ROHM BD9202EFS

LED Driver Series for LCD Backlight
White backlight LED drivers
for medium to large LCD panels
(SWREG type)
No.09040EAT01
BD9202EFS
●Description
BD9202EFS is the LED driver IC which loads the step-up DCDC controller and the constant electric current driver of 8ch.
As for the constant electric current driver, PWM modulated light of 10bit gradation (1024stages) is possible with the register
setting from 4 line serial interfaces.
Because it can adjust brightness with every channel, back light is controlled in every area according to the light and shade
of the picture, rise of contrast ratio is actualized.
●Features
1)8ch constant electric current driver built-in
・ Largest drive electric current 150mA/CH *2
・10bit gradation (1024 stages) modulated light is possible by register setting
・To input the standard CLK of PWM from outside is possible (BCT_SYNC_IN terminal)
・Because it is high output resisting pressure (60V), the multi-stage connection of LED is p ossi b le
・Detecting abnormal mode with LED opening detection
2)Step-up DCDC controller built-in
3) UVLO function
4) 4 line serial interface
5) HTSSOP-A44 Package
●Applications
For the equipment of loading LCD indicator of TV, monitor and note PC and the like
●Absolute maximum rating (Ta=25℃)
Parameter
Symbol
Rating
Unit
Power supply voltage
VCC
CPUVDD
36
5.5
V
V
VREG
5.5
V
LED1~8 terminal voltage
VLED1~8
60
V
EN,LOADSW terminal voltage
VEN,VLOADSW
36
V
FAIL1,FAIL2 terminal voltage
VFAIL1,VFAIL2
VVREF, VISET, VVSET, VTEST, VBRT,
VRT, VCS, VUVLO,
VCOMP,VCP1,VCP2,VTOUT1,
VTOUT2,VSWOUT,VOVPVCT_SYNC_IN,
VCT_SYNC_OUT,VBCT_SYNC_IN,
VBCT_SYNC_OUT
7
V
-0.3~5.5<
VREG
V
VREF,ISET,VSET,TEST,BRT,RT,
CS,UVLO,COMP,CP1,CP2,TOUT1,
TOUT2,SWOUT,OVP,CT_SYNC_IN,
CT_SYNC_OUT,BCT_SYNC_IN,
BCT_SYNC_OUT terminal voltage
CPUDI,CPUCLK,CPUCS,CPUDO
terminal voltage
VCPUDI, VCPUCLK, VCPUCS, VCPUDO
-0.3~5.5<
CPUVDD
V
Power Dissipation
Pd
4.5 *1
W
Operating Temperature Range
Topr
-40~+85
℃
Storage Temperature Range
Tstg
-55~+150
℃
LED Maximum Current
ILED
150 *2 *3
mA
*1At the time of mounting 2 layer glass epoxy base-plate of 70mm×70mm×1.6mm, 36.0mW is reduced at 1 ℃ above Ta=25.
*2 When the VF variation of LED is large, the loss quantity with the driver will increase, because there are times when package
temperature rises, please do the base-plate design after considering heat dissipation measure sufficiently.
*3It is the electric current quantity per 1ch.
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1/19
2009.04 - Rev.A
Technical Note
BD9202EFS
●Operating condition (Ta=25℃)
Parameter
Symbol
Voltage range
Unit
VREG
5.25~5.5
V
CPUVDD
2.7~5.5
V
CT oscillation frequency setting range
fCT
300~800
kHz
CT_SYNC_IN input frequency range *4*5
FCT_SYNC_IN
fCT~800
kHz
Power supply voltage
BCT oscillation frequency setting range
fBCT
100~1000
kHz
BCT_SYNC_IN input frequency range *4*5
FBCT_SYNC_I
fBCT~1000
kHz
VSET Input potential
VSET
0.9~2.4
V
*4 When not using external frequency input, please connect the terminal of CT_SYNC_IN, BCT_SYNC_IN to GND.
*5When using external frequency input, please do not do the operation that is changed to internal oscillation
frequency on midway.
●
Electric characteristic
((Unless otherwise specified Ta=25℃,VCC=24V,VREG=5V,
Parameter
Symbol
Min
CPUVDD=3V)
Limit
Typ
Max
Unit
Condition
【All the circuit electric currents】
Circuit electric currents
Icc
6
13
21
mA
VCC=24V
CPUVDD=3V, EN=3V
LED1~8=OFF
Stand-by electric current
IST
-
0
10
uA
EN=0V
VREG Output voltage
VREG
4.8
5
5.2
V
Io=0mA,CREG=2.2uF
VREG
IREG
5
12
20
VREF
1.57
1.60
1.63
mA
V
RONH
RONL
-
7
2
-
Ω
Ω
VOLIMIT
0.1
0.2
0.3
V
VLED
ICOMPSINK
ICOMPSOURCE
0.55
40
-200
0.75
100
-100
0.95
V
200
uA
VLED=2V,Vcomp=1V
-40
uA
VLED=0V,Vcomp=1V
FCT
500
VREG
×0.7
600
700
VREG
+0.3
VREG
×0.3
kHz
RT=51kΩ
【VREG section】
VREG sink electric current
VREF Output voltage
At the time of external impressing of
