INTEGRATED CIRCUITS DATA SHEET SAA5700 Chinese Character System Teletext (CCST) decoder Preliminary specification File under Integrated Circuits, IC02 1997 May 16 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SAA5700 FEATURES • Acquisition and display of the 625-line PAL CCST Chinese standard for teletext, with Chinese and Latin character sets • Supports multiple DRAM sizes: 256K × 4 bits, 1M × 4 bits, 4M × 4 bits and 2 × 1M × 4 bits with an additional decoder/demultiplexer IC GENERAL DESCRIPTION • Acquires and stores in background up to (typically) 400 pages with 1M × 4 bits external DRAM The SAA5700 is a Chinese teletext decoder suitable for TV and multimedia applications. It incorporates all the data slicing, acquisition and display circuitry on-chip, as well as the logic for memory management. An external DRAM is used to store the currently displayed page and also the precaptured teletext pages. • CCST Fastext, with capability of displaying Chinese characters on Fastext prompt row • Meshing for reduced contrast video background in subtitles and boxes • Full line and screen colour to all edges of screen An external ROM is used to store the ideographic Chinese character set. There is a high level software interface with easy commands for the control of the decoder. Control is achieved via the I2C-bus. • Supports 625-line 50/100 Hz display modes • Scan-locked and stand-alone sync modes; supports video-locked sync modes with external PLL • Easy control via high level I2C-bus SAFARI commands The device is available in a QFP64 package. • Sync mode switching and picture centring via I2C-bus SAFARI commands • Supports external decryption unit for encrypted data. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME SAA5700GP 1997 May 16 QFP64 DESCRIPTION plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 × 20 × 2.8 mm 2 VERSION SOT319-2 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SAA5700 BLOCK DIAGRAM VDDD1 VSS1 VDDD2 VSS2 VSS3 VDDX VSSO VDDA VSSA handbook, full pagewidth 35 BLACK CVBS REF+ STN IREF 33 48 49 2 19 20 9 VSS 8 14,16, 26 FRONT END 4 ACQUISITION TIMING SYNC SEPARATOR 5 10 6 DATA ACQUISITION 1 OSCILLATOR AND CLOCK GENERATOR 12 MHz 7 6 MHz 64 59 63 60 PACKET BUFFER PROCESSOR BLOCK RAS CAS WE 27 21 42 DISPLAY INTERFACE 53 44 54, 41, 40, 38 to 36, 32 to 28 62 OSCIN RESET DCL DDA SCL SDA 24 MHz BUS ROMCS 61 OSCOUT 22 23 24 MEMORY INTERFACE R G B BLAN RA10 to RA0 55 to 58, 52, 51, 47, 46 17 DISPLAY TIMING RD7 to RD0 18 25 DISPLAY SECTION SAA5700 MGG539 Fig.1 Block diagram. 1997 May 16 3 LFB FFB/STTV ODD/EVEN Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SAA5700 PINNING SYMBOL PIN I/O DESCRIPTION OSCOUT 1 O VSS3 2 ground oscillator output to crystal n.c. 3 − BLACK 4 I/O CVBS 5 I STN 6 I/O IREF 7 I VSSA 8 ground 0 V power supply; analog VDDA 9 supply +5 V power supply; analog REF+ 10 I ADC voltage reference decoupling; 100 nF to VSSA i.c. 11 − internally connected; do not use i.c. 12 − internally connected; do not use i.c. 13 − internally connected; do not use ground for I/O pad buffers connect to