INTEGRATED CIRCUITS
DATA SHEET
TEA6810V; TEA6811V
Front-end and PLL synthesizers for
car radios
Product specification
Supersedes data of September 1994
File under Integrated Circuits, IC01
1996 Jun 18
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
FEATURES
• Synthesizer function which includes a Voltage
Controlled Oscillator (VCO), dividers, phase detector,
charge-pump and in-lock detector
• FM mixer with AGC
• AM RF amplifier with AGC
• AM mixer.
Minimum alignments are required due to wideband RF
inputs and the common AM/FM VCO.
APPLICATIONS
High dynamic behaviour and minimum distortion is
obtained by a special RF input design combined with AGC.
High sensitivity is possible in combination with RF input
FETs.
• Car radios.
GENERAL DESCRIPTION
Minimum interference is experienced due a to special
synthesizer loop design and ensuring that the I2C-bus is
inoperative in the locked-tuned condition.
The TEA6810V and TEA6811V, together with TEA6821V
forms an AM/FM receiving concept for electronically tuned
car radios.
The reference frequency for the synthesizer and the
I2C-bus information is delivered by the TEA6821V.
The TEA681xV is an FM/AM front-end with one local
synthesized oscillator for both AM and FM which is used
together with the TEA6821T in a double-conversion
concept. It delivers a first FM-IF of 72.2 MHz and, for
MW/LW, a first AM-IF of 10.7 MHz.
The programmable local/dx switch enables switching the
gain of the FM mixer from normal AGC control (FM dx) to
the forced 4th level of AGC (FM local).
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VCCA1
analog supply voltage (pin 2)
VCCA2
analog supply voltage (pin 13)
8.1
8.5
8.9
V
VAMant
AM AGC range
see Fig.4
0.3
−
6.0
V
VFMant
FM AGC range
see Fig.5
10
−
600
mV
fAMant
AM input frequency
0.144
−
22
MHz
fFMant
FM input frequency
60
−
108
MHz
Tamb
operating ambient temperature
−40
−
+85
°C
4.75
5.0
5.25
V
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TEA6810V
VSO40
plastic very small outline package; 40 leads
SOT158-1
TEA6811V
VSO40
plastic very small outline package; 40 leads; face down
SOT158-2
1996 Jun 18
2
37
38
AM/FM
OSCILLATOR
VTUNE
CHPOUT
32
30
34
31
3
LCKDET
VCCA2
AGND2
12
33
AMSB2
AMPREC
27
28
FM
AM/FM
BUFFER
AM/FM
PROGRAMME
DIVIDER N1
PHASE DETECTOR
14
frefN
26
22
RF
AMPREO
AM/FM
TEA6810V
TEA6811V
18
AMMIN
7
2
17
frefP VCCA1 n.c.
23
n.c.
10
n.c.
BAND
GAP
I2C-BUS CONTROL
20
n.c.
5
4
SCL
SDA
DGND
9
VCCD
15
16
AMMON
AMMOP
21
Vref
29
AMMGND RFGND
MGE727
Product specification
Fig.1 Block diagram.
8
19
TEA6810V; TEA6811V
AGND1
24
AM/FM
13
6
25
AM
N2
LOCK
DETECTOR
1
AMPREI
AMSB1
AM
CHARGE
PUMP
BUFFER
3
AMAGCC
FMAGCC
11
PIN DIODE
DRIVER
39
40
FMIFOP
FMIFON
Philips Semiconductors
35
FMRFIP
Front-end and PLL synthesizers for
car radios
36
FMRFIN
IPIDIO
BLOCK DIAGRAM
ndbook, full pagewidth
1996 Jun 18
VCCOSC
OSCFDB
OSCGND
FMAGCref
OSCTNK
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
PINNING
PIN(1)
DESCRIPTION
SYMBOL
TEA6810
TEA6811
AGND1
1
1
analog ground 1
VCCA1
2
2
analog supply voltage 1 (+5 V)
LCKDET
3
3
lock detector flag
SDA
4
4
serial data input/output; I2C-bus
SCL
5
5
serial clock input; I2C-bus
frefN
6
6
reference frequency input from TEA6821 N-terminal
frefP
7
7
reference frequency input from TEA6821 P-terminal
DGND
8
8
digital ground
VCCD
9
9
digital supply voltage (+5 V)
n.c.
