BCM857BS PNP matched double transistor; ∆hFE = 10 % Rev. 02 — 11 April 2005 Product data sheet 1. Product profile 1.1 General description PNP matched double transistor in a SOT363 (SC-88) SMD plastic package. Matched version of BC857BS. The transistors are fully isolated internally. NPN equivalent: BCM847BS. 1.2 Features ■ Current gain matching ■ Base-emitter voltage matching 1.3 Applications ■ Current mirror ■ Differential amplifier 1.4 Quick reference data Table 1: Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - −45 V IC collector current - - −100 mA hFE DC current gain VCE = −5 V; IC = −2 mA 200 290 450 ∆hFE hFE matching VCE = −5 V; IC = −2 mA - - 10 % ∆VBE VBE matching VCE = −5 V; IC = −2 mA - - 2 mV BCM857BS Philips Semiconductors PNP matched double transistor; ∆hFE = 10 % 2. Pinning information Table 2: Pinning Pin Description Simplified outline 1 emitter TR1 2 base TR1 3 collector TR2 4 emitter TR2 5 base TR2 6 collector TR1 6 5 4 Symbol 6 5 4 TR2 TR1 1 2 3 1 2 3 sym018 3. Ordering information Table 3: Ordering information Type number BCM857BS Package Name Description Version SC-88 plastic surface mounted package; 6 leads SOT363 4. Marking Table 4: Marking codes Type number Marking code [1] BCM857BS A9* [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 9397 750 14723 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 11 April 2005 2 of 8 BCM857BS Philips Semiconductors PNP matched double transistor; ∆hFE = 10 % 5. Limiting values Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per transistor VCBO collector-base voltage open emitter - −50 V VCEO collector-emitter voltage open base - −45 V VEBO emitter-base voltage open collector - −5 V IC collector current (DC) - −100 mA ICM peak collector current single pulse; tp ≤ 1 ms - −200 mA Ptot total power dissipation Tamb ≤ 25 °C - 200 mW Tstg storage temperature −65 +150 °C Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C - 300 mW Per device total power dissipation Ptot [1] Tamb ≤ 25 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 6: Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit - - 416 K/W Per device Rth(j-a) [1] thermal resistance from junction to ambient in free air Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 9397 750 14723 Product data sheet [1] © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 11 April 2005 3 of 8 BCM857BS Philips Semiconductors PNP matched double transistor; ∆hFE = 10 % 7. Characteristics Table 7: Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per transistor ICBO collector-base cut-off VCB = −30 V; IE = 0 A current VCB = −30 V; IE = 0 A; Tj = 150 °C - - −15 nA - - −5 µA nA IEBO emitter-base cut-off current VEB = −5 V; IC = 0 A - - −100 hFE DC current gain VCE = −5 V; IC = −10 µA - 250 - VCE = −5 V; IC = −2 mA 200 290 450 −200 VCEsat collector-emitter saturation voltage IC = −10 mA; IB = −0.5 mA - −50 IC = −100 mA; IB = −5 mA - −200 −400 mV VBEsat base-emitter saturation voltage IC = −10 mA; IB = −0.5 mA - −760 - mV - −920 - mV VBE base-emitter voltage VCE = −5 V; IC = −2 mA -600 −650 −700 mV VCE = −5 V; IC = −10 mA - - −760 mV Cc collector capacitance VCB = −10 V; IE = ie = 0 A; f = 1 MHz - - 2.2 pF Ce emitter capacitance VEB = −0.5 V; IC = ic = 0 A; f = 1 MHz - 10 - pF fT transition frequency VCE = −5 V; IC = −10 mA; f = 100 MHz 100 250 - MHz IC = −100 mA; IB = −5 mA [1] mV Per device ∆hFE DC current gain matching VCE = −5 V; IC = −2 mA - - 10 % ∆VBE base-emitter voltage matching VCE = −5 V; IC = −2 mA - - 2 mV [1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. 9397 750 14723 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 11 April 2005 4 of 8 BCM857BS Philips Semiconductors PNP matched double transistor; ∆hFE = 10 % 8. Package outline 2.2 1.8 6 2.2 1.35 2.0 1.15 1.1 0.8 5 4 2 3 0.45 0.15 pin 1 index 1 0.25 0.10 0.3 0.2 0.65 1.3 Dimensions in mm 04-11-08 Fig 1. Package outline SOT363 (SC-88) 9. Packing information Table 8: Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. [1] Type number BCM857BS Package SOT363 Description 3000 10000 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135 4 mm pitch, 8 mm tape and reel; T2 [3] -125 -165 [1] For further information and the availability of packing methods, see Section 14. [2] T1: normal taping [3] T2: reverse taping 9397 750 14723 Product data sheet Packing quantity © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 11 April 2005 5 of 8 BCM857BS Philips Semiconductors PNP matched double transistor; ∆hFE = 10 % 10. Revision history Table 9: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes BCM857BS_2 20050411 Product data sheet - 9397 750 14723 BCM857BS_1 Modifications: BCM857BS_1 • • Table 7 Revaluation of data according to the latest control samples Table 7 ICBO unit for conditions VCB = 30 V; IE = 0 A; Tj = 150 °C amended to µA 20040914 Product data sheet - 9397 750 14723 Product data sheet 9397 750 13712 - © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 11 April 2005 6 of 8 BCM857BS Philips Semiconductors PNP matched double transistor; ∆hFE = 10 % 11. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 12. Definitions 13. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 14. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] 9397 750 14723 Product data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 02 — 11 April 2005 7 of 8 BCM857BS Philips Semiconductors PNP matched double transistor; ∆hFE = 10 % 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 3 3 4 5 5 6 7 7 7 7 © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 11 April 2005 Document number: 9397 750 14723 Published in The Netherlands