VSS; internally connected to VSS1 and VSS2 not connected black level sample and hold capacitor; 100 nF to VSSA video signal input; 100 nF series capacitor, 250 Ω source impedance maximum, reference to VSSA ADC current reference decoupling; 100 nF to VSSA current reference input; 10 kΩ to VSSA VSS 14 ground n.c. 15 − VSS 16 ground LFB 17 I FFB/STTV 18 I/O scan field flyback input (VSYNC)/sync to TV output VDDX 19 supply +5 V power supply; connect to VDD for normal use connect to VSS for normal use not connected connect to VSS for normal use scan line flyback input (HSYNC) VSSO 20 ground R 21 O analog Red output G 22 O analog Green output B 23 O analog Blue output BLAN 24 O fast blanking (VDS) ODD/EVEN 25 O frame rate signal for hardware de-interlace (FRAME) VSS 26 ground ROMCS 27 O chip select (address decode) for ROM RA0 28 O bit 0 of address to DRAM, ROM and IC RA1 29 O bit 1 of address to DRAM, ROM and IC RA2 30 O bit 2 of address to DRAM, ROM and IC RA3 31 O bit 3 of address to DRAM, ROM and IC 1997 May 16 output stage current return and 0 V connect to VSS for normal use 4 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SYMBOL SAA5700 PIN I/O RA4 32 O VSS1 33 ground n.c. 34 − VDDD1 35 supply RA5 36 O bit 5 of address to DRAM, ROM and IC RA6 37 O bit 6 of address to DRAM, ROM and IC RA7 38 O bit 7 of address to DRAM, ROM and IC n.c. 39 − not connected RA8 40 O bit 8 of address to DRAM, ROM and IC RA9 41 O bit 9 of address to DRAM, ROM and IC RAS 42 O row address strobe to DRAM; active LOW n.c. 43 − not connected WE 44 O write enable to DRAM and IC; active LOW i.c. 45 − internally connected; do not use RD0 46 I/O bit 0 of data bus to/from DRAM, ROM and IC RD1 47 I/O bit 1 of data bus to/from DRAM, ROM and IC VDDD2 48 supply VSS2 49 ground n.c. 50 − RD2 51 I/O RD3 52 I/O bit 3 of data bus to/from DRAM, ROM and IC CAS 53 O column address strobe to DRAM; active LOW RA10 54 O bit 10 of address to DRAM, ROM and IC RD7 55 I/O bit 7 of data bus to/from DRAM, ROM and IC RD6 56 I/O bit 6 of data bus to/from DRAM, ROM and IC RD5 57 I/O bit 5 of data bus to/from DRAM, ROM and IC RD4 58 I/O bit 4 of data bus to/from DRAM, ROM and IC RESET 59 I DDA 60 I/O SCL 61 I SDA 62 I/O primary I2C-bus serial data DCL 63 O serial clock to optional Decryptor OSCIN 64 I oscillator input from crystal/external clock input 1997 May 16 DESCRIPTION bit 4 of address to DRAM, ROM and IC 0 V power supply digital; connected internally to VSS2 and VSS3 not connected +5 V power supply digital; connected internally to VDD2 +5 V power supply digital; connected internally to VDD1 0 V power supply digital; connected internally to VSS1 and VSS3 not connected bit 2 of data bus to/from DRAM, ROM and IC chip/processor reset input (active HIGH) bidirectional serial data to/from optional Decryptor primary I2C-bus serial clock input 5 Philips Semiconductors Preliminary specification 52 RD3 53 CAS 54 RA10 OSCOUT 1 51 RD2 VSS3 2 50 n.c. n.c. 3 49 VSS2 BLACK 4 48 VDDD2 CVBS 5 47 RD1 STN 6 46 RD0 IREF 7 45 i.c. VSSA 8 44 WE VDDA 9 43 n.c. REF+ 10 42 RAS i.c. 11 41 RA9 i.c. 12 40 RA8 i.c. 13 39 n.c. VSS 14 38 RA7 n.c. 15 37 RA6 VSS 16 36 RA5 LFB 17 35 VDDD1 FFB/STTV 18 34 n.c. VDDX 19 33 VSS1 6 RA4 32 RA3 31 RA2 30 RA1 29 RA0 28 ROMCS 27 VSS 26 ODD/EVEN 25 BLAN 24 B 23 G 22 R 21 VSSO 20 SAA5700 Fig.2 Pin configuration. 