10
10
not connected
FMIFON
11
11
FM mixer negative output (72.2 MHz)
FMIFOP
12
12
FM mixer positive output (72.2 MHz)
VCCA2
13
13
analog supply voltage 2 (+8.5 V)
AGND2
14
14
analog ground 2
AMMOP
15
15
AM mixer positive output (10.7 MHz)
AMMON
16
16
AM mixer negative output (10.7 MHz)
n.c.
17
17
not connected
AMMIN
18
18
AM mixer RF input
Vref
19
19
reference voltage output from AM band gap
n.c.
20
20
not connected
AMMGND
21
21
AM mixer ground
AMPREO
22
22
AM preamplifier output
n.c.
23
23
not connected
AMSB1
24
24
AM feedback switch SB1
AMSB2
25
25
AM feedback switch SB2
AMPREI
26
26
AM preamplifier input
AMAGCC
27
27
AM AGC capacitor
AMPREC
28
28
AM preamplifier decoupling capacitor
RFGND
29
29
RF ground
FMRFIP
30
30
RF positive input for FM mixer
FMRFIN
31
31
RF negative input for FM mixer
IPIDIO
32
32
pin diode drive
FMAGCC
33
33
FM AGC integrating capacitor
FMAGCref
34
34
FM AGC reference voltage
OSCFDB
35
35
oscillator feedback input
OSCGND
36
36
oscillator ground
OSCTNK
37
37
oscillator tank output
1996 Jun 18
4
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
PIN(1)
SYMBOL
DESCRIPTION
TEA6810
TEA6811
VCCOSC
38
38
oscillator supply voltage (+8.5 V)
VTUNE
39
39
tuning voltage
CHPOUT
40
40
charge pump output
Note
1. Pins 10, 17, 20 and 23 should be connected to a common ground.
1996 Jun 18
5
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
handbook, halfpage
handbook, halfpage
CHPOUT 40
1
AGND1
VTUNE 39
2
VCCA1
38 VCCOSC
VCCOSC 38
3
LCKDET
4
37 OSCTNK
OSCTNK 37
4
SDA
SCL
5
36 OSCGND
OSCGND 36
5
SCL
frefN
6
35 OSCFDB
OSCFDB 35
6
frefN
frefP
7
34 FMAGCref
FMAGCref 34
7
frefP
DGND
8
33 FMAGCC
FMAGCC 33
8
DGND
VCCD
9
32 IPIDIO
IPIDIO 32
9
VCCD
AGND1
1
40 CHPOUT
VCCA1
2
39 VTUNE
LCKDET
3
SDA
FMRFIN 31
31 FMRFIN
n.c. 10
FMIFON 11
30 FMRFIP
FMRFIP 30
11 FMIFON
FMIFOP 12
29 RFGND
RFGND 29
12 FMIFOP
VCCA2 13
28 AMPREC
AMPREC 28
13 VCCA2
AGND2 14
27 AMAGCC
AMAGCC 27
14 AGND2
AMMOP 15
26 AMPREI
AMPREI 26
15 AMMOP
AMMON 16
25 AMSB2
AMSB2 25
16 AMMON
n.c. 17
24 AMSB1
AMSB1 24
17 n.c.
n.c.
23 n.c.
AMMIN 18
23
18 AMMIN
Vref 19
22 AMPREO
AMPREO 22
19 Vref
n.c. 20
21 AMMGND
AMMGND 21
20 n.c.
MGE726
MGE725
Fig.2 Pin configuration (TEA6810).
1996 Jun 18
10 n.c.
TEA6811V
TEA6810V
Fig.3 Pin configuration (TEA6811).
6
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
I2C-BUS ORGANIZATION
The TEA6810V; TEA6811V is controlled via the I2C-bus which is driven from the TEA6821V. For programming purposes
a module address and four data bytes are required. When used partially, the transmission must be ended by a stop
condition.