VREG=5.25VAt
LED1~8=OFF,EN=3V
Io=0uA
【Switching section】
SWOUT Source value of resistance
SWOUT Sink value of resistance
ION=-10mA
ION=10mA
【OCP section】
Over-current protective operating
voltage
Vcs=Sweep up
【Error amplifier section】
LED Control voltage
COMP Sink electric current
COMP Source electric current
【CT Oscillator section】
CT Oscillation frequency
CT_SYNC_IN input High voltage
VSYNC_INH
-
V
CT_SYNC_IN input low voltage
VSYNC_INL
-0.3
-
CT_SYNC_OUT output high voltage
VSYNC_OUTH
VREG
-1.0
VREG
–0.15
-
V
IOL=-1mA
CT_SYNC_OUT output low voltage
VSYNC_OUTL
-
0.1
0.5
V
IOL=1mA
FBCT
500
VREG
×0.7
600
700
VREG
+0.3
VREG
×0.3
kHz
V
【BCT Oscillator section】
BCT Oscillation frequency
-
BRT=51kΩ
BCT_SYNC_IN input High voltage
VBSYNC_INH
V
BCT_SYNC_IN input low voltage
VBSYNC_INL
-0.3
-
BCT_SYNC_OUT output high voltage
VBSYNC_OUTH
VREG
-1.0
VREG
–0.15
-
V
IOL=-1mA
BCT_SYNC_OUT output low voltage
VBSYNC_OUTL
-
0.1
0.5
V
IOL=1mA
V
【OVP section】
Over-voltage detection reference voltage
OVP Hysteresis voltage
VOVP
1.85
2.0
2.15
V
VOVP=Sweep up
VOVPHYS
0.4
0.5
0.6
V
VOVP=Sweep down
VUVLO_VREG
VUHYS_VREG
2.6
50
2.9
100
3.2
200
V
mV
VUVLO_EXT
1.7
1.9
2.1
V
VREG=Sweep down
VREG=Sweep up
UVLO=sweep down
VUHYS_EXT
50
100
200
mV
【UVLO section】
UVLO (VREG) Detection voltage
UVLO (VREG) Hysteresis voltage
UVLO(EXT) Detection voltage
UVLO(EXT) Hysteresis voltage
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2/19
UVLO=sweep up
2009.04 - Rev.A
Technical Note
BD9202EFS
Min
Limit
Typ
Max
Unit
RON_LOAD
1.2
2.0
2.2
kΩ
ILOAD=1mA
VCP
ICP
1.8
-2.0
2.0
-1.0
2.2
-0.5
V
uA
CP1,CP2=Sweep up
CP1,CP2=0V
⊿ILED
-
-
(5)
%
VISET
VOPEN
VSHORT
1.8
0.05
3.5
2.0
0.20
4.0
2.2
0.35
4.5
V
V
V
Input High voltage
VINH
0.7×
-
CPUVDD
CPUVDD
V
Input Low voltage
VINL
-0.3
-
CPUVDD
V
IIN
-5
0
5
uA
IEN
13
25
38
uA
VIN=5V(CPUCS,
CPUCLK,CPUDI),
CPUVDD=5V
VEN=5V(EN)
VOUTH
VOUTL
2.4
-
2.7
0.25
0.6
V
V
IOL=-1mA,CPUVDD=3V
IOL=1mA,CPUVDD=3V
VOL
0.07
0.14
0.28
V
IOL=1mA
Parameter
Symbol
【LOADSW section】
LOADSW ON value of resistance
【Filter(CP1,CP2) section】
CP Detection voltage
CP Charging current
【LED output (LED1~8) section】
LED Electric current absolute
variation
ISET Clamp voltage
Open detection voltage
Short detection voltage
【Logic input(EN,CPUCS,CPUCLK,CPUDI)】
Input influx electric current
(CPUCS,CPUCLK,CPUDI)
Input influx electric current (EN)
【Logic output section(CPUDO)】
output High voltage
output Low voltage
【FAIL1,2outut open drain】
FAIL Low voltage
+0.3
0.3×
Condition
ILED=75mA,VSET=1.65V
RISET=130kΩ
when input VSET>VISET
VLED=Sweep down
VLED=Sweep up
*This product is not designed for protection against radioactive rays.
●Block diagram
VIN
CIN
+
CREG
VREG
UVLO
15
34
VCC
EN
VREF
RT
CT_SYNC_IN
CT_SYNC_OUT
UVLO
EXT
Control
Logic
31
OCP
35
ERR AMP
8
39
I/F
4
29
+
+
32
1
3
20
Logic
22
23
Current driver
25
40
42
44
CP1
FAIL1
SWOUT
CS
PGND1
LED1
LED2
LED3
LED4
LED5
LED6
LED7
LED8
18
ISET
ISET
OVP
CP1
Driver
+
+
11
VSET
30
6
37
13
12
9
10
OVP
PWM COMP
OSC1
28
RPC
TOUT2
TSD
FILTER
CPC
CPUVDD
CPUCS
CPUCLK
CPUDI
CPUDO
UVLO
VREG
VREG
16
AGND
COMP
LOADSW
33
14
41
COUT
2
PGND2
PGND3
PGND4
PGND5
21
24
17
43
PWMCLK
BRT
27
OSC2
Open-Short
Detect
FILTER
BCT_SYNC_IN
5
38
7
BCT_SYNC_OUT
CP2
CP2
FAIL2
36
Nov.29.2007
26
TEST 19
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3/19
TOUT1
2009.04 - Rev.A
Technical Note
BD9202EFS
LED8
PGND5
LED7
EN
TOUT 2
COMP
BCT_SYNC_IN
CT_SYNC_IN
BCT_SYNC_OUT
CT_SYNC_OUT
UVLO
LOADSW
PGND1
SWOUT
OVP
CS
RT
BRT
TOUT 1
LED6
PGND4
LED5
●Pin configuration
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
17
18
19
20
21
22
LED4
16
PGND3
15
LED3
14
TEST
13
VSET
12
ISET
FAIL1
11
VREF
CP2
10
VREG
CP1
9
VCC
LED2
8
CPUCS
PGND2
7
CPUCLK
6
CPUVDD
5
CPUDO
4
CPUDI
3
AGND
2
FAIL2
1
LED1
BD9202EFS
●Terminal number, terminal name
PIN
No.
Terminal
name
(1)
(2)
(3)
LED1
PGND2
LED2
(4)
CP1
Function
PIN
No.