1997 May 16 55 RD7 56 RD6 57 RD5 58 RD4 SAA5700 59 RESET 60 DDA 61 SCL 62 SDA handbook, full pagewidth 63 DCL 64 OSCIN Chinese Character System Teletext (CCST) decoder MGG538 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SAA5700 HIGH LEVEL I2C-BUS COMMAND INTERFACE This device communicates via the I2C-bus using the SAFARI protocol. The following section indicates the protocol which is supported by this decoder. User commands Table 1 lists the CCST user command codes in TV mode; Table 2 lists the CCST user command codes in Text mode. Table 1 TV mode user command codes FUNCTION ID (HEX) Table 2 Text mode user command codes FUNCTION ID (HEX) FUNCTION FUNCTION 00 − 20 RED 01 − 21 GREEN 02 − 22 YELLOW 03 PICTURE 23 SUBTITLE 04 STATUS 24 STATUS 05 − 25 HOLD TOGGLE 06 − 26 REVEAL 07 TIME 27 CANCEL TOGGLE 08 − 28 INDEX 09 − 29 − 0A − 2A BROWSE 0B − 2B REVEAL SET TOGGLE 0C − 2C − 0D − 2D PREVIOUS 0E − 2E DISPLAY CHINESE PROMPT 0F − 2F SUBCODE TOGGLE 10 TV PROGRAMME 0 30 1 11 TV PROGRAMME 1 31 2 12 TV PROGRAMME 2 32 3 13 TV PROGRAMME 3 33 4 14 TV PROGRAMME 4 34 5 15 TV PROGRAMME 5 35 6 16 TV PROGRAMME 6 36 7 17 TV PROGRAMME 7 27 8 18 TV PROGRAMME 8 28 9 19 TV PROGRAMME 9 29 0 1A TV PROGRAMME 10 3A SIZE 1B TV PROGRAMME 11 3B UP 1C TV PROGRAMME 12 3C DOWN 1D TV PROGRAMME 13 3D CYAN 1E TV PROGRAMME 14 3E MIX 1F TV PROGRAMME 15 3F TEXT 1997 May 16 7 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SAA5700 Extended commands The extended commands for the decoder are listed in Table 3. Table 3 Extended commands OBJECT NAME Display PARAMETER LENGTH (BYTES) FUNCTION ID (HEX) 48 PARAMETERS ID (HEX) INPUT OUTPUT set sync mode 04 1 − sync mode set display position 08 4 − row start, line start none NAME INPUT OUTPUT none Processor 52 restart software 06 3 − FFFFFCH none Memory and OSD 53 read packet 03 1 [+1] 40 packet number, [Designation code] packet data write packet 06 1 +40 − packet number, packet data none 1997 May 16 OSD mode on 08 0 − none none OSD mode off 0A 0 − none none OSD display 0E 0 − none none clear display page 10 0 − none none 8 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SAA5700 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNITS VDDD1 digital supply voltage 1 −0.3 +6.5 V VDDD2 digital supply voltage 2 −0.3 +6.5 V VDDA analog supply voltage −0.3 +6.5 V VDDX supply voltage X −0.3 +6.5 V VI(max) maximum input voltage (any input) −0.3 VDD + 0.5 V VO(max) maximum output voltage (any output) −0.3 VDD + 0.5 V ∆VDDX-DDn supply voltage difference − 0.25 V II(d) diode input current (DC) − 20 mA IO(d) diode output current (DC) − 20 mA IO(max) maximum output current (any output) − 10 mA Tstg storage temperature −55 +125 °C Tamb operating ambient temperature −20 +70 °C between VDDX, VDDD1, VDDD2 and VDDA CHARACTERISTICS Tamb = −20 to +70 °C and VDDn = 4.5 to 5.5 V; unless otherwise indicated. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Power supplies VDDD1 digital supply voltage 1 4.5 5.0 5.5 V IDDD1 digital supply current 1 − 95 140 mA VDDD2 digital supply voltage 2 4.5 5.0 5.5 V IDDD2 digital supply current 2 − 2.4 6.5 mA VDDA analog supply voltage 4.5 5.0 5.5 V IDDA analog supply current − 40 53 mA VDDX supply voltage X 4.5 5.0 5.5 V IDDX supply current X − 32 40 mA IDD(tot) total supply current − 170 240 mA Vsync sync amplitude 0.1 0.3 0.6 V Vbur(p-p) colour burst amplitude (peak-to-peak value) 0 0.3 4 V VI(video)(p-p) video input amplitude (peak-to-peak value) 0.7 1.0 1.4 V VI(data) teletext data amplitude 0.29 0.46 0.71 V Zsource source impedance − − 250 Ω VSW(I) input switching level of sync separator 1.6 1.9 2.2 V Ci input capacitance − − 10 pF Inputs CVBS 1997 May 16 9 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SYMBOL PARAMETER SAA5700 CONDITIONS MIN. TYP. MAX. UNIT IREF RIREF resistor to VSSA VIREF voltage on IREF pin VDD = 5 V − 10 − kΩ − 2.3 − V RESET VIL LOW-level input voltage −0.3 − +0.8 V VIH HIGH-level input voltage 2.0 − VDD + 0.5 V ILI input leakage current −10 − +10 µA −0.3 − +0.6 V VI = 0 to VDD LFB (HSYNC) VIL LOW-level input voltage VIH HIGH-level input voltage 2.4 − VDD + 0.5 V Vhys input hysteresis voltage − 0.7 − V ILI input leakage current VI = 0 to VDD −10 − +10 mA II(max) maximum input current note 1 −1 − +1 µA tW(LFB) LFB input pulse width 200 − − ns ti(r) input rise time − − 100 ns ti(f) input fall time − − 100 ns −0.3 0.3VDD − V FFB (VSYNC) VIL LOW-level input voltage 0.7VDD VDD + 0.5 − V −10 +10 − µA maximum input current −1 +1 − mA tW(FFB) FFB input pulse width 1 − − display lines ti(r) input rise time − − 500 ns ti(f) input fall time − − 500 ns VIH HIGH-level input voltage ILI input leakage current II(max) VI = 0 to VDD Input/outputs REF+ CREF+ decoupling capacitor to VSSA − 100 − nF VREF+ DC voltage on REF+ 2.3 2.5 2.7 V OSCIN AND OSCOUT Vosc(p-p) oscillation amplitude (peak-to-peak value) − VDD − V Ci input capacitance − − 10 pF fosc oscillator frequency − 6.0 − MHz ∆fosc oscillator frequency tolerance − 500 − ppm CBLACK storage capacitor to VSSA − 100 − nF VBLACK black level for nominal sync amplitude 1.75 2.0 2.25 V BLACK 1997 May 16 10 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SYMBOL ILI PARAMETER input leakage current SAA5700 CONDITIONS VI = 0 to VDD MIN. TYP. MAX. UNIT −10 − +10 µA STN CSTN decoupling capacitor to VSSA − 100 − nF VSTN DC voltage on STN 0.95 1.1 1.25 V kHz SCL (OPEN-DRAIN) fSCL SCL clock frequency 0 − 400 VIL LOW-level input voltage −0.5 − +1.5 V VIH HIGH-level input voltage 3.0 − VDD + 0.5 V VOL LOW-level output voltage IOL = 3 mA 0 − 0.4 V IOL = 6 mA 0 − 0.6 V VI = 0 to VDD ILI input leakage current −10 − +10 µA Ci input capacitance − − 10 pF CL load capacitance − − 400 pF ti(r) input rise time fSCL = 100 kHz; note 2 50 − 1000 ns fSCL = 400 kHz; note 2 50 − 300 ns fSCL = 100 kHz; note 3 50 − 300 ns fSCL = 400 kHz; note 3 50 − 300 ns 3 to 1.5 V; IOL = 3 mA 50 − 250 ns ti(f) to(f) input fall time output