Table 1
Bit organization
START
MODULE
ADDRESS
S
byte 0
Table 2
PROGRAMMABLE
DIVIDER DATA
A
byte 1
A
SWITCH
CONTROL
byte 2
A
TEST
byte 3
A
STOP
byte 4
A
P
I2C-bus address and received bytes
BUS ADDRESS
BYTES TO
BE
RECEIVED
(4 BYTES)
MSB
LSB
1
1
0
0
0
1
0
0
Byte 1(1)
program
divider N1
(Low byte)
S7
S6
S5
S4
S3
S2
S1
S0
Byte 2(1)
program
divider N1
(High byte)
S15
S14
S13
S12
S11
S10
S9
S8
Byte 3
switching
MSB in-lock
counter
LSB in-lock
counter
1 = HIGH
0 = LOW
current
tuning
oscillator
1 = HIGH
0 = LOW
current
charge
pump
1 = FM
local
0 = FM dx
MSB
divider
N2
LSB divider
N2
1 = FM
0 = AM
Byte 4
testing
1 = 3-state
0 = normal
charge pump
1 = fdiv
0 = LCKDET
1 = test
0 = normal
in-lock
counter
X(2)
X
X
X
X
Notes
1. N1 divider ratio is (N + 2); where N is the programmed binary number composed of bytes 1 and 2. For the minimum
ratio; if N < 2048 then N1 divider ratio is {2048 + (N − 2)}.
2. X = don’t care.
Table 3
N2 divider
Table 4
In-lock
N2 DIVIDER
MSB
LSB
IN-LOCK
MSB
LSB
AM/FM
3
0
0
8
0
0
FM
5
0
1
16
1
0
AM or FM
10
1
0
32
1
1
AM or FM
15
1
1
48
0
0
AM
64
0
1
AM
1996 Jun 18
7
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCCA1
analog supply voltage (pin 2)
−0.3
12
V
VCCA2
analog supply voltage (pin 13)
−0.3
12
V
VCCD
digital supply voltage (pin 9)
−0.3
12
V
VCCOSC
oscillator supply voltage (pin 38)
−0.3
12
V
Ptot
maximum power dissipation
−
0.55
W
Tstg
storage temperature
−65
+150
°C
Ves
electrostatic handling
−300
+300
V
note 1
Note
1. Machine model: equivalent to discharging a 200 pF capacitor through 0 Ω.
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
thermal resistance from junction to ambient in free air
VALUE
UNIT
90
K/W
DC CHARACTERISTICS
V13 = V38 = 8.5 V; V9 = V2 = 5.0 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
ICCA1
analog input current (pin 2)
ICCA2
analog input current (pin 13)
ICCOSC
CONDITIONS
oscillator input current (pin 38)
ICCD
digital input current (pin 9)
IAMMO
AM mixer output current (pins 15 and 16)
IFMIFO
1996 Jun 18
FM mixer output current (pins 11 and 12)
8
TYP.
MAX.
