INTEGRATED CIRCUITS DATA SHEET SAA5261; SAA5262; SAA5263 10-page intelligent teletext decoders Product specification File under Integrated Circuits, IC02 1998 Apr 22 Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 FEATURES SAA5261, SAA5262 and SAA5263 • Complete 625-line teletext decoder in a single integrated circuit thereby reducing printed-circuit board area and cost • Automatic detection of transmitted pages so that only existing pages will be selected by page-up and page-down once inventory validated SAA5262 and SAA5263 • Automatic Channel Installation (ACI) • Automatic detection of transmitted Fastext links or service information (packet 8/30) • Enhanced SAFARI interface providing additional commands. • On-screen display for user interface (menus, etc.) using teletext and dedicated menu icons SAA5263 • Video Programming System (VPS) decoding • Electronic Programme Guide (EPG) feature. • Wide Screen Signalling (WSS) decoding • 8-page Fastext decoder GENERAL DESCRIPTION • 6-page TOP decoder in addition to capture of Basic TOP Table (BTT) and 3 Additional Information Table (AIT) pages The SAA526xPS ICs are single-chip 10-page 625-line World System Teletext (WST) decoders with a high level command interface, SAFARI compatible. • 4-page user defined list mode It has been designed so that the overall system cost is kept to a minimum. This has been achieved through the capability of the device to be driven from a single +5 V power supply, low cost 12 MHz crystal oscillator and the high level command interface, which offers the benefit of low software overhead in the TV microcontroller. • Yugoslavian, Cyrillic, Greek/Turkish, Thai, Arabic/Hebrew, Pan-European and Arabic/English/French language coverage • High level command interface via I2C-bus giving easy control from a low software overhead The SAA526xPS offers automatic detection of Fastext or TOP transmissions. The device also incorporates a facility to detect the pages in the transmission, which allows only transmitted pages to be selected by page-up and page-down. • High level command interface is backward compatible to SAFARI interface • 625 and 525 line display • RGB interface to standard colour decoder ICs, push-pull output drive SAA5262 and SAA5263 provide Automatic Channel Installation (ACI) information. • Versatile 8-bit open-drain I/O expander • Single 12 MHz crystal oscillator for reduced cost SAA5263 provides access to Electronic Programme Guide (EPG) information. • +5 V power supply. 1998 Apr 22 2 Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION SAA5261PS SDIP52 plastic shrink dual in-line package; 52 leads (600 mil) SOT247-1 SAA5262PS SDIP52 plastic shrink dual in-line package; 52 leads (600 mil) SOT247-1 SAA5263PS SDIP52 plastic shrink dual in-line package; 52 leads (600 mil) SOT247-1 QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VDDD digital supply voltage 4.5 5.0 5.5 V IDDD(M) microcontroller supply current − 20 35 mA IDDA analog supply current − 35 50 mA IDDD(T) teletext supply current − 50 80 mA fxtal crystal frequency − 12 − MHz Tamb operating ambient temperature −20 − +70 °C 1998 Apr 22 3 Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 BLOCK DIAGRAM PON handbook, full pagewidth VDS RGBREF COR 35 30 29 43 RESET POWER-ON RESET G B VDDA R 31 32 33 34 38 VDDD(T) 39 DRAM REFRESH AND TIMING DISPLAY VDDD(M) 44 10 k × 8 DRAM 9 to 12 27 res FRAME 24 TO 18 HAMMING DECODER PACKET 