fall time SDA (OPEN-DRAIN) VIL LOW-level input voltage −0.5 − +1.5 V VIH HIGH-level input voltage 3.0 − VDD + 0.5 V VOL LOW-level output voltage ILI input leakage current IOL = 3 mA 0 − 0.4 V IOL = 6 mA 0 − 0.6 V VI = 0 to VDD −10 − +10 µA Ci input capacitance − − 10 pF CL load capacitance − − 400 pF ti(r) input rise time fSCL = 100 kHz; note 2 50 − 1000 ns fSCL = 400 kHz; note 2 50 − 300 ns fSCL = 100 kHz; note 3 50 − 300 ns fSCL = 400 kHz; note 3 50 − 300 ns 3 to 1.5 V; IOL = 3 mA 50 − 250 ns ti(f) to(f) 1997 May 16 input fall time output fall time 11 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SYMBOL PARAMETER SAA5700 CONDITIONS MIN. TYP. MAX. UNIT DCL AND DDA (INTERNAL PULL-DOWN RESISTOR) VIL LOW-level input voltage −0.3 − +0.8 V VIH HIGH-level input voltage 2.0 − VDD + 0.5 V VOL LOW-level output voltage IOL = 1.6 mA 0 − 0.4 V ILI input leakage current VI = 0 to VDD −10 − +10 µA Ci input capacitance − − 10 pF CL load capacitance − − 50 pF to(f) output fall time − − 10 ns 2.2 to 0.6 V; IOL = 1.6 mA RD7 TO RD0 VIL LOW-level input voltage −0.3 − +0.8 V VIH HIGH-level input voltage 2.0 − VDD + 0.5 V VOL LOW-level output voltage IOL = 1.6 mA 0 − 0.4 V VOH HIGH-level output voltage IOH = −0.2 mA 2.4 − VDD V ILI input leakage current VI = 0 to VDD −10 − +10 µA Ci input capacitance − − 10 pF CL load capacitance − − 30 pF to(r) output rise time into CL 0.6 to 2.2 V − − 10 ns to(f) output fall time into CL 2.2 to 0.6 V − − 10 ns VOL LOW-level output voltage IOL = 1.6 mA 0 − 0.4 V VOH HIGH-level output voltage IOH = −0.2 mA 2.4 − VDD V CL load capacitance − − 50 pF to(r) output rise time into CL 0.6 to 2.2 V − − 5 ns to(f) output fall time into CL 2.2 to 0.6 V − − 5 ns Outputs CAS RAS, WE, ROMCS, RA10 TO RA0 VOL LOW-level output voltage IOL = 1.6 mA 0 − 0.4 V VOH HIGH-level output voltage IOH = −0.2 mA 2.4 − VDD V CL load capacitance − − 50 pF to(r) output rise time into CL 0.6 to 2.2 V − − 10 ns to(f) output fall time into CL 2.2 to 0.6 V − − 10 ns ODD/EVEN (FRAME) VOL LOW-level output voltage IOL = 1.6 mA 0 − 0.4 V VOH HIGH-level output voltage IOH = −0.2 mA 2.4 − VDD V CL load capacitance − − 200 pF to(r) output rise time into CL 0.6 to 2.2 V − − 200 ns to(f) output fall time into CL 2.2 to 0.6 V − − 200 ns 1997 May 16 12 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SYMBOL PARAMETER SAA5700 CONDITIONS MIN. TYP. MAX. UNIT STTV VSTTV VCS, TCS amplitude 0.2 0.3 0.4 V VSTTV(DC) nominal DC voltage 1.85 2.0 2.15 V IO(drive) output drive − − 3 mA IOL LOW-level output current (black level) −10 − +10 µA IOH HIGH-level output current (full intensity) 5.1 6.0 6.9 mA RL load resistance to VSSO for nominal 1 V(p-p) output − 160 − Ω CL load capacitance − − 20 pF to(r) output rise time 10% to 90% − − 15 ns to(f) output fall time 90% to 10% − − 15 ns VOH HIGH-level output voltage IOH = −2 mA VDD − 0.25 − VDD V VOL LOW-level output voltage IOL = 2 mA 0 − 0.2 V CL load capacitance − − 50 pF to(r) output rise time 10% to 90% − − 15 ns to(f) output fall time 90% to 10% − − 15 ns tSK skew delay between outputs R,G,B and BLAN − − 15 ns R, G AND B VDDX = 5 V BLAN (VDS) Notes 1. This current is the maximum allowed into the inputs when line and field flyback signals are connected to these inputs. An external series resistor must be used to limit the input currents to 1 mA. 2. Measured from VIL(max) to VIH(min). 