UNIT
AM mode
7
9
mA
FM mode
6
8
mA
AM mode
17
22
mA
FM mode
15
18
mA
AM mode
4
6
mA
FM mode
6
8
mA
AM mode
32
35
mA
FM mode
27
30
mA
AM mode
8.5
−
mA
FM mode
0
−
mA
AM mode
0
−
mA
FM mode
10
−
mA
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
AC CHARACTERISTICS
All voltage and current values are RMS values; noise values are unweighted within the bandwidth 0.03 to 20 kHz;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
AM signal channel; (note 1; see Fig.4)
RF PREAMPLIFIER STAGE
Z21
40
65
−
kΩ
AGC start level 1
−
750
−
mV
AGC start level 2
−
850
−
mV
AGC stop level 1
−
145
−
mV
AGC stop level 2
−
170
−
mV
transimpedance
AGC STAGE; FI2 = 1 MHZ
Vi2
HF input voltage
IAGCsink
AGC sink current
V18 = V19 + 0.5 V; V27 = V19
−
1
−
µA
IAGCsource
AGC source current
V18 = V19 - 0.5 V; V27 = V19
−
2
−
mA
MIXER (fO = 10.7 MHZ)
Ri
input resistance between pins
18 and 21
15(2)
20
−
kΩ
Ci
input capacitance between
pins 18 and 21
−
5
−
pF
Co
output capacitance between
pins 15 and 16
−
−
5(2)
pF
GmC
conversion transconductance
(I15 to I16/V18 to V19
2.4
2.75
3.1
mS
∆GmC
variation in conversion
transconductance
−
−0.005
−
mS/K
IP3
third-order intermodulation
130(2)
137
−
dBmV
CP
−1 dB compression point
114(2)
120
−
dBmV
Vn(eq)
equivalent input noise voltage
−
9
−
nV/√Hz
−
15
−
−
10
−
−
5
−
−
3
−
OSCILLATOR/N2 DIVIDER
RN2
internal divider ratio (N2)
set by I2C-bus; see Table 3
REFERENCE VOLTAGE (PIN 19)
Vo
output reference voltage
−
2.75
−
V
Zo
output impedance
−
40
−
Ω
Io(max)
maximum output current
−
−
0.1
mA
1996 Jun 18
9
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
SYMBOL
PARAMETER
TEA6810V; TEA6811V
CONDITIONS
MIN.
TYP.
MAX.
UNIT
FM signal channel (note 3; see Fig.5)
MIXER
Ri
input resistance between
pins 30 and 31
1.65(2)
2
−
kΩ
Ci
input capacitance between
pins 30 and 31
3.4(2)
4
4.5(2)
pF
Ro
output resistance between
pins 11 and 12
10
−
−
kΩ
Co
output capacitance between
pins 11 and 12
6.5(2)
8
9(2)
pF
Gm
transconductance
I11 to I12/V30 to V31 < VAGC1
5.5
6.3
6.9
mS
I11 to I12/V30 to V31 < VAGC2
−
4.7
−
mS
I11 to I12/V30 to V31 < VAGC3
−
2.3
−
mS
I11 to I12/V30 to V31 > VAGC3
−
1.0
−
mS
∆GmT
variation in transconductance
with temperature
<VAGC1
−
−0.015
−
mS/K
F
noise figure
(both sidebands)
fi = 72.2 MHz; PLL tuned
−
7(2)
−
dB
IP3
third-order intermodulation
135(2)
139
−
dBmV
CP
−1 dB compression point
120(2)
127
−
dBmV
αIF1
1st IF rejection
25(2)
30
−
dB
VAGC(S)
AGC start voltage between
pins 30 and 31
VAGC(H)
AGC hysteresis voltage
start level 1
4.8
6.2
7.8
mV
start level 2
−
15
−
mV
start level 3
−
39
−
mV
hysteresis level 1
−
1
−
mV
hysteresis level 2
−
2
−
mV
hysteresis level 3
−
3
−
mV
−
5
−
kΩ
R33
FM AGC output resistance
Ipin
pin diode current
V32 = 1.4 V
4
−
−
mA
Vpin
start level pin diode voltage
between pins 30 and 31
Io = 1 mA
−
57
−
mV
OSCILLATOR
fosc
oscillator frequency
116.8
−
207
MHz
∆fosc/∆T
oscillator temperature
dependence
−
−90
−
10−6/K
1996 Jun 18
10
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
SYMBOL
PARAMETER
TEA6810V; TEA6811V
CONDITIONS
MIN.
TYP.
MAX.