26 PROCESSING ENGINE MEMORY INTERFACE 52 20 16 48 SAA526xPS PL 21 TELETEXT ACQUISITION AND DECODING SYSTEM CONTROLLER 17 47 18 46 19 45 1-8 51 VPS ACQUISITION AND DECODING SERIAL-TOPARALLEL CONVERTER WSS ACQUISITION AND DECODING I2C-BUS INTERFACE 15 14 50 49 25 26 Iref DATA SLICER AND CLOCK REGENERATOR TELETEXT OR VPS CONTROL ANALOGREFERENCE GENERATOR ANALOGTO-DIGITAL CONVERTER 22 13 36 INPUT CLAMP AND SYNC SEPARATOR 12 MHz CLOCK GENERATOR 28 23 24 42 41 VSSA VSSD1 VSSD2 CVBS1 CVBS2 XTALO XTALI Fig.1 Block diagram. 1998 Apr 22 DISPLAY CLOCK GENERATOR 4 37 40 E/W PDI SA DISLCBD FP DIS8/30 HSMODE DISDSR VSMODE PUINL V0-V7 ME8/30T SDA1 SCL1 SDA2 SCL2 BLACK HSYNC VSYNC OSCGND MGL418 Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 PINNING SYMBOL PIN DESCRIPTION V0 1 versatile open-drain input/output bit 0 (should be tied HIGH) V1 2 versatile open-drain input/output bit 1 (should be tied HIGH) V2 3 versatile open-drain input/output bit 2 (should be tied HIGH) V3 4 versatile open-drain input/output bit 3 (should be tied HIGH) V4 5 versatile open-drain input/output bit 4 (should be tied HIGH) V5 6 versatile open-drain input/output bit 5 (should be tied HIGH) V6 7 versatile open-drain input/output bit 6 (should be tied HIGH) V7 8 versatile open-drain input/output bit 7 (should be tied HIGH) res 9 reserved res 10 reserved res 11 reserved res 12 reserved VSSD1 13 digital ground 1 SCLK1 14 serial clock input 1 (NVRAM) SDAT1 15 serial data input/output 1 (NVRAM) SA 16 slave address input: LOW selects 58H; HIGH selects 60H FP 17 field polarity input: LOW selects first half line; HIGH selects second half line at the start of an even field HSMODE 18 horizontal sync mode control input: LOW selects HSYNC on rising edge VSMODE 19 vertical sync mode control input. LOW selects VSYNC on rising edge PDI 20 power-down imminent input: this input should be pulled LOW to indicate that the system is about to lose power PL 21 phase-lock output: HIGH indicates that the system is phase-locked to the CVBS input VSSA 22 analog ground CVBS1 23 CVBS input: this signal is applied via a 100 nF capacitor (nominal input 1 V (p-p) CVBS2 24 this pin should be connected to ground if unused BLACK 25 black level input: a 100 nF capacitor should be connected to VSSA Iref 26 reference current input for analog circuits: for correct operation a 27 kΩ resistor should be connected to VSSA FRAME 27 Frame output for use in non-interlaced displays: during teletext off, teletext mixed with TV picture and subtitles this pin is inactive. In full teletext mode this pin provides a 25 Hz square wave. FRAME = 1 = odd, FRAME = 0 = even. VSSD2 28 digital ground 2 COR 29 contrast reduction: active LOW output which allows selective contrast reduction of the television picture to enhance a mixed mode display PON 30 picture on output: HIGH indicates that a TV picture is present and that the SAA526xPS is in TV mode, mix mode, subtitle mode or news flash mode RGBREF 31 RGB reference input: drive level reference for RGB outputs B 32 blue dot rate character output of the blue colour information: the high voltage level is defined by the RGBREF pin (can source 4 mA) 1998 Apr 22 5 Philips Semiconductors Product specification 10-page intelligent teletext decoders SYMBOL SAA5261; SAA5262; SAA5263 PIN DESCRIPTION G 33 green dot rate character output of the green colour information: the high voltage level is defined by the RGBREF pin (can