Terminal name
LED output terminal1
GND2 for LED
LED output terminal2
Condenser connected terminal for filter
setting 1
Condenser connected terminal for filter
setting 2
(23)
(24)
(25)
LED5
PGND4
LED6
(26)
TOUT1
(27)
BRT
(5)
CP2
(6)
FAIL1
Malfunction detection output 1
(28)
RT
(7)
FAIL2
Malfunction detection output 2
(29)
CS
Function
LED output terminal 5
GND4 for LED
LED output terminal 6
Output terminal 1 for test monitor 1
BCT oscillation frequency setting
resistant connected terminal
CT oscillation frequency setting
resistant connected terminal
DC/DC output electric current
detection terminal
DC/DC
Over-voltage
detection
terminal
DC/DC Switching output terminal
GND1 for LED
Load switch control terminal
It is the prevention detection terminal
for miss operating at low voltage
CT Synchronization signal output
terminal
BCT Synchronization signal output
terminal
CT Synchronization signal input
terminal
BCT Synchronization signal input
terminal
(8)
AGND
Small signal section GND
(30)
OVP
(9)
(10)
(11)
CPUDI
CPUDO
CPUVDD
Serial interface DATA input terminal
Serial interface DATA output terminal
Serial interface Power supply terminal
(31)
(32)
(33)
SWOUT
PGND1
LOADSW
(12)
CPUCLK
Serial interface CLK input terminal
(34)
UVLO
(13)
CPUCS
Serial interface CS input terminal
(35)
CT_SYNC_OUT
(14)
VCC
Power supply terminal
(36)
BCT_SYNC_OUT
(15)
VREG
Series regulator output terminal
(37)
CT_SYNC_IN
(16)
VREF
Reference voltage output terminal
(38)
BCT_SYNC_IN
(17)
ISET
(39)
COMP
Error amplifier output terminal
(18)
(19)
(20)
(21)
(22)
VSET
TEST
LED3
PGND3
LED4
LED fixed electric current setting resistant
connected terminal
DC modulated light voltage input terminal
Test mode change terminal
Output terminal 3
GND3 for LED
LED output terminal 4
(40)
(41)
(42)
(43)
(44)
TOUT2
EN
LED7
PGND5
LED8
Output terminal 2 for test monitor
Enabling terminal
LED output terminal 7
GND5 for LED
LED output terminal 8
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4/19
2009.04 - Rev.A
Technical Note
BD9202EFS
●The reference data (Unless otherwise specified VCC=24V and Ta=25 ℃)
110
5.5
OSC1,OSC2 FREQUENCY [kHz]
5.3
100
EFFICIENCY [%]
VREG [ V ]
700
VCC=24V, Io=0mA
VCC=24V, Io=0mA
5.1
4.9
4.7
90
80
70
4.5
-40
-15
10
35
60
680
660
640
620
600
580
540
520
500
60
85
-40
0
Ta [℃]
Fig.1 VREG Temperature characteristic
200
400
600
800
1000
-15
10
1200
35
60
85
Ta [℃]
IDCDC [mA]
Fig.3
Fig.2 VREF Temperature characteristic
100
VCC=24V, RT(BRT)=51kΩ
560
90
OSC1,OSC2 Temperature
re characteristic
1.0
80
0.9
VCC=24V, RSET=68kΩ
40
VCC=24V, RSET=130kΩ
VFB [ V ]
60
ILED [ mA ]
ILED [ mA ]
85
80
75
20
VCC=24V, RSET=68kΩ
0.8
0.7
0.6
0.5
0
70
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-40
-40
VLED [V]
Fig.4 ILED depending on VLED
-15
10
35
60
-15
10
85
35
60
85
Ta [℃]
Ta [℃]
Fig.5 ILED Temperature characteristic
Fig.6 VSET Constant electric current
characteristic
1.0
10
100
0.9
80
0.8
0.7
8
60
VREG [ V ]
ILED [ mA ]
VFB [ V ]
VCC=24V
40
20
6
4
0.6
2
0
0.5
0.0
-40
-15
10
35
Ta [℃]
Fig.7 VLED
characteristic
60
0.5
1.0
1.5
2.0
2.5
3.0
0
VLED [V]
85
0
Temperature
0.9
5
100
EFFICIENCY [%]
VFB [ V ]
VSHORT[ V ]
4
110
4.5
3.5
3
Fig.9 EN Threshold voltage
1.0
4.0
2
VEN [V]
Fig.8 ICC-VCC characteristic
5.0
1
0.8
0.7
0.6
90
80
VCC=24V, recommendation
70
for
external part use
3.0
60
0.5
-40
-15
10
35
60
85
Ta [℃]
Fig.10 Short detection temperature
characteristic
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-40
-15
10
35
60
85
Ta [℃]
Fig.11 Open detection temperature
characteristic
5/19
0
200
400
600
800
1000
1200
IDCDC [mA]
Fig.12 Efficiency
2009.04 - Rev.A
Technical Note
BD9202EFS
●Functional explanation
○
VREG
The fixed voltage of 5V is generated from VCC. It starts when it becomes EN=H.
UVLO (Under Voltage LOCK Out) is built in by VREG, When it is below 2.9V (typ),the internal circuit stops.
When it is above 3.0V (typ), the internal circuit operation starts.
Please connect Creg=2.2 μ F to the VREG terminal, as a capacity for phase compensation.
In order to make IC heat generation decrease, impressing voltage into the VREG terminal from outside, it is possible
to decrease the loss with the regulator inside IC.
In this case, as for the impressing voltage, please impress that of above output voltage (5.25V5.5V) of the internal
regulator.
○
UVLO (Under Voltage Lock Out)
There are UVLO (REG) which detects VREG voltage① and UVLO (VCC) ② which detects VCC voltage in UVLO.
When each UVLO is below specified value, the internal circuit is made to stop. (The logic section is reset.)
Detecting circuit
Detection object
Detection
Cancellation
UVLO (VREG)
VREG
Below2.9V(typ)
Above 3.0V(typ)
UVLO (VCC) VCC partial pressure input Below1.9V(typ)
Above 2.0V(typ)
Please do not connect VCC terminal (> 5.25V) to the UVLO terminal (for VCC detection) directly. Because there is a
possibility of destruction, please be sure to input with partial pressure.
○ Fixed electric current driver
Fixed current value of the fixed electric current driver can be got by constant doubling the standard electric current
which is decided by the resistance (RSET) of being connected to ISET and the voltage which are input into the VSET
terminal. In addition continual electric current variable (analog modulated light) is possible by changing VSET voltage
from outside.