UNIT
SYNTHESIZER (see Fig.6)
Reference frequency input (pins 6 and 7)
Vref(p-p)
reference frequency input
voltage (V6 to V7)
(peak-to-peak value)
−
0.4
−
V
ttrans
reference frequency transition
time
−
−
50
ns
fref
input reference frequency for:
tuning step (kHz) N2
50
−
−
50
−
kHz
AM standard SW1
5
10
−
50
−
kHz
AM full-band MW (USA)
10
5
−
50
−
kHz
FM
25
−
−
25
−
kHz
AM full-band SW1
5
5
−
25
−
kHz
AM standard MW/LW
1
15
−
15
−
kHz
AM full-band MW/LW
3
5
−
15
−
kHz
AM full-band SW2
5
3
−
15
−
kHz
FM
10
−
−
10
−
kHz
AM standard SW1
1
10
−
10
−
kHz
AM full-band MW/LW
1
5
−
5
−
kHz
AM full-band SW1
1
5
−
5
−
kHz
AM full-band SW2
1
3
−
5
−
kHz
FM
Phase detector/charge pump
IOL
LOW level output charge
pump current
V40 = 4 V
120
175
215
µA
IOH
HIGH level output charge
pump current
V40 = 4 V
0.85
1
1.2
mA
VOL
LOW level tuning voltage at
charge pump LOW
IO = 0.5Icharge; V13 = 8.5 V
0.2
−
8.25
V
VOH
HIGH level tuning voltage at
charge pump HIGH
IO = 0.5Icharge; V13 = 8.5 V
0.4
−
8.0
V
Ioz
3-state output current
V40 = 4 V
−5
−
+5
nA
Hz
∆fr(p-p)
residual FM frequency
(peak-to-peak value)
B = 300 Hz to 20 kHz;
Icharge = IOL; fi = 100 MHz
−
9
16(2)
tlock
lock time
FM = 88 to 108 MHz
−
2
−
ms
FM = 108 to 88 MHz
−
2
−
ms
AM = 510 to 1710 kHz
−
2
−
ms
AM = 1710 to 510 kHz
−
2
−
ms
1996 Jun 18
11
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
SYMBOL
PARAMETER
TEA6810V; TEA6811V
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Programmable divider
Nmin
minimum programmable ratio
−
2 050
−
Nmax
maximum programmable ratio
−
65537
−
DR
divider ratio for:
tuning step (kHz) N2
FM
50
−
2050
−
3 604
FM
25
−
6388
−
7208
FM
10
−
15970
−
18020
FM
5
−
31940
−
36040
AM standard MW/LW
1
15
10844
−
12420
AM standard SW1
5
10
3320
−
4140
AM standard SW1
1
10
16600
−
20700
AM full-band MW/LW
3
5
10448
−
10973
AM full-band MW/LW
1
5
31344
−
32920
AM full-band SW1
5
5
6700
−
8240
AM full-band SW1
1
5
33500
−
41200
AM full-band SW2
5
3
8240
−
10640
AM full-band SW2
1
3
41200
−
53200
10
5
3172
−
3292
AM full-band MW (USA)
In-lock detector (reset by any start condition on
I2C-bus)
VOH
in-lock HIGH level output
voltage (pin 3)
4.0
−
5.0
V
VOL
in-lock LOW level output
voltage (pin 3)
0
−
0.4
V
td
in-lock delay
−
N × 1⁄fref
−
ms
counter length = N
Notes
1. fi1 = 1053 kHz; fmod = 400 Hz; m = 0.3; Vi1 = Vi2 = 1 mV; N2 divider switched to divide-by-15.
2. Not measured 100% in production.
3. Vi1 = 1 mV; fi1 = 98 MHz; fmod = 1 kHz; ∆f = ±22.5 kHz.
1996 Jun 18
12
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
50 Ω
10 nF
1 mH
handbook, full pagewidth
20
kΩ
50
Ω
Vo1
33 µF
V i2
Vref
18
19
22
AM/FM
50 Ω
20 kΩ
4.7 nF
10 kΩ
50
Ω
Vi1
10 kΩ
33 µF
1.5 µF
24
25
AM
RF
1 nF
BB515
10
kΩ
50
nH
2.7 pF
22
nF
TEA6810V
TEA6811V
AGC
N2
37
35
36
AM/FM
OSCILLATOR
I 2 C BUS
CONTROL
AM/
FM
9
V TUNE
8
4
5
VCCD
10 kΩ
100 nF
10 kΩ
5V
SDA SCL
Fig.4 AM test circuit.