source 4 mA) R 34 red dot rate character output of the red colour information: the high voltage level is defined by the RGBREF pin (can source 4 mA) VDS 35 push-pull output for blanking the TV picture HSYNC 36 horizontal sync input: the polarity of this pulse is set by input HSMODE VSYNC 37 vertical sync input: the polarity of this pulse is set by input VSMODE VDDA 38 analog supply voltage (+5 V) VDDD(T) 39 digital supply voltage for teletext circuits (+5 V) OSCGND 40 ground for crystal oscillator XTALI 41 12 MHz crystal oscillator input XTALO 42 12 MHz crystal oscillator output RESET 43 reset input VDDD(M) 44 digital supply voltage for microcontroller (+5 V) PUINL 45 power-up in list mode control input: LOW selects auto TOP/Fastext on power-up; HIGH selects LIST mode on power-up DISDSR 46 disable default status row input: LOW enables display of status row DIS8/30 47 disable packet 8/30 display input: LOW enables display of packet 8/30 DISLCBD 48 disable Link Control Byte (LCB) decode input: LOW enables decoding of the LCB in Fastext SCLK2 49 serial clock input (I2C-bus) SDAT2 50 serial data input/output (I2C-bus) ME8/30T 51 mesh 8/30 and time displays input: HIGH will select a meshed display for the packet 8/30 and time E/W 52 East/West language select input: LOW selects West language 1998 Apr 22 6 Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 handbook, halfpage V0 1 52 E/W V1 2 51 ME8/30T V2 3 50 SDA2 V3 4 49 SCL2 V4 5 48 DISLCBD V5 6 47 DIS8/30 V6 7 46 DISDSR V7 8 45 PUINL res 9 44 VDDD(M) res 10 43 RESET res 11 42 XTALO res 12 41 XTALI VSSD1 13 40 OSCGND SAA526xPS SCL1 14 39 VDDD(T) SDA1 15 38 VDDA SA 16 37 VSYNC FP 17 36 HSYNC HSMODE 18 35 VDS VSMODE 19 34 R PDI 20 33 G PL 21 32 B VSSA 22 31 RGBREF CVBS1 23 30 PON CVBS2 24 29 COR BLACK 25 28 VSSD2 Iref 26 27 FRAME MGL417 Fig.2 Pin configuration. 1998 Apr 22 7 Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 HIGH LEVEL COMMAND INTERFACE The I2C-bus interface is used to pass control commands and data between the SAA526xPS and the television microcontroller. The interface uses high level commands, which are backward compatible with the SAFARI interface. The formats for the I2C-bus transmission are as follows: Table 1 User command I2C-bus ADDRESS START Table 2 ACK COMMAND WRITE ACK COMMAND READ ACK DATA ACK Table 3 I2C-bus ADDRESS ACK PARAMETER ACK STOP System read I2C-bus ADDRESS START NACK STOP I2C-bus address PIN 16 = LOW Table 5 STOP System command START Table 4 WRITE PIN 16 = HIGH ADDRESS DESCRIPTION ADDRESS DESCRIPTION 01 01 100 read = 1; write = 0 0110 000 read = 1; write = 0 Control commands COMMAND BYTE (HEX) DATA BYTE 03 04 07 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E − − − − − − − − − − − − − − − − − − 1998 Apr 22 COMMAND DESCRIPTION picture TV status time program 0 program 1 program 2 program 3 program 4 program 5 program 6 program 7 program 8 program 9 program 10 program 11 program 12 program 13 program 14 8 COMMAND BYTE (HEX) DATA BYTE 1F 20 21 22 23 24 25 26 27 28 29 2B 2C 2D 2F 30 31 32 − − − − − − − − − − − − − − − − − − COMMAND DESCRIPTION program 15 red green yellow subtitle text status hold reveal cancel index list toggle reveal toggle store previous subcode digit 1 digit 2 digit 3 Philips Semiconductors Product specification 10-page intelligent teletext decoders COMMAND BYTE (HEX) 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 4A 89 91 92 93 94 98 99 9A 9B 9C 9D 