In addition, it is possible to do PWM modulated light by the fact that the data is input to the internal register from the
serial interface section. It is possible to set the Duty value of PWM for each channel.
・Setting of fixed current value
Fixed current value (DC value) of the LED driver is a relational expression below.
ILED={VSET/(RSET[kΩ]+20[kΩ]) }×7980-8 [mA]
However, when VSET voltage is above 2V, it reaches the point where it is clamped with 2V inside IC, fixed
current value above that does not increase.
In addition, please input VSET in the range of 0.6V-2.4V.
Characteristic
RSET- ILE D特
性
160
140
IL ED[m A]
120
100
Calculated value
計算値
(実線)
Solid line
80
60
Survey value
実測値
(Marker)
( マ ーカー)
40
20
0
0
・
100
200
300
400
R S E T[kΩ ]
500
600
700
800
VREF normal output
In VREG block, VREF (1.6V (typ.)of reference voltage output is provided.
The necessity of doing the voltage impression from outside by the fact that this terminal is connected to the VSET terminal is gone.
However, because the voltage variation of VREF is to be reflected on the variation of LED fixed electric current directly, so that
please pay attention to it.
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6/19
2009.04 - Rev.A
Technical Note
BD9202EFS
○
Serial interface section
This IC is controlled by 4 line serial interfaces of CPUCLK, CPUCS,CPUDI and CPUDO. The data entry format and
timing are shown below.
In the case of WRITE
CPUCS
tCYC
tCSS
CPUCLK
1
tDIS
2
3
tCLKH
4
5
6
7
tDIH
CPUDI
W
tCSH
8
9
10
11
12
13
14
15
16
tCLKL
A5
A4
A3
A2
A1
A0
D7
*
CPUDO
D6
D5
D4
D3
D2
D1
D0
Hi-Z
In the case of READ
CPUCS
tCYC
tCSS
CPUCLK
1
tDIS
CPUDI
2
3
4
tCLKH
5
6
7
tDIH
R
A5
tCSH
8
9
10
11
12
13
14
15
16
tCLKL
A4
A3
A2
A1
A0
*
*
*
*
*
*
*
*
D6
D5
D4
D3
D2
D1
*
tDOD
CPUDO
D7
Hi-Z
D0
Hi-Z
・It does not correspond to the continual entry of the data. It is necessary to set CPUCS into L in every address.
・There is no function of the automatic increment of address.
・Address width is correspondence to 6bit, but please do not access the address other than 00h-11h absolutely.
AC electric quality
Function
CPUCLK Periods
CPUCLK high level width
CPUCLK low level width
CPUDI input set up time
CPUDI input hold time
CPUCS input set up time
CPUCS input hold time
CPUDO Output delay time
Symbol
tCYC
tCLKH
tCLKL
tDIS
tDIH
tCSS
tCSH
tDOD
Min
Limit
Typ
Max
100
35
35
50
50
50
50
-
-
40
Unit
ns
ns
ns
ns
ns
ns
ns
ns
(Output load:15pF)
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7/19
2009.04 - Rev.A
Technical Note
BD9202EFS
Register map
Addres
Initial
R/W
s
value
Register
name
00H
R/W
00h
PWMCNT
01H
R/W
00h
02H
R/W
00h
03H
R/W
00h
04H
R/W
00h
05H
R/W
00h
06H
R/W
00h
07H
R/W
00h
08H
R/W
00h
09H
R/W
00h
0AH
R/W
00h
0BH
R/W
00h
0CH
R/W
00h
0DH
R/W
00h
0EH
R/W
00h
0FH
R/W
00h
10H
R/W
00h
11H
R/W
00h
LEDEN
SETPWM1
1
SETPWM
12
SETPWM
21
SETPWM
22
SETPWM
31
SETPWM
32
SETPWM
41
SETPWM
42
SETPWM
51
SETPWM
52
SETPWM
61
SETPWM
62
SETPWM
71
SETPWM
72
SETPWM
81
SETPWM
82
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bitφ
PWMRS -
-
-
-
-
PARADRV
PWMEN
LED8EN
PWM
LED1[7]
-
LED7EN
PWM
LED1[6]
-
LED6EN
PWM
LED1[5]
-
LED5EN
PWM
LED1[4]
-
LED4EN
PWM
LED1[3]
-
LED3EN
PWM
LED1[2]
-
PWM
LED2[7]
-
PWM
LED2[6]
-
PWM
LED2[5]
-
PWM
LED2[4]
-
PWM
LED2[3]
-
PWM
LED2[2]
-
PWM
LED3[7]
-
PWM
LED3[6]
-
PWM
LED3[5]
-
PWM
LED3[4]
-
PWM
LED3[3]
-
PWM
LED3[2]
-
PWM
LED4[7]
-
PWM
LED4[6]
-
PWM
LED4[5]
-
PWM
LED4[4]
-
PWM
LED4[3]
-
PWM
LED4[2]
-
PWM
LED5[7]
-
PWM
LED5[6]
-
PWM
LED5[5]
-
PWM
LED5[4]
-
PWM
LED5[3]
-
PWM
LED5[2]
-
PWM
LED6[7]
-
PWM
LED6[6]
-
PWM
LED6[5]
-
PWM
LED6[4]
-
PWM
LED6[3]
-
PWM
LED6[2]
-
PWM
LED7[7]
-
PWM
LED7[6]
-
PWM
LED7[5]
-
PWM
LED7[4]
-
PWM
LED7[3]
-
PWM
LED7[2]
-
PWM
LED8[7]
-
PWM
LED8[6]
-
PWM
LED8[5]
-
PWM
LED8[4]
-
PWM
LED8[3]
-
PWM
LED8[2]
-
LED2EN
PWM
LED1[1]
PWM
LED1[9]
PWM
LED2[1]
PWM
LED2[9]
PWM
LED3[1]
PWM
LED3[9]
PWM
LED4[1]
PWM
LED4[9]
PWM
LED5[1]
PWM
LED5[9]
PWM
LED6[1]
PWM
LED6[9]
PWM
LED7[1]
PWM
LED7[9]
PWM
LED8[1]
PWM
LED8[9]
LED1EN
PWM
LED1[0]
PWM
LED1[8]
PWM
LED2[0]
PWM
LED2[8]
PWM
LED3[0]
PWM
LED3[8]
PWM
LED4[0]
PWM
LED4[8]
PWM
LED5[0]
PWM
LED5[8]
PWM
LED6[0]
PWM
LED6[8]
PWM
LED7[0]
PWM
LED7[8]
PWM
LED8[0]
PWM
LED8[8]
Function
PWM control
T
register
LED ON/OFF Control register
Register 1 for setting LED1 PWM
( Subordinate bit setting)
Register 2 for setting LED1 PWM
(Superior bit setting)
Register 1 for setting LED2 PWM
(Subordinate bit setting)
Register 2 for setting LED2 PWM
(Superior bit setting)
Register 1 for setting LED3 PWM
(Subordinate bit setting)
Register 2 for setting LED3 PWM
(Superior bit setting)
Register 1 for setting LED4 PWM
(Subordinate bit setting)
Register 2 for setting LED4 PWM
(Superior bit setting)
Register 1 for setting LED5 PWM
(Subordinate bit setting)
Register 2 for setting LED5 PWM
(Superior bit setting)
Register 1 for setting LED6 PWM
(Subordinate bit setting)
Register 2 for setting LED6 PWM
(Superior bit setting)
Register 1 for setting LED7 PWM
(Subordinate bit setting)
Register 2 for setting LED7 PWM
(Superior bit setting)
Register 1 for setting LED8 PWM
(Subordinate bit setting)
Register 2 for setting LED8 PWM
(Superior bit setting)
All registers are reset by each condition below.