1996 Jun 18
100
nF
12
AM/
FM
13
MLB828
Vo2
33 µH
13 VCCA2
V CCOSC 38
1.8 pF
200
Ω
15
28
27
1:1
16
AM
29
8.5 V
21
BAND
GAP
26
33
µF
8.5 V
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
handbook, full pagewidth
100 nF
75
Ω
Vo3
TEA6810V; TEA6811V
33
TEA6810V
TEA6811V
29
AGC
50 Ω
FM
50
Ω
f i1
11
31
30
12
Vo1
34
PIN
DIODE
DRIVE
32
8.5 V
10
kΩ
Vo2
50
nH
2.7 pF
13 VCCA2
100
nF
14
BUFFER
VCCOSC 38
1.6 pF
BB515
37
35
AM/FM
OSCILLATOR
1Ω
36
AM/FM
V TUNE
I 2 C BUS
CONTROL
9
8
4
5
VCCD
10 kΩ
100 nF
10 kΩ
5V
SDA SCL
Fig.5 FM test circuit.
1996 Jun 18
1 kΩ
Vi1
50 Ω
1 nF
56
pF
14
MLB829
1 mH
33
µF
8.5 V
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
handbook, full pagewidth
8.5 V
VCCOSC 38
1.8 pF
1 nF
2.2
kΩ
BB515
Vo1
50
nH
2.7 pF
TEA6810V; TEA6811V
TEA6810V
TEA6811V
BUFFER
37
35
AM/FM
OSCILLATOR
PROGRAM
DIVIDER
N1
1Ω
2 VCCA1
36
39
120 nF
12
nF
3.6
kΩ
10
kΩ
13
CHARGE
PUMP
40
PHASE
DETECTOR
I 2 C BUS
CONTROL
14
9
8
4
5
10 kΩ
100 nF
10 kΩ
5V
SDA SCL
Fig.6 Synthesizer test circuit.
15
1.2 kΩ
LOCK
DETECTOR
VCCD
1996 Jun 18
8 pF
1
3.3
nF
3
5V
1.2 kΩ
MLB830
Viref
0.4 V (p p)
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
INTERNAL PIN CONFIGURATION
handbook, full pagewidth
AGND1
1
40
VCCA1
LCKDET
SDA
2
39
VTUNE
38
VCCOSC
3
4
TEA6810V
TEA6811V
37
36
35
SCL
frefN
DGND
VCCD
n.c.
FMIFON
FMIFOP
VCCA2
AGND2
AMMON
n.c.
8
33
10
32
11
12
31
IPIDIO
FMRFIN
14
15
29
FMRFIP
RFGND
16
28
AMPREC
17
18
25
23
22
19
21
20
MGE728
Fig.7 Internal pin configuration.
1996 Jun 18
FMAGCC
13
24
n.c.
FMAGCref
9
26
Vref
OSCFDB
7
27
AMMIN
OSCGND
6
30
AMMOP
OSCTNK
5
34
frefP
CHPOUT
16
AMAGCC
AMPREI
AMSB2
AMSB1
n.c.
AMPREO
AMMGND
6.4
MHz
RTC
9
8
10
7
VSS
100 kΩ
MR
5
12
HEF4060B
47 pF
12 pF
O8
O7
O9
150 nF
VDD
13
4
14
3
15
2
16
1
47
µF
47 µF
O3
6 O6
11
1 mH
SCL
470 kΩ
RS
1 mH
VCCA2
47
µF
47
µF
12 nF
1 kΩ
50
kHz
3.3 nF
1
1 kΩ
1 kΩ
O4
O5
10 kΩ
220 nF
2
39
120 nF
VTUNE
100 nF
1 pF
22 kΩ
TR4
10 kΩ
O13
1 kΩ
10 kΩ
3
38
1 kΩ
O11
TR2
TR3
17
4
37
5
36
6
35
7
34
8
33
9
32
47 kΩ
O12
3.6 kΩ
40
1 kΩ
TR1
12.5 kHz
FMOUT
4.7
nF
10
100 Ω
100 nF
ANZAC
TP103
1 nF
FMAGCref
120 nF
FMAGCC
120 nF
IPIDIO
100 Ω
100 Ω
4.7
nF
AMOUT
11
TEA6810V
TEA6811V
31
FMIN
ANZAC
TP101
50 Ω
30
1 nF
29
13
28
14
27
15
26
16
25
17
24
18
23
19
22
20
21
47 µF
1 kΩ
2.2 µF
1 kΩ
AMAGCC
20 kΩ
10 µF
AMPREI
50 kΩ
AMSB2
10 kΩ
AMSB1
10 kΩ
10 nF
AMPREO
1 mH
5 kΩ
AMMIN
50 Ω
47 µF
MGE729
Fig.8 Test board diagram.