9E 9F A0 DATA BYTE − − − − − − − − − − − − − 0 00 to 41 00 to 03 or 00 to 80 00 00 or 01 0 OSD data 0 0 0 0 0 0, row, column 0 followed by 20 bytes 00 to FF A1 00 to FF A2 00 to FF A3 B0 B1 B2 B8 1998 Apr 22 PWM No. reg reg reg PWM data data data data 0 SAA5261; SAA5262; SAA5263 COMMAND BYTE (HEX) COMMAND DESCRIPTION digit 4 digit 5 digit 6 digit 7 digit 8 digit 9 digit 0 size up down cyan mix text read PAL + line select list force mode DATA BYTE COMMAND DESCRIPTION SAA5262 and SAA5263 only B9 C0 C1 C2 C3 D0 D1 D2 D3 D4 D5 D6 read broadcast status read network identification read PCS byte OSD mode on OSD mode off OSD display on OSD display off OSD cursor on OSD cursor off OSD position OSD data write D7 D8 D9 0 0 = disable 1 = enable 0 0 information type 0 page type and page number page type page type and language page type row 24 control start column and length string string type, index length and string option type and values movement type get time set ACI mode get ACI status select next ACI channel get ACI information get device version set page number get page number set language get language enable/disable row 24 set row 24 contents set string contents set option move cursor SAA5263 only C8 C9 CA CB bitwise parameter or V7 to V0 bitwise parameter and V7 to V0 returns V7 to V0 on I2C-bus read PWM control CC CD CE or text register and text register read text register quick list 9 EPG mode 0 number and list of features 0 set EPG mode get EPG status set EPG feature list get number of EPG CNIs found CNI index get found EPG CNIs number and list set EPG CNI list of CNIs table type, item get EPG item type and string information index Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 64 µs handbook, full pagewidth 23 lines 10.5 µs ∆X 52 µs ∆Y 40 µs 25 rows TEXT DISPLAY AREA 250 lines 287 lines 312 lines 40 characters TV PICTURE AREA FIELD SCANNING AREA MGL122 Fig.3 625 display format. 63.55 µs handbook, full pagewidth 17 lines 10.5 µs ∆X 52 µs ∆Y 40 µs 25 rows TEXT DISPLAY AREA 225 lines 243 lines 40 characters TV PICTURE AREA FIELD SCANNING AREA MGL123 Fig.4 525 display format. 1998 Apr 22 10 263 lines Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 CHARACTER SETS Geographical coverage handbook, full pagewidth , , ,, MGL412 Fig.5 SAA5261PS/101 Yugoslavia. handbook, full pagewidth ,,,,,,, , ,, ,,,,,,, , , ,,,,,,, ,,,,,,, , , ,,,,,,, ,,,,,,, ,,,,,,,, MGL128 Fig.6 SAA5261PS/109 Cyrillic, SAA5262PS/122 Cyrillic. 1998 Apr 22 11 Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 handbook, full pagewidth ,, , ,,,,, ,, , , ,,,,, ,,, , ,,, ,,,,, ,,,,, ,,,,, ,, MGL129 Fig.7 SAA5261/113 Greek/Turkish, SAA5262PS/123 Greek/Turkish. handbook, full pagewidth ,, ,, ,,,,,,, ,,,,, ,,,,, ,,,,,, ,,, , MGL132 Fig.8 SAA5261PS/104 Thai, SAA5262PS/124 Thai. 1998 Apr 22 12 Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 ook, full pagewidth ,,,,,,,,, ,,,,,,,,, ,,,,,,,,, ,,,,,,,,, ,,,,,,,,, MGL130 Fig.9 SAA5261P/105 Arabic/Hebrew, SAA5262PS/125 Arabic/Hebrew. handbook, full pagewidth ,,,, ,,,, ,,,, ,,,,, , ,,,, , ,, ,, ,,,,, , , ,,,, , ,, ,, ,,,,, ,, ,,,,, ,,, , , ,,,,, ,,,,, MGL133 Fig.10 SAA5261PS/117 Pan-European, SAA5262PS/128 Pan-European/Eastern, SAA5263PS/137 Pan-European. 