①UVLO(VREG)<2.9V(typ.)
②UVLO(EXT)<1.9V(typ.)
③Thermal shutdown detection (Tj>175℃)
④Register PWMRST=1( exclude PWMRST itself)
●ADDR=00h
PWMCNT(PWM Control register : Read/Write)
Bit
7
6
5
Register
PWMRST
not_used
not_used
name
Initial value
0
0
0
PWMEN
0
1
PARADRV
0
1
4
3
2
1
0
not_used
not_used
not_used
PARADRV
PWMEN
0
0
0
0
0
PWM mode control
disable (Default)
PWM mode enable
LED output control
To control LED1-LED8 independently
To control LED1and 2, LED3 and 4, LED5 and 6, LED7
and 8 simultaneously
PWMRST
PWM logic reset control
0
Normal Function (Default)
1
Logic reset
When it makes PWMRST = ' 1 ', PWM Logic and all registers (the PWMRST register is excluded) is reset.
To make normal operation, it is necessary to reset if make PWMRST= ' 0 '.
When it makes PARADRV= ' 1 ', because LED1 and LED2 (LED3 and LED4, LED5 andLED6, LED7 and LED8) operate
synchronously (following the setting of LED of odd number turn), when you use the output of LED1 and LED2 (LED3and LED4,
LED5 and LED6, LED7 and LED8) by short-circuiting, it operates as each heavy-current driver of ILEDMAX=300mA.
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8/19
2009.04 - Rev.A
Technical Note
BD9202EFS
●ADDR=01h
LEDEN(LED ON/OFF Control register : Read/Write)
Bit
7
6
5
Register
LED8EN
LED7EN
LED6EN
name
Initial value
0
0
0
LED1(~8)EN
0
1
4
3
2
1
0
LED5EN
LED4EN
LED3EN
LED2EN
LED1EN
0
0
0
0
0
LED1 (~8) output control
OFF (Default)
Usual ON
When doing PWM modulated light with PWMEN of ADDR=00h, if LED1 of ADDR=01h (8) EN is designated as 1, it becomes
regular ON. (LED1 (8) EN takes precedence.) So after that, if LED1 (8) EN is designated as 0, it returns to the PWM modulated
light that is set at beginning.
●ADDR=02h
SETPWM11(Register 1 for setting LED1 PWM (Subordinate bit setting): Read/Write)
Bit
7
6
5
4
3
2
1
0
Register PWMLED1 PWMLED PWMLED1 PWMLED1 PWMLED1 PWMLED1 PWMLED1 PWMLED1
name
[7]
1[6]
[5]
[4]
[3]
[2]
[1]
[0]
Initial value
0
0
0
0
0
0
0
0
●ADDR=03h
SETPWM12((Register 2 for setting LED1 PWM (superior bit setting) : Read/Write)
Bit
7
6
5
4
3
Register
not used
not used
not used
not used
not used
name
Initial value
0
0
0
0
0
2
not used
0
1
0
PWMLED1 PWMLED1
[9]
[8]
0
0
It sets Duty of PWM modulated light with the total 10bit of Bit70 of ADDR=02h and Bit1-0 of ADDR=03h.
To set the subordinate position 8bit with ADDR=02h and the Superior position 2bit with ADDR=03h. (Chart below)
PWMLED1
[9:0]
“0000000000”
“0000000001”
“0000000010”
“0000000011”
~
“1111111100”
“1111111101”
“1111111110”
“1111111111”
LED1 Pulse width
Usual ‘L’ (Default)
PWMCLK 1 Clock width
PWMCLK 2 Clock width
PWMCLK 3 Clock width
~
PWMCLK 1020 Clock width
PWMCLK 1021 Clock width
PWMCLK 1022 Clock width
PWMCLK 1023 Clock width
●ADDR=04h~11h
The setting method is similar to LED1 of ADDR=02h,03h is described above with the PWM pulse width setting register of
LED28.
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9/19
2009.04 - Rev.A
Technical Note
BD9202EFS
PWM設定例
PWM Setting example
PWMCLK(=FBCT)
(600kHz)
PWMEN
(resister)
COUNT [9:0]
(internal)
0
1
2
3
4
5
300
6
1021 1022 1023
0
PWMLED1 [9:0] = 300d = 12Ch
LED1ON
(internal)
PWMLED2 [9:0] = 6d = 006h
LED2ON
(internal)
1.71ms(586Hz)
※
When count [ 9:0 ] becomes 1, LEDON will become High and then LED lights up. When COUNT [ 9:0 ] reaches to the
value that is set by PWM pulse, LEDON will become Low and the light goes out.
