INTEGRATED CIRCUITS DATA SHEET TDA8012M Low power PLL FM demodulator for satellite TV receivers Product specification Supersedes data of 1995 Feb 02 File under Integrated Circuits, IC02 1996 Mar 26 Philips Semiconductors Product specification Low power PLL FM demodulator for satellite TV receivers TDA8012M FEATURES APPLICATIONS • High input sensitivity • Direct Broadcast Satellite (DBS) receivers. • Fully balanced two-pin Voltage Controlled Oscillator (VCO) GENERAL DESCRIPTION • Low input impedance (50 Ω) The TDA8012M is a sensitive PLL FM demodulator which is used for the second IF in satellite receivers. It provides Automatic Gain Control (AGC) and Automatic Frequency Control (AFC) outputs that can be used to optimize the level and frequency of the input signal. During the searching procedure, the AFC output provides a signal which is used for carrier detection. • Low impedance video baseband output • Internal voltage stabilizer • Keyed AFC or peak-to-peak AFC • Carrier detector • AGC output • Suitable for High Definition TV (HDTV). QUICK REFERENCE DATA SYMBOL PARAMETER VCC supply voltage ICC supply current Vi input signal voltage level Vo(p-p) video output signal voltage amplitude (peak-to-peak value) fi operating input frequency CONDITION VCC = 5 V; Tamb = 25 °C ∆fo = 25 MHz (p-p) MIN. TYP. MAX. UNIT 4.5 5.0 5.5 V 50 60 70 mA 53 57 61 dBµV − 1 − V − 480 − MHz ORDERING INFORMATION PACKAGES TYPE NUMBER NAME TDA8012M SSOP20 1996 Mar 26 DESCRIPTION plastic shrink small outline package; 20 leads; body width 4.4 mm 2 VERSION SOT266-1 Philips Semiconductors Product specification Low power PLL FM demodulator for satellite TV receivers TDA8012M BLOCK DIAGRAM handbook, full pagewidth CDF1 CDF2 CARRIER DETECTOR 1 2 20 AFC 19 18 AFCos AFCCDO KEY 17 3 PD(pos) PD(neg) IFI1 IFI2 4 5 16 VCO 6 15 14 GND V CC AGC th 8 VCO1 OSCGND STABILIZER 13 12 9 10 LF2 LF1 VIDEO TDA8012M 11 VIDEO BUFFER Fig.1 Block diagram. 1996 Mar 26 VCO2 7 AGC AGCO NF 3 MBE251 Philips Semiconductors Product specification Low power PLL FM demodulator for satellite TV receivers TDA8012M PINNING SYMBOL PIN DESCRIPTION CDF1 1 carrier detector filter 1 input CDF2 2 carrier detector filter 2 input PD(pos) 3 positive peak detector output PD(neg) 4 negative peak detector output CDF1 1 20 AFC os IFI1 5 IF input 1 CDF2 2 19 AFC CDO IFI2 6 IF input 2 PD(pos) 3 18 KEY GND 7 ground VCC 8 supply voltage PD(neg) 4 17 NF AGCO 9 AGC output IFI1 5 AGCth 10 AGC threshold voltage input VIDEO 11 baseband signal output LF1 12 loop filter 1 input LF2 13 OSCGND VCO1 VCO2 16 oscillator tank circuit 2 input NF 17 noise filter input KEY 18 key pulse input AFCCDO 19 AFC and carrier detector output AFCos 20 AFC offset input ndbook, halfpage IFI2 6 15 VCO1 GND 7 14 OSCGND loop filter 2 input V CC 8 13 LF2 14 oscillator ground AGCO 9 12 LF1 15 oscillator tank circuit 1 input AGC th 10 11 VIDEO MBE250 Fig.2 Pin configuration. The circuit provides an AGC signal which is used to drive a gain-controlled IF amplifier (TDA8011T or TDA8010M) to ensure a stable PLL demodulation characteristic. FUNCTIONAL DESCRIPTION The TDA8012M is a low power PLL FM demodulator designed for use in satellite TV reception systems. An analog AFC voltage is also made available. This signal can be suitably applied to the input of the ADC port of the PLL frequency synthesizer (TSA5055). The AFC function may be keyed to address D2MAC and MUSE systems. The demodulator is based on a Phase-Locked Loop (PLL) structure including a fully balanced two-pin VCO. A high gain IF amplifier ensures a high input sensitivity. The video output voltage is supplied via a highly linear video buffer which has a low output impedance. The centre frequency of the VCO and the loop characteristics can be set using external components. 1996 Mar 26 16 VCO2 TDA8012M The TDA8012M includes a Carrier Detector (CD) which is used for channel detection during search procedures. 