1998 Apr 22 13 Philips Semiconductors Product specification 10-page intelligent teletext decoders handbook, full pagewidth SAA5261; SAA5262; SAA5263 ,, ,,,,,,,,, ,, , ,,,,,,,,, , ,,,,,,,,, ,,,,,,,,, ,,,,,,,,, ,,,,,,,,, ,,,,,,,,, ,,,,,,,,, MGL131 Fig.11 SAA5261PS/108 Arabic/English/French, SAA5262PS/126 Arabic/English/French. ndbook, full pagewidth ,,,,, ,,,,, ,,,,, ,,,,, MGL413 Fig.12 SAA5261PS/110 Iranian, SAA5262PS/120 Iranian. The character sets for the languages Yugoslavian, Cyrillic, Greek/Turkish, Thai, Arabic/Hebrew, Pan-European, Arabic/English/French and Iranian are available on request. 1998 Apr 22 14 Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 LIMITING VALUES In accordance with Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDDD digital supply voltages −0.3 +6.5 V VDDA analog supply voltage −0.3 +6.5 V VI input voltage (any input) note 1 −0.3 VDDD(M) + 0.5 V VO output voltage (any output) note 1 −0.3 VDDD(M) + 0.5 V IO output current (each output) − ±10 mA II/OK DC input or output diode current − ±20 mA Tamb operating ambient temperature −20 +70 °C Tstg storage temperature −55 +125 °C Note 1. This maximum value has an absolute maximum of 6.5 V independent of VDDD. QUALITY AND RELIABILITY This device will meet Philips Semiconductors general quality specification for business group “Consumer Integrated Circuits SNW-FQ-611-Part E”. The principal requirements are shown in Tables 6 to 9. Group A Table 6 Acceptance tests per lot; note 1 TEST REQUIREMENTS Mechanical cumulative target: <80 ppm Electrical cumulative target: <80 ppm Note 1. ppm = fraction of defective devices, in parts per million. Group B Table 7 Processability tests (by package family); note 1 TEST REQUIREMENTS Solderability <7% LTPD Mechanical <15% LTPD Solder heat resistance <15% LTPD Note 1. LTPD = Lot Tolerance Percent Defective. 1998 Apr 22 15 Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 Group C Table 8 Reliability tests (by package family); note 1 TEST CONDITIONS REQUIREMENTS Operational life 168 hours at Tj = 150 °C <1000 FPM at Tj = 70 °C Humidity life temperature, humidity, bias 1000 hours, Tamb = 85 °C, 85% RH (or equivalent test) <2000 FPM Temperature cycling performance Tstg(min) to Tstg(max) <2000 FPM Note 1. FPM = fraction of devices failing at test conditions, in Failures Per Million. Table 9 Reliability tests (by device type) TEST ESD and latch-up CONDITIONS REQUIREMENTS ESD human body model 100 pF, 1.5 kΩ <2000 V ESD machine model 200 pF, 0 Ω <200 V latch-up 100 mA, 1.5VDDD (absolute maximum) CHARACTERISTICS VDDD(M) = 5 V ±10%; VSS = 0 V; Tamb = −20 to +70°C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VDDD(M) microcontroller supply referenced to VSSD voltage 4.5 5.0 5.5 V VDDA analog supply voltage referenced to VSSD 4.5 5.0 5.5 V VDDD(T) teletext supply voltage 4.5 5.0 5.5 V IDDD(M) microcontroller supply current − 20 35 mA IDDA analog supply current − 35 50 mA IDDD(T) teletext supply current − 50 80 mA referenced to VSSD Digital inputs PIN RESET VIL LOW-level input voltage −0.3 − 0.2VDDD(M) − 0.1 V VIH HIGH-level input voltage 0.7VDDD(M) − VDDD(M) + 0.3 V ILI input leakage current −10 − +10 µA Ci input capacitance − − 4 pF 1998 Apr 22 Vi = 0 to VDDD(M) 16 Philips Semiconductors Product specification 10-page intelligent teletext decoders SYMBOL PARAMETER SAA5261; SAA5262; SAA5263 CONDITIONS MIN. TYP. MAX. UNIT PINS HSYNC AND VSYNC Vth(f) switching threshold falling 0.2VDDD(M) − − V Vth(r) switching threshold rising − − 0.8VDDD(M) V Vhys hysteresis voltage − 0.33VDDD(M) − V Ci input capacitance − − 4 pF Digital outputs PINS R, G AND B: note 1 VOL LOW-level