※ COUNT [9:0 ] =1 with Illumination timing of each channel becomes being identical.
※
※
When setting of pwm modulated light is modified, it is reflected being at the point where COUNT [ 9:0 ] is reset to 0
(It is not immediately reflection with register entry)
After writing ' 1 ' in PWMEN, the delay of 0 ~maximum of 1 clocks occurs until LED lights up.
○
Register setting example of LED illuminations
・ When illuminates LED3 and LED8 regular (100% illumination)
① (ADDR,DATA)=(01h、84h)
→ Operation of regular illumination
・ When it does PWM modulated light with 40% to LED3, and 80% to LED8,
1024×40%=409 , 1024×80%=819
Because (409)DEC=(199)HEX , (819)DEC=(333)HEX
① (ADDR,DATA)=(06h、99h)
(ADDR,DATA)=(07h、01h)
→Setting LED3 to 40%
② (ADDR,DATA)=(10h、33h)
(ADDR,DATA)=(11h、03h)
→Setting LED8 to 80%
→Operation of modulated light
③ (ADDR,DATA)=(00h、01h)
○
The method connected control wire when plural IC is used
Connected method of the control wire when plural BD9202EFS is controlled with one CPU is shown.
You connect CPUCLK and CPUDI in parallel (note the ability of respective drive), CPUCS wires in each BD9202EFS.
CPU
BD9202 No.1
CPUCS
DATA
CLK
CS1
CPUDI
CPUCLK
BD9202 No.2
CS2
CPUCS
CS3
CPUDI
CPUCLK
BD9202 No.3
CPUCS
CPUDI
CPUCLK
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10/19
2009.04 - Rev.A
Technical Note
BD9202EFS
○Booster DC/DC Controller
・ LED Series Numeric
It detects the LED cathode voltage, or the LED voltage, and controls the output voltage to be 0.75 (Typ.). The booster only
operates when the LED output is operating. When multiple LED outputs are operating, the LED VF controls the LED output
of the highest line to be 0.75V (Typ.). Therefore, the voltages of other LED outputs are higher by the variation of VF.
Furthermore, you must be aware that the LED inline numerics have the following limits. At open detection, 85% of
the OVP configured voltage becomes the trigger, so the maximum value of output voltage during normal operation is
51V=60×0.85, and 51V/VF>maximum N.
・
Over voltage Protection Circuit OVP
Inputs the output voltage to the OVP terminal with resistive divide. The configured value of OVP should be
determined by the series numeric of the LED and the VF variance. When determining the OVP configured voltage,
the open detection trigger, OVP×0.85 should be considered. The switching operation stops when OVP is detected.
Furthermore, if the output voltage falls to 80% of the OVP configuration voltage within the filter time tcp1 determined
by CP1, OVP is released. If OVP continues for over tcp1, the error detection flag FAIL1 turns to Low, it latches with
the switching operation in the stopped position.
When the output voltage side is ROVP1 and the GND side is ROVP2, the OVP detection voltage is:
VOVP=(ROVP1+ROVP2)/ROVP2×2.0V
When ROVP1=560kΩand ROVP2=20kΩ, OVP activates when VOUT=58V or more.
・ Booster DC/DC Converter Oscillation Frequency and LED Driver PWM Standard Frequency
By attaching resistance to RT (BRT), it is possible to configure triangular wave oscillation frequency. The RT (BRT)
determines the charge and discharge current corresponding to the internal condenser, and the frequency changes.
Configure the RT (BRT) resistance by referring to the theoretical formula below. We recommend a range of 30kΩ
~300kΩ. Configurations outside of the frequency range in the chart below can result in stopping switching, and
operation cannot be guaranteed.
R T(B R T)-FOSC特
性
RT(BRT)-FOSC
Characteristics
1200
1000
fOS C [kHz]
800
Calculated
Value
計算値
(Actual Line)
600
fosc 
(実線)
3.04  10 4
[kHz]
RT (BRT )[ kΩ]
実Measured
測値
( マ ーValue
カー )
400
(Marker)
200
0
0
・
100
200
300
R T(BR T)[kΩ ]
400
500
600
Internal Oscillation Frequency Output Terminal CT_SYNC_OUT and External Synchronous Terminal CT_SYNC_IN
The internal oscillation frequency output terminal CT_SYNC_ OUT outputs the internal oscillator’s clock configured by the
RT terminal. However, there is no output when there is a CLK input in the external synchronous terminal CT_SYNC_IN.
The external synchronous terminal CT_SYNC_IN can be the operational frequency of the DC/DC converter by
externally inputting CLK. At this time, the external input frequency should be configured to be higher than the internal
oscillation frequency. Furthermore, there should be no switching between the external synchronous and internal oscillator
during operation.
・
Soft Start
There is no soft start function with this IC. At startup, stand-up occurs with control by the current value configured by
OCP (over-current detection).
・ Over-current Protection Circuit (OCP)
The current flowing through the coil is changed to voltage by the sense resistance Rcs, and when the CS terminal is
over 0.2V (typ), the switching operation is stopped.
OCP detection is in pulse-by-pulse format, and is detected at every switching cycle and reset at the next clock.
When detection continues longer than the time configured at tCP1, FAIL1=L and it latches with the switching operation
in the stopped position.
○
Error Detection Output Function
・ Outputs errors detected by protection circuits to FAIL1 and FAIL2 terminals. FAIL1 or FAIL2 switch to Low after the
filter time configured at CP1 or CP2, when they detect OVP or OCP (FAIL1) or LED open/short (FAIL2). (Because
FAIL1 terminal is open collector output, it is used with external pull-up.)