4 Philips Semiconductors Product specification Low power PLL FM demodulator for satellite TV receivers TDA8012M LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VCC supply voltage −0.3 6.0 V Vi(max) maximum input voltage on all pins −0.3 VCC V Isource(max) maximum output source current − 10 mA tsc maximum short-circuit time on all outputs − 10 s ZL AC load impedance at video output 600 − Ω Tstg storage temperature −55 +150 °C Tj junction temperature − +150 °C Tamb operating ambient temperature −10 +80 °C HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe it is desirable to take normal precautions appropriate to handling MOS devices. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER VALUE UNIT 120 K/W thermal resistance from junction to ambient in free air CHARACTERISTICS VCC = 5 V; fi = 480 MHz; Vi = 57 dBµV; Tamb = 25 °C; measured in application circuit of Fig.4; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VCC supply voltage ICC supply current 4.75 5.0 5.25 V note 1 50 60 70 mA 27.5 MHz/V Voltage controlled oscillator KVCO voltage controlled oscillator constant VCC = 4.75 to 5.25 V; Tamb = −10 το +80 °C 22.5 25 δfo/δT voltage controlled oscillator drift note 2 − −70 × 10−6 − °C−1 ∆fo voltage controlled oscillator shift VCC = 4.75 to 5.25 V − − ±750 kHz note 3 53 57 61 dBµV Frequency demodulator Vi input signal voltage level Zi input impedance KPD phase detector constant Gv phase-lock loop gain 1996 Mar 26 real part; note 4 − 50 − Ω parallel inductive part; note 4 − 130 − nH Vi = 57 dBµV − 0.37 − V/rad drift; note 5 − 2 − dB shift; note 5 − 2 − dB 5 Philips Semiconductors Product specification Low power PLL FM demodulator for satellite TV receivers SYMBOL PARAMETER Zo(diff) differential output impedance of the phase detector TDA8012M CONDITIONS MIN. TYP. MAX. UNIT 1.6 2 2.4 kΩ CRPLL phase-lock loop capture range note 6 − ±17 − MHz Gdiff differential gain note 7 − ±2 − % Φdiff differential phase note 7 − ±2 − deg IM3 third-order intermodulation distortion note 8 50 − − dB ∆fo = 25 MHz 0.9 1.0 1.1 V Video output Vo(p-p) baseband output signal amplitude (peak-to-peak value) VO(DC) DC voltage level of video output 2.1 2.35 2.6 V Zo output impedance − 10 50 Ω Automatic gain control (note 9) AGCth LD Vsat(AGC) IAGC = 0.5 mA; 0.1VCC − − 53 dBµV IAGC = 0.5 mA; 0.9VCC 61 − − dBµV shift; VCC = 4.75 to 5.25 V − 1 − dB drift; Tamb = −10 to +80 °C − 1 − dB AGC steepness IAGC = 0.5 mA; note 10 − 8 − mA/dB low level AGC output saturation voltage IAGC = 1 mA − 200 500 mV AGC threshold as a function of the voltage applied to pin 10 level detector Keying pulse tkey input keyed pulse time period − 64 − µs tW(key) keyed pulse width 8 − − µs VIL LOW level input keyed pulse voltage key on − − 0.8 V VIH HIGH level input keyed pulse voltage key off 2.7 − − V Zi input impedance 1 − − kΩ 4.9 5.5 6.1 V/MHz AFC and carrier detector output (note 11) δVAFC/δf AFC steepness AFCshift shift of AFC voltage in relation to VCO shift with unmodulated 480 MHz input signal ∆VCC = ±5% − ±180 ±500 kHz AFCdrift drift of AFC voltage in relation to the VCO Tamb = 80 °C; note 12 − −400 − kHz 1996 Mar 26 6 Philips Semiconductors Product specification Low power PLL FM demodulator for satellite TV receivers TDA8012M Notes 1. The DC supply current is defined for VCC = 5 V. 2. This typical value of −70 ppm/°C or −70 × 10−6 °C−1 can be found in the reference measuring set-up shown in Fig.3. The temperature drift may be adjusted by the temperature coefficient of the external capacitor in the tank circuit. 3. The circuit is designed for an input level of 57 dBµV. The maximum allowable input level is 61 dBµV. However, for levels other than 57 dBµV the optimum loop filter values will be different from those given for the 57 dBµV input level in the reference measuring set-up. 4. The input impedance is reduced to a resistor with a parallel reactance. The values are given at 480 MHz. In order to reduce the radiation from the oscillator to the RF input, it is recommended to use a symmetrical drive. 5. The PLL loop gain shift and drift are given without loop filter shift and drift (non-temperature compensated external components). 6. The capture range or lock-in range is defined as the PLL normal operating range. This value depends strongly on the loop filter characteristics. 