output voltage IOL = 2 mA 0 − 0.2 V VOH HIGH-level output voltage IOH = −2 mA VRGBREF − 0.3 VRGBREF VRGBREF + 0.4 V ZO output impedance − − 150 Ω CL load capacitance − − 50 pF IO DC output current − − −4 mA to(r) output rise time between 10 and 90%; CL = 50 pF − − 20 ns to(f) output fall time between 90 and 10%; CL = 50 pF − − 20 ns VOL LOW-level output voltage IOL = 1.6 mA 0 − 0.2 V VOH HIGH-level output voltage IOH = −1.6 mA VDDD(M) − 0.3 − VDDD(M) + 0.4 V PIN VDS CL load capacitance − − 50 pF to(r) output rise time between 10 and 90%; CL = 50 pF − − 20 ns to(f) output fall time between 90 and 10%; CL = 50 pF − − 20 ns − − 20 ns − − VDDD(M) V 0 − 0.5 V PINS R, G, B AND VDS td(skew) skew delay between any two pins PIN COR (OPEN-DRAIN OUTPUT) VOH HIGH-level pull-up output voltage VOL LOW-level output voltage IOL LOW-level output current − − 2 mA CL load capacitance − − 25 pF 1998 Apr 22 IOL = 2 mA 17 Philips Semiconductors Product specification 10-page intelligent teletext decoders SYMBOL PARAMETER SAA5261; SAA5262; SAA5263 CONDITIONS MIN. TYP. MAX. UNIT PIN FRAME VOH HIGH-level output voltage IOL = 8 mA 0 − 0.5 V VOL LOW-level output voltage IOL = −8 mA VDDD(M) − 0.5 − VDDD(M) V IOL LOW-level output current −8 − +8 mA CL load capacitance − − 100 pF Digital inputs/outputs PINS V0 TO V7 VIL LOW-level input voltage −0.3 − 0.2VDDD(M) − 0.1 V VIH HIGH-level input voltage 3.0 − VDDD(M) + 0.3 Ci input capacitance VOL LOW-level output voltage CL load capacitance IOL = 10 mA V − − 4 pF 0 − 0.45 V − − 50 pF PINS SCL AND SDA (PINS 14, 15, 49 AND 50) VIL LOW-level input voltage −0.3 − +1.5 V VIH HIGH-level input voltage 3.0 − VDDD(M) + 0.3 V Ci input capacitance − − 5 pF VOL LOW-level output voltage 0 − 0.5 V CL load capacitance − − 400 pF to(f) output fall time − − 200 ns IOL = 3 mA between 3 and 1 V Digital inputs PINS VSMODE, HSMODE, PDI, SA, FP, PUINL, DISDSR, DIS8/30, DISLCBD, ME8/30T AND E/W VIL LOW-level input voltage −0.3 − 0.2VDDD(M) − 0.1 V VIH HIGH-level input voltage 0.2VDDD(M) + 0.9 − VDDD(M) + 0.3 V Ci input capacitance − − 4 pF CL load capacitance − − 50 pF 0 − 0.45 V − − 50 pF Digital outputs PINS PL AND PON VOL LOW-level output voltage CL load capacitance 1998 Apr 22 IOL = 10 mA 18 Philips Semiconductors Product specification 10-page intelligent teletext decoders SYMBOL PARAMETER SAA5261; SAA5262; SAA5263 CONDITIONS MIN. TYP. MAX. UNIT Analog inputs PINS CVBS0 AND CVBS1 Vsync sync voltage amplitude 0.1 0.3 0.6 V Vvid(p-p) video input voltage amplitude (peak-to-peak value) 0.7 1.0 1.4 V Zsource source impedance − − 250 Ω VIH HIGH-level input voltage 3.0 − VDDD(M) + 0.3 V Zi input impedance 2.5 5.0 − kΩ Ci input capacitance − − 10 pF resistor to ground − 27 − kΩ PIN Iref RVSS RGBREF: note 1 Vi input voltage −0.3 − VDDD(M) V II DC input current − − 12 mA Analog input/output PIN BLACK CBLACK storage capacitor to ground − 100 − nF VBLACK black level voltage for nominal sync amplitude 1.8 2.15 2.5 V ILI input leakage current −10 − +10 µA Crystal oscillator PIN XTALI VIL LOW-level input voltage −0.3 − 0.2VDDD(M) − 0.1 V VIH HIGH-level input voltage 0.7VDDD(M) − VDDD(M) + 0.3 V Ci input capacitance − − 10 pF output capacitance − − 10 pF PIN XTALO Co 1998 Apr 22 19 Philips Semiconductors Product specification 10-page intelligent teletext decoders SYMBOL PARAMETER SAA5261; SAA5262; SAA5263 CONDITIONS MIN. TYP. MAX. UNIT CRYSTAL SPECIFICATION: note 2 fxtal nominal frequency − 12 − MHz CL load capacitance − 32 − pF C1 series capacitance Tamb = 25 °C − 18.5 − fF C0 parallel capacitance Tamb = 25 °C − 4.9 − pF Rres resonance resistance Tamb = 25 °C − 35 − Ω Txtal temperature range −20 +25 +70 Xj adjustment tolerance Xd drift Tamb = 25 °C °C 10−6 − − ±50 × − − ±30 × 10−6 Notes 1. All RGB current is sourced from the RGBREF pin. The maximum effective series resistance between RGBREF and the R, G and B pins is 150 Ω. 2. Crystal order number 4322 143 05561. TIMING CHARACTERISTICS SYMBOL PARAMETER INPUT OUTPUT I2C-BUS SPECIFICATION SCL timing tHD;STA START condition hold time ≥4.0 µs note 1 ≥4.0 µs tLOW SCL LOW time ≥4.7 µs note 1 ≥4.7 µs tHIGH SCL HIGH time ≥4.0 µs ≥4.0 µs; note 2 ≥4.0 µs tr(SCL) SCL rise time ≤1.0 µs note 3 ≤1.0 µs tf(SCL) SCL fall time ≤0.3 µs ≤0.3 µs; note 4 ≤0.3 µs SDA timing tSU;DAT1 data set-up time ≥250 ns note 1 ≥250 ns tHD;DAT data hold time ≥0 ns note 1 ≥0 ns tSU;STA repeated START set-up time ≥4.7 µs note 1 ≥4.7 µs tSU;STO STOP condition set-up time ≥4.0 µs note 1 ≥4.0 µs tBUF bus free time ≥4.7 µs note 1 ≥4.7 µs tr(SDA) SDA rise time ≤1.0 µs note 3 ≤1.0 µs tf(SDA) SDA fall time ≤0.3 µs ≤0.3 µs; note 4 ≤0.3 µs Notes 1. This parameter is determined by the user software. It must comply with the I2C-bus specification. 2. This value gives the auto-clock pulse length which meets the I2C-bus specification for the special crystal frequency. Alternative, the SCL pulse must be timed by software. 3. The rise time is determined by the external bus line capacitance and pull-up resistor. It must be less than 1 µs. 4. The maximum capacitance on bus lines SDA and SCL is 400 pF. 1998 Apr 22 20 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... START condition STOP condition t SU;STA t rD 0.7V DD SDA (input / output) 0.3VDD 21 t fD t rC t BUF t fC Philips Semiconductors START or repeated START condition 10-page intelligent teletext decoders 1998 Apr 22 repeated START condition t SU;STO 0.7VDD SCL (input / output) 0.3VDD t HIGH t SU;DAT1 t HD;DAT Fig.13 I2C-bus interface timing. t SU;DAT3 t SU;DAT2 MLC104 Product specification handbook, full pagewidth t LOW SAA5261; SAA5262; SAA5263 t HD;STA Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 CLOCK GENERATOR The oscillator circuit is a single-stage inverting amplifier in a Pierce oscillator configuration. The circuitry between pins XTALI and XTALO is basically an inverter biased to the transfer point. A crystal must be used as the feedback element to complete the oscillator circuitry. It is operated in parallel resonance. XTALI is the high gain amplifier input and XTALO is the output. To drive the device externally XTALI is driven from an external source and XTALO is left open-circuit. handbook, halfpage OSCGND C1 handbook, halfpage 40 not connected 41 external clock 42 not connected OSCGND 40 (1) XTALI XTALI 41 C2 (1) XTALO MGL415 XTALO 42 MGL416 (1) The values of C1 and C2 depend on the crystal specification: C1 = C2 = 2CL. Fig.15 Oscillator circuit driven from external source. Fig.14 Oscillator circuit. 