The filter time for CP1 and CP2 is expressed as:
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Tcp1(cp2) 
11/19
Ccp1 2V
1μA
2009.04 - Rev.A
Technical Note
BD9202EFS
【Protection Functions】
Logic at detection
FAIL1
FAIL2
Protection Function
Detection
Release
Type
UVLO (VREG)
UVLO (EXT)
TSD
VREG<2.9V
UVLO<1.9V
Tj>175℃
VOVP>2.0V &
t>tCP1
VCS≧0.2V &
t>tCP1
VLED<0.2V &
VOVP>1.7V
VLED≧4.0V
VREG>3.0V
UVLO>2.0V
Tj<150℃
Hysteresis
Hysteresis
Hysteresis
H
H
H
H
H
H
VOVP<1.5V
Latch
L
H
VCS<0.2V
Latch
L
H
Latch
H
L
Latch
H
L
OVP
OCP
LED open detection
LED short detection
VLED>0.2V &
VOVP<1.6V
VLED<4.0V
To clear the latch type, the logic section must be reset.
Protection Function
UVLO (VREG)
UVLO (EXT)
TSD
OVP
OCP
LED open detection
LED short detection
*1
*1
Operation at protection function detection
LOADSW
LED Dr
ON
All CH stop
ON
All CH stop
ON
All CH stop
OFF
(All CH stop) *2
OFF
Normal operation
ON
All CH stop
ON
All CH stop
DCDC
Stop
Stop
Stop
Stop
Current limit
Stop
Stop
Internal logic
Reset
Reset
Reset
Normal operation
Normal operation
Normal operation
Normal operation
*1 LED open and short detection is only valid with operating channels, and all CH turn to OFF when 1-ch error is
detected. Furthermore, it is only valid in the ON areas during PWM operation.
*2 Because the DC/DC converter stops and there is no voltage supply for the LED, the light will be turned off.
●
Selection of External Parts
1.
Selection of Coil (L)
The value of the coil greatly affects the input ripple current. As presented
in formula (1), the larger the coil and the higher the switching frequency, the
lower the ripple current.
ΔIL
ΔIL 
VCC
(VOUT  Vcc)  Vcc
[ A] ・・・・・ (1)
L  VOUT f
When efficiency is expressed as in formula (2), the input peak current is as
shown in formula (3).
IL
L
VOUT
CO

VOUT  IOUT
・・・・・ (2)
Vcc  Icc
ILMAX  Icc 
ΔIL VOUT IOUT
ΔIL

 ・・・・・ (3)
2
Vcc
2
※
If current that is stronger than the coil’s fixed current value flows through the coil, there is magnetic saturation in
the coil, lowering efficiency.
A margin large enough should be considered during selection, so that the peak current does not exceed the coil’s
fixed current value.
※ To lessen loss from the coil and improve efficiency, coils with low resistance components (DCR and ACR) should
be selected.
2.
Selection of Output Condenser (Co)
The stability domain of the output voltage and equivalent series resistance necessary to smooth out the ripple voltage should be
consideredVCC
when choosing a condenser for the output side.
The output ripple voltage is determined by formula (4).
ΔVOUT  ILMAX  RESR 
L
IL
VOUT
ESR
l
IOUT 1

 [V
] ・・・・・ (4)
Co
f

(ΔIL: output ripple current, ESR: equivalent series resistance of Co, η:
efficiency)
※The condenser’s fixed value should be selected with enough margin for
the output voltage.
CO
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12/19
2009.04 - Rev.A
Technical Note
BD9202EFS
3.
Selection of Input Condenser (Cin)
The input condenser selected should have low ESR with enough capacity to be
compatible large ripple current, in order to prevent large transient voltage.
VCC
The ripple current IRMS can be derived from formula (5).
Cin
IRMS  IOUT 
L
IL
VOUT
VOUT
[ A] ・・・・・ (5)
Furthermore, because it relies heavily on the characteristics of the power
used for input, the wiring pattern on the substrate and MOSFET gate drain
capacity, the usage temperature, load range and MOSFET conditions must
be adequately confirmed.
CO
●
(VOUT  VCC)  VOUT
4.
Selection of MOSFET for Load Switch, and its Soft Start
Because there are no switches on the route between the VCC and the VO with regular boost applications, in case of
an output short circuit the coil or rectification diode may be damaged. To prevent this from happening, a PMOSFET
load switch should inserted between the VCC and the coil. PMOSFET with better ability to withstand pressure
between gate-source and drain-source than VCC should be selected.
To initiate soft start of the load switch, insert capacity between the gate and source.
5.
Selection of Switching MOSFET
There are no problems as long as the absolute maximum rating of the current rating is L and the pressure threshold
and rectification diode of C are at least VF, but in order to actualize high-speed switching, one with small gate
capacity (injected charge amount) should be selected.
※ Excess of over current protection configuration recommended
※ Higher efficiency can be gained if one with smaller ON resistance is selected.
6.
Selection of Rectification Diode
Select a Schottky barrier diode with higher current ability than the current rating of L and higher reverse pressure
threshold than the threshold of C, particularly with low forward voltage VF.
Phase Compensation Configuration Method
・Stability of Applications
Feedback stability conditions for reverse feedback are as follows:
・ Phase-lag of less than 150°(phase margin of over 30°) when gain is 1 (0dB)
Furthermore, DC/DC converter applications have been sampled by the switching frequency, so the GBW of the entire line is
configured at less than 1/10 of the switching frequency. To sum up, the characteristics aimed for by applications are as
outlined below:
・ Phase-lag less than 150°(phase margin over 30°) when gain is 1 (0dB)
・ The GBW (frequency of gain 0dB) at that time is less than 1/10 of switching frequency
Therefore, to improve the response with GBW limitations, it is necessary to make the switching frequency higher.
The trick to secure stability by phase compensation is to cancel out the second phase lag (-180°) generated by LC
resonance with two phase leads (insert two phase leads).
Phase leads are by the output condenser’s ESR component or the error amp output Comp terminal’s CR.
With DC/DC converter applications, there is always a LC resonance circuit at the output, so the phase lag at that section is
180°. If the output condenser has large ESR (several Ω), such as an aluminum electrolysis condenser, a phase lead of
+90°is generated, and the phase lag is -90°. When using an output condenser with low ESR such as a ceramic
condenser, insert R for the ESR component.
