input impedance Z9-3 − 3,3 − kΩ Input capacitance C9-3 − 4,0 − pF 3,58 MHz fosc − 7,16 − MHz 4,43 MHz fosc − 8,86 − MHz R13-3 − 350 − Ω ∆f ± 300 − − Hz V14-3 − 6,0 − V colour switching threshold V14-3 − 6,6 − V hysteresis of colour switching V14-3 − 150 − mV Colour-ON delay td on − − 3 (note 1) Colour-OFF delay td off − − 1 (note 1) Supply current Chrominance part Input voltage range (peak-to-peak value) Nominal input voltage (peak-to-peak value) with 75% colour bar signal Oscillator and control voltage part Oscillator frequency for subcarrier frequency Input resistance Catching range (depending on RC network between pins 12 and 3) Control voltage without burst signal August 1986 4 Philips Semiconductors Product specification NTSC decoder TDA4570 PARAMETER SYMBOL MIN. TYP. MAX. UNIT Colour switching output (open n-p-n emitter) output current −I16 − − 5, 0 mA colour-ON voltage V16-3 − 6,0 − V colour-OFF voltage V16-3 − 0 − V φ −5 0 +5 deg V11−3 = 2 V −φ 30 − − deg V11−3 = 4 V +φ 30 − − deg − 3 − V V11-3 0 − 1 V V11-3 5 − VP V −(R-Y) signal V1−3(p-p) 0,84 1,05 1,32 V −(B-Y) signal V2-3(p-p) 1,06 1,33 1,67 V V1 – 3 ------------V2 – 3 0,71 0,79 0,87 V1,2-3 − 7,7 − V (1 x subcarrier frequency) V1, 2-3(p-p) − − 20 mV (2 x subcarrier frequency) V1, 2-3(p-p) − − 30 mV HUE control and service switches Phase shift of reference carrier relative to the input signal V11−3 = 3 V Phase shift of reference carrier relative to phase at V11−3 = 3 V Internal source (open pin) First service position (PLL is inactive for oscillator adjustment, colour ON, HUE OFF) Second service position (colour ON, HUE OFF) Demodulator part Colour difference signals output voltage (peak-to-peak value) Ratio of colour difference output signals (R-Y)/(B-Y) D.C. voltage at colour difference outputs Residual carrier at colour difference outputs (peak-to-peak value) August 1986 5 Philips Semiconductors Product specification NTSC decoder PARAMETER TDA4570 SYMBOL MIN. TYP. MAX. UNIT Sandcastle pulse detector (note 2) Input voltage level (pin 15) to separate vertical and horizontal blanking pulses V15-3 1,3 1,6 1,9 V required pulse amplitude V15-3 2,0 2,5 3,0 V blanking pulse V15-3 3,3 3,6 3,9 V required pulse amplitude V15-3 4,1 4,5 4,9 V to separate burst gating pulse V15-3 6,6 7,1 7,6 V required pulse amplitude V15-3 7,7 − − V V15-3 − − 1,1 V −I15 − − 100 µA to separate horizontal Input voltage during horizontal scanning Input current Notes 1. Expressed as field periods. 2. The sandcastle pulse is compared with three internal threshold levels, which are proportional to the supply voltage. August 1986 6 NTSC decoder August 1986 7 Fig.2 Application diagram. Crystal frequency 7, 16 or 8,86 MHz; resonance resistance 60 Ω; load capacitance 20 pF; dynamic capacitance 22 fF and static capacitance 5,5 pF. Philips Semiconductors Product specification TDA4570 APPLICATION INFORMATION Philips Semiconductors Product specification NTSC decoder TDA4570 PACKAGE OUTLINE DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE August 1986 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 8 Philips Semiconductors Product specification NTSC decoder TDA4570 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. August 1986 9