1998 Apr 22 22 Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 A ferrite bead or inductor with resistive characteristics at high frequency may be utilized in the supply line close to the decoupling capacitor to provide a high impedance. To prevent pollution by conduction onto signal lines (which may then radiate) signals connected to the +5 V supply via a pull up resistor should not be connected to the IC side of the ferrite component. EMC GUIDELINES Optimization of circuit return paths and minimisation of common mode noise will be assisted by using a double-sided PCB with a low inductance ground plane. On a single-sided PCB a local ground plane under the whole IC should be present, as shown in Fig.16. This should be connected by the widest possible connection back to the PCB ground connection and bulk electrolytic decoupling capacitor. It should preferably not connect to other grounds on the way and no wire links should be present in this connection. The use of wire links increases ground bounce by introducing inductance into the ground. OSCGND should be connected only to the crystal load capacitors and not the local or circuit ground. Keep physical connection distances to associated active devices short. Route output traces with close proximity mutually coupled ground return paths. The supply pins can be decoupled at the pin to the ground plane under the IC. This is easily accomplished using surface mount capacitors, which are more effective than leaded components at high frequency. Using a device socket will unfortunately add to the area and inductance of the external bypass loop. GND +5 V handbook, full pagewidth electrolytic decoupling capacitor (2.2 µF) ferrite components other GND connections SM decoupling capacitors (22 to 100 nF) VDDD(M) VDDD(T) VDDA under-IC GND plane under-IC GND plane GND connection note: no wire links VSSD IC(SAA5290) VSSA Fig.16 Power supply and ground connections for SOT247-1. 1998 Apr 22 23 MGL414 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 4.7 kΩ 4.7 kΩ 4.7 kΩ 4.7 kΩ 4.7 kΩ 4.7 kΩ 4.7 kΩ 1 52 2 51 3 50 4 49 5 48 6 47 7 46 8 45 9 44 10 43 11 42 12 41 13 40 4.7 kΩ 4.7 kΩ PCF8582P 2 3 4 A1 A2 VSS 56 kΩ 3.3 nF VDD 8 7 PTC 6 SCL 5 SDA 4.7 kΩ VDDD(M) 4.7 kΩ 4.7 kΩ 4.7 kΩ 4.7 kΩ 4.7 kΩ VSSD 4.7 kΩ 4.7 kΩ VSSA 100 nF CVBS1 4.7 kΩ 220 Ω VSSD2 SDA2 SCL2 VSSD2 VDDD(M) 12 MHz 22 pF SAA526xPS 39 VDDD(T) 15 38 VDDA 16 37 VSYNC 17 36 HSYNC 18 35 VDS 19 34 R 20 33 G 21 32 22 31 23 30 24 29 VDDD(M) 1 kΩ 1 kΩ 100 nF B 4.7 kΩ 100 nF CVBS2 25 100 nF 27 kΩ 26 MGL419 VSSA VSSD2 28 27 Fig.17 Application diagram. PON VSSD2 COR FRAME Product specification 14 SAA5261; SAA5262; SAA5263 VSSD1 4.7 kΩ 220 Ω 22 pF VSSD1 4.7 kΩ 2.2 µF handbook, full pagewidth 24 VSSD A0 4.7 kΩ VSSD2 VDDD(M) 1 4.7 kΩ Philips Semiconductors 4.7 kΩ 10-page intelligent teletext decoders 4.7 kΩ VDDD(M) APPLICATION INFORMATION 1998 Apr 22 VDDD(M) Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 PACKAGE OUTLINE seating plane SDIP52: plastic shrink dual in-line package; 52 leads (600 mil) SOT247-1 ME D A2 L A A1 c e Z b1 (e 1) w M MH b 27 52 pin 1 index E 1 26 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.08 0.51 4.0 1.3 0.8 0.53 0.40 0.32 0.23 47.9 47.1 14.0 13.7 1.778 15.24 3.2 2.8 15.80 15.24 17.15 15.90 0.18 1.73 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 90-01-22 95-03-11 SOT247-1 1998 Apr 22 EUROPEAN PROJECTION 25 Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (order code 9398 652 90011). Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1998 Apr 22 26 Philips Semiconductors Product specification 10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263 NOTES 1998 Apr 22 27 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545104/00/01/pp28 Date of release: 1998 Apr 22 Document order number: 9397 750 03442