7. Measurements with test signals in accordance with CCIR recommendation 473-3. FM modulated signal with DBS parameters: a) 625 lines PAL TV system b) 25 MHz/V modulator sensitivity c) 1 V (p-p) video signal d) No SAW filter is used. 8. No SAW filter is used at the input: a) 16 MHz/V modulator sensitivity b) 4.43 MHz sine wave colour signal [660 mV (p-p)] c) 3.25 MHz sine wave luminance signal [700 mV (p-p)] d) Two Wegner sound sub-carriers at 7.02 and 7.2 MHz (100 mV) e) Intermodulation distance is defined as the distance between the luminance signal and the intermodulation products. 9. The characteristics of the AGC function are measured in the application circuit of Fig.4. The circuit illustrated in Fig.4 has been designed to set the maximum AGC current of 1 mA. The output of the AGC function is capable of handling up to 5 mA. The maximum AGC current can be increased to 5 mA by decreasing the value of the resistor connected between pins 8 and 9. 10. In the application circuit (see Fig.4) the voltage at the AGC output decreases when the IF input level increases above the adjusted AGC threshold. 11. The outputs from the AFC and carrier detector are combined at pin 19 (see Fig.3). During search tuning, when the input frequency is outside the capture range, the combined output (carrier detector function) is at a LOW level (any voltage below 0.6VCC). When the PLL becomes locked, the voltage at pin 19 rises to a HIGH level (V19 = 0.8VCC to VCC). When the input channel is close to the centre frequency, V19 falls to the LOW level. As shown in Fig.3, the voltage at pin 19 is now a function of the centre frequency (AFC function). This information may be read by a microcontroller via the ADC of the satellite frequency synthesizer (TSA5055) and the I2C-bus. 12. The drift of the AFC voltage is measured in accordance with the following method: a) At room temperature (Tamb = 25 °C) the TDA8012M is driven by a 480 MHz unmodulated signal. The voltage at pin 20 must be adjusted to obtain a 1.5 V output at the AFC output (pin 19). b) At Tamb = 80 °C, due to its temperature drift, the AFC output voltage differs from 1.5 V. The input frequency must, therefore, be adjusted to obtain 1.5 V at the AFC output. The drift of the AFC voltage will then be equal to the difference between the new input frequency and 480 MHz. 1996 Mar 26 7 Philips Semiconductors Product specification Low power PLL FM demodulator for satellite TV receivers TDA8012M MBE253 V19/VCC 1 carrier detect on 0.8 0.6 0.45 0.3 AFC DATA 0.15 0 fo 500 kHz frequency Fig.3 AFC and carrier detector output. 1996 Mar 26 8 Philips Semiconductors Product specification Low power PLL FM demodulator for satellite TV receivers TDA8012M APPLICATION INFORMATION VCC dbook, full pagewidth 1 µF 36 kΩ CARRIER DETECTOR 1 2.2 kΩ 82 kΩ 2.7 MΩ 2 20 AFC 13 kΩ 19 22 µF 18 330 nF 3 10 MΩ 4 17 1 µF KEY 180 pF 330 nF 10 MΩ AFCCDO 10 kΩ 10 nF IF input 5 16 VCO 6 15 30 nH 1.2 pF 10 nF 14 7 8 V CC STABILIZER 4.7 kΩ 12 AGC 2 kΩ 9 AGCO 47 kΩ 10 VIDEO TDA8012M 11 VIDEO BUFFER MBE252 Fig.4 Application circuit. 1996 Mar 26 10 pF 13 9 1.3 kΩ Philips Semiconductors Product specification Low power PLL FM demodulator for satellite TV receivers TDA8012M PACKAGE OUTLINE SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm D SOT266-1 E A X c y HE v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 1.5 0.15 0 1.4 1.2 0.25 0.32 0.20 0.20 0.13 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.45 0.65 0.45 0.2 0.13 0.1 0.48 0.18 10 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 90-04-05 95-02-25 SOT266-1 1996 Mar 26 EUROPEAN PROJECTION 10 o Philips Semiconductors Product specification Low power PLL FM demodulator for satellite TV receivers TDA8012M If wave soldering cannot be avoided, the following conditions must be observed: SOLDERING Introduction • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. • The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Reflow soldering Reflow soldering techniques are suitable for all SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. Wave soldering Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. 