3. Measured from VIH(min) to VIL(max). 1997 May 16 13 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder Table 4 SAA5700 I2C-bus Timing (see note 1 and Fig.3) 100 kHz SYMBOL 400 kHz PARAMETER UNIT MIN. MAX. MIN. MAX. fSCL SCL clock frequency 0 100 0 400 kHz tLOW LOW period of the SCL clock 4.7 − 1.3 − µs tHIGH HIGH period of the SCL clock 4.0 − 0.6 − µs tSU;DAT data set-up time 250 − 100 − µs tHD;DAT date hold time 0 − 0 − µs tSU;STO set-up time clock HIGH to STOP 4.7 − 0.6 − µs tBUF set-up time STOP to START 4.7 − 1.3 − µs tHD;STA START hold time 4.0 − 0.6 − µs tSU;STA set-up time clock rising edge to START 4.7 − 0.6 − µs tr rise time of both SDA and SCL signals − 1000 − 300 ns tf fall time of both SDA and SCL signals − 300 − 300 ns Note 1. The I2C-bus interface pins SDA and SCL may pull the data and clock lines below 3 V while the power supply VDD is in the range 0.4 to 0.8 V. Outside this range, the SDA and SCL pins behave correctly. handbook, full pagewidth tHIGH tLOW tr tf SCL tSU;STA tSU;DAT tSU;STO tHD;DAT tHD;STA SDA MGG541 tBUF Fig.3 Primary I2C-bus timing. 1997 May 16 14 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SAA5700 DRAM Interface timing (see note 1 and Fig.4) SYMBOL PARAMETER MIN. TYP. MAX. UNIT Tcy(RAS) RAS cycle time − 375 − ns tpch(RAS) RAS precharge time 60 − − ns th(CAS) CAS hold time 80 − − ns td(RAS-CAS) RAS to CAS delay time 20 − − ns tWL(CAS) CAS pulse width LOW 20 − − ns Tcy(CAS) CAS page mode cycle time 50 − − ns tpch(CAS) CAS precharge time 10 − − ns th(CAS-RAS) RAS hold time after CAS 20 − − ns tpch(CAS-RAS) CAS to RAS precharge time 10 − − ns tsu(RA) row address set-up time 0 − − ns th(RA) row address hold time 10 − − ns tsu(CA) column address set-up time 0 − − ns th(CA) column address hold time 15 − − ns tsu(R) read command set-up time 0 − − ns th(R)(CAS) read command hold time from (CAS) 0 − − ns th(R)(RAS) read command hold time from (RAS) 10 − − ns tsu(W) write command set-up time 0 − − ns th(W) write command hold time 15 − − ns tsu(i)(D) data input set-up time 0 − − ns th(i)(D) data input hold time 15 − − ns tACC(R)(CAS) read access time from (CAS) − − 20 ns tACC(R)(RAS) read access time from (RAS) − − 80 ns Note 1. Based on a display clock frequency of 24 MHz, maximum 24 MHz + 500 ppm. 1997 May 16 15 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SAA5700 tRP handbook, full pagewidth tCYC RAS tRSH tCSH tPC CAS tRCD tASR tCP tCAS tASC tCAH tRAH ADDRESS tRRH tRCH tRCS WE tCAC READ CYCLE RD OUT tRAC tWCS tWCH WE tDH WRITE CYCLE tDS RD IN MGG542 Fig.4 DRAM interface timing. 