Product specification
12
TEA6810V; TEA6811V
4.7
nF
50 nH
1 nF
100 Ω
ANZAC
TP103
2.2 kΩ
2.7 pF
100 nF
4.7
nF
OSCTNK
1.8 pF
Philips Semiconductors
CTC
1 kΩ
DGND
Front-end and PLL synthesizers for
car radios
SDA
100 Ω
VCCD
APPLICATION INFORMATION
dbook, full pagewidth
1996 Jun 18
LCKDET
VCCA1
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
PACKAGE OUTLINES
VSO40: plastic very small outline package; 40 leads
SOT158-1
D
E
A
X
c
y
HE
v M A
Z
40
21
Q
A2
A
(A 3)
A1
θ
pin 1 index
Lp
L
1
detail X
20
w M
bp
e
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
2.70
0.3
0.1
2.45
2.25
0.25
0.42
0.30
0.22
0.14
15.6
15.2
7.6
7.5
0.762
12.3
11.8
2.25
1.7
1.5
1.15
1.05
0.2
0.1
0.1
0.6
0.3
0.012 0.096
0.017 0.0087 0.61
0.010
0.004 0.089
0.012 0.0055 0.60
0.30
0.29
0.03
0.48
0.46
0.067
0.089
0.059
inches
0.11
0.045
0.024
0.008 0.004 0.004
0.041
0.012
θ
7o
0o
Notes
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
92-11-17
95-01-24
SOT158-1
1996 Jun 18
EUROPEAN
PROJECTION
18
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
VSO40: plastic very small outline package; 40 leads; face down
SOT158-2
D
E
A
y
X
c
HE
v M A
Z
40
21
L
Lp
θ
A1 Q
(A 3)
A2
A
pin 1 index
detail X
1
20
w M
bp
e
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
2.70
0.3
0.1
2.45
2.25
0.25
0.42
0.30
0.22
0.14
15.6
15.2
7.6
7.5
0.762
12.3
11.8
2.25
1.7
1.5
1.15
1.05
0.2
0.1
0.1
0.6
0.3
0.012 0.096
0.017 0.0087 0.61
0.010
0.004 0.089
0.012 0.0055 0.60
0.30
0.29
0.03
0.48
0.46
0.067
0.089
0.059
inches
0.11
0.045
0.024
0.008 0.004 0.004
0.041
0.012
θ
7o
0o
Note
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
92-11-17
95-01-24
SOT158-2
1996 Jun 18
EUROPEAN
PROJECTION
19
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
SOLDERING
Wave soldering
Introduction
Wave soldering techniques can be used for all VSO
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all VSO
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
1996 Jun 18
20
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1996 Jun 18
21
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
NOTES
1996 Jun 18
22
Philips Semiconductors
Product specification
Front-end and PLL synthesizers for
car radios
TEA6810V; TEA6811V
NOTES
1996 Jun 18
23
Philips Semiconductors – a worldwide company
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Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
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Czech Republic: see Austria
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India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
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Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 83749, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
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Portugal: see Spain
Romania: see Italy
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Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
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Slovenia: see Italy
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2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
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Tel. +55 11 821 2333, Fax. +55 11 829 1849
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Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
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Ukraine: PHILIPS UKRAINE, 2A Akademika Koroleva str., Office 165,
252148 KIEV, Tel. +380 44 476 0297/1642, Fax. +380 44 476 6991
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 708 296 8556
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 825 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com/ps/
(1) ADDRESS CONTENT SOURCE April 6, 1998
© Philips Electronics N.V. 1996
SCA49
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
517021/02/pp24
Date of release: 1996 Jun 18
Document order number:
9397 750 00916