1996 Mar 26 11 Philips Semiconductors Product specification Low power PLL FM demodulator for satellite TV receivers TDA8012M DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Mar 26 12 Philips Semiconductors Product specification Low power PLL FM demodulator for satellite TV receivers TDA8012M NOTES 1996 Mar 26 13 Philips Semiconductors Product specification Low power PLL FM demodulator for satellite TV receivers TDA8012M NOTES 1996 Mar 26 14 Philips Semiconductors Product specification Low power PLL FM demodulator for satellite TV receivers TDA8012M NOTES 1996 Mar 26 15 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02) 805 4455, Fax. (02) 805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. (01) 60 101-1256, Fax. (01) 60 101-1250 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. (172) 200 733, Fax. (172) 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. (359) 2 689 211, Fax. (359) 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS: Tel. (800) 234-7381, Fax. (708) 296-8556 Chile: see South America China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. (852) 2319 7888, Fax. (852) 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. (032) 88 2636, Fax. (031) 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. (358) 0-615 800, Fax. (358) 0-61580 920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. (01) 4099 6161, Fax. (01) 4099 6427 Germany: P.O. Box 10 51 40, 20035 HAMBURG, Tel. (040) 23 53 60, Fax. (040) 23 53 63 00 Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. (01) 4894 339/4894 911, Fax. (01) 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, BOMBAY 400 018 Tel. (022) 4938 541, Fax. (022) 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. (01) 7640 000, Fax. (01) 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. (03) 645 04 44, Fax. (03) 648 10 07 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. (0039) 2 6752 2531, Fax. (0039) 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. (03) 3740 5130, Fax. (03) 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. (02) 709-1412, Fax. (02) 709-1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. (03) 750 5214, Fax. (03) 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. 9-5(800) 234-7831, Fax. (708) 296-8556 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. (040) 2783749, Fax. (040) 2788399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. (09) 849-4160, Fax. (09) 849-7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. (022) 74 8000, Fax. (022) 74 8341 Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (63) 2 816 6380, Fax. (63) 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. (022) 612 2831, Fax. (022) 612 2327 Portugal: see Spain Romania: see Italy Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. (65) 350 2000, Fax. (65) 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. (011) 470-5911, Fax. (011) 470-5494 South America: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SÃO PAULO-SP, Brazil, P.O. Box 7383 (01064-970), Tel. (011) 821-2333, Fax. (011) 829-1849 Spain: Balmes 22, 08007 BARCELONA, Tel. (03) 301 6312, Fax. (03) 301 4107 Sweden: Kottbygatan 7, Akalla. S-16485 STOCKHOLM, Tel. (0) 8-632 2000, Fax. (0) 8-632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. (01) 488 2211, Fax. (01) 481 77 30 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1, P.O. Box 22978, TAIPEI 100, Tel. (886) 2 382 4443, Fax. (886) 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. (66) 2 745-4090, Fax. (66) 2 398-0793 Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. (0212) 279 2770, Fax. (0212) 282 6707 Ukraine: PHILIPS UKRAINE, 2A Akademika Koroleva str., Office 165, 252148 KIEV, Tel. 380-44-4760297, Fax. 380-44-4766991 United Kingdom: Philips Semiconductors LTD., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. (0181) 730-5000, Fax. (0181) 754-8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800) 234-7381, Fax. (708) 296-8556 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. (381) 11 825 344, Fax. (359) 211 635 777 Internet: http://www.semiconductors.philips.com/ps/ For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31-40-2724825 SCDS48 © Philips Electronics N.V. 1996 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 537021/1100/02/pp16 Document order number: Date of release: 1996 Mar 26 9397 750 00766