1997 May 16 16 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SAA5700 APPLICATION INFORMATION handbook, full pagewidth 0V +5 V 100 nF VDDD1 OSCIN 35 100 nF VSS1 33 OSCOUT 22 pF 100 nF CVBS VSS3 100 nF 100 nF 100 nF 100 nF +5 V HSYNC VSYNC TV display R/G/B/BLAN RGB ground 48 2 49 53 5 42 IREF STN REF+ BLACK VDDA LFB 0V +5 V 100 nF 1 75 Ω 10 kΩ DCL 60 DDA 44 CVBS VSSA front end 19 63 100 kΩ 22 pF VDDX 64 6 MHz crystal oscillator +5 V VDDD2 VDD VSS2 VSS WE WE CAS CAS RAS RAS RD3 to RD0 D3 to D0 52, 51, 47, 46 8 A10 to A0 28 to 32, RA0 to RA10 36 to 38, 40,41,54 7 OE 0V 6 SAA5700 10 I2C-bus to microcontroller D7 to D4 55 to 58 9 A18 to A0 ROM 17 FFB 18 R/G/B/BLAN 21 to 24 VSSO 20 ODD/EVEN DI SDA SCL 62 61 OE DO OE 25 59 VDD VSS CE +5 V 0V EN 27 ROMCS MGG540 14 16 26 RESET VSS VSS VSS RESET Fig.5 Application Diagram. 1997 May 16 +5 V D3 to D0 RD7 to RD4 4 74LS573 ODD/EVEN DRAM 17 0V 0V Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SAA5700 PACKAGE OUTLINE QFP64: plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm SOT319-2 c y X 51 A 33 52 32 ZE Q e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 20 64 detail X 19 1 ZD w M bp e v M A D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp Q v w y mm 3.20 0.25 0.05 2.90 2.65 0.25 0.50 0.35 0.25 0.14 20.1 19.9 14.1 13.9 1 24.2 23.6 18.2 17.6 1.95 1.0 0.6 1.4 1.2 0.2 0.2 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 θ Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-04 SOT319-2 1997 May 16 EUROPEAN PROJECTION 18 o 7 0o Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SAA5700 SOLDERING Wave soldering Introduction Wave soldering is not recommended for QFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. If wave soldering cannot be avoided, the following conditions must be observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). • The footprint must be at an angle of 45° to the board direction and must incorporate solder thieves downstream and at the side corners. Reflow soldering Even with these conditions, do not consider wave soldering the following packages: QFP52 (SOT379-1), QFP100 (SOT317-1), QFP100 (SOT317-2), QFP100 (SOT382-1) or QFP160 (SOT322-1). Reflow soldering techniques are suitable for all QFP packages. The choice of heating method may be influenced by larger plastic QFP packages (44 leads, or more). If infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. For more information, refer to the Drypack chapter in our “Quality Reference Handbook” (order code 9397 750 00192). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. 1997 May 16 19 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SAA5700 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1997 May 16 20 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SAA5700 NOTES 1997 May 16 21 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SAA5700 NOTES 1997 May 16 22 Philips Semiconductors Preliminary specification Chinese Character System Teletext (CCST) decoder SAA5700 NOTES 1997 May 16 23 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 São Paulo, SÃO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com © Philips Electronics N.V. 1997 SCA54 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 547047/50/01/pp24 Date of release: 1997 May 16 Document order number: 9397 750 01008