VCC
VCC
fr 
VOUT
CO
1
2 LCO
fr 
[ Hz] VOUT
Resonance
point
phase lag -180°
RESR
1
2 LCO
fESR 
Resonance
[ Hz] -180°
point
1
Phase lead
[ Hz] 2RESRCo
Phase lag -90°
CO
With the changes in phase characteristics by caused by ESR, the number of phase leads to be inserted is one.
The frequency configuration to insert phase lead should ideally be configured close to the LC resonance frequency in order to
cancel LC resonance.
This configuration is for simplicity, and no detailed calculations have been carried out, so there are times when adjustments
on the actual product are necessary. These characteristics change depending on substrate layout and load conditions, so
ample confirmation is necessary during design for mass production.
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13/19
2009.04 - Rev.A
Technical Note
BD9202EFS
●Electricity Consumption Calculations
Pc(N)=ICC*VCC+2*Ciss*VREG*Fsw*Vcc*[VLED*N+ΔVf*(N-1)]*ILED
:Maximum circuit current
:Power voltage
:External FET capacity
:SW gate voltage
:SW frequency
:LOAD SW ON resistance
:LOAD SW maximum inflowing current
:LED control voltage
:LED parallel numeric
:LED Vf variance
:LED output current
ICC
VCC
Ciss
Vsw
Fsw
Rload
Iload
VLED
N
ΔVf
ILED
<Sample calculation>
When Pc(8)=21mA×30V+500pF×5V×600kHz×30V+[0.95V×8+ΔVf×7] ×75mA
ΔVf=1.2V (about 0.1V each),
Pc(8)=0.63W+0.045W+1.2W
=1.875W
Because this IC has a built-in driver circuit, there is a considerable amount of heat generated. Careful consideration is
necessary for substrate and heat dissipation design.
●PCB Board Circuit Diagram
RVCC=300Ω
VCC
14
CVCC=10uF
1
2
3
4
RVULO1
=91kΩ
LED8
44
PGND5
43
LED7
42
CP1
EN
41
CP2
TOUT2
40
6
FAIL1
COMP
39
7
FAIL2
BCT_SYNC_IN
38
8
AGND
CT_SYNC_IN
37
1
LED1
2
PGND2
3
LED2
4
5
RUVLO2
=10kΩ
J4
GND
J3
CT_SYNC_IN
37
BCT_SYNC_IN
38
RE-H42TD-1130
CP1=27pF
CPUVDD
CP2=27pF
RFL1=5.1kΩ
RPC=300Ω
9
CPUDI
10
CPUDO
11
CPUVDD
12
CPUCLK
13
CPUCS
14
VCC
15
VREG
16
17
BD9202EFS
CPC=1uF
RFL2=5.1kΩ
BCT_SYNC_OUT
36
CT_SYNC_OUT
35
UVLO
34
LOSDSW
33
PGND1
32
SWOUT
31
OVP
30
VREF
CS
29
ISET
RT
28
RLD1
=5.1kΩ
LED1 1
CLD
Q1
LED8 44
L1
47uH
LED7 42
D1
RESR
CVOUT
=220uF
RLPF=100Ω
RSET=68kΩ
RCT=51kΩ
RBCT=51kΩ
VSET
BRT
27
19
TEST
TOUT1
26
20
LED3
LED6
25
21
PGND3
PGND4
24
22
LED4
LED5
23
ROVP1=
560kΩ
LED6 25
Q2
CREG=2.2uF
18
LED2 3
RLD2
=5.1kΩ
CLPF
=1000pF
ROVP2
=20kΩ
RCS=51mΩ
LED5 23
LED3 20
LED4 22
CSGND
J5
1
2
3
4
5
6
7
8
9
10
11
12
1
2
3
4
5
6
7
8
CPUVDD 11
CPUDCLK 12
CPUDO
10
CPUCS
13
PGND1
32
CPUDI
9
EN
41
08FDZ-ST (1)
VREF
16
VSET
18
J2
J1
12FDZ-BT
BCT_SYNC_IN
38
BCT_SYNC_OUT 36
CT_SYNC_IN
37
CT_SYNC_OUT
35
1
2
3
4
5
6
7
8
08FDZ-ST (2)
○
○
○
○
○
○
The CVCC and CREG decoupling condensers should be placed as close as possible to the IC pin.
Because high current can flow through CSGND and PGND1~4, they should all be wired independently with low impedance.
Do not apply noise to 17-pin ISET, 18-pinVSET, 27-pin BRT, 28-pin RT and 39-pin COMP.
1-pin LED, 3-pin LED2, 20-pin LED3, 22-pin LED4, 23-pin LED5, 25-pin LED6, 31-pin SWOUT, 35-pin CT_CYNC_OUT,
36-pin BCT_SYNC_OUT, 42-pin LED7 and 44-pin LED8 switch, so make sure they do not affect the surrounding pattern.
The thick-lined areas should be laid out as short as possible with broad pattern.
During normal use, the jumper configurations are J1~J4=Short and J5=open.
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© 2009 ROHM Co., Ltd. All rights reserved.
14/19
2009.04 - Rev.A
Technical Note
BD9202EFS
●External Parts for PCB Board
Name
Connector
Ceramic
Type
Parts Number
Connecting Point
Size
Maker
Pieces/Board
2
For SPI/IF
22 05 2081
-
-
Molex
For LED Board I/F
22 05 2121
-
-
Molex
1
For Power Supply
22 01 2045
-
-
Molex
1
-
-
CSS
1005
murata
1
27pF
GRM1882C1H270JA01
CP1 , CP2
1608
murata
2
1000pF
GRM15XB11H102KA86
CLPF
1005
murata
1
10uF
GRM55D31106KA87
CVCC
5750
murata
1
2.2uF
GRM188R71A225KE15
CREG
1608
murata
1
1uF
GRM188R71A105KA61
CPC
1608
murata
1
-
-
CLD
3225
murata
1
Tantal
220uF
UVR5A221MPD
CVOUT
-
Rubicon
1
Resistance
5.1kΩ
MCR03Series5101
RLD1 , RLD2 ,
RFL1 , RFL2
1608
ROHM
4
PMOS
NMOS
Indactance
Diode
※
-
-
RESR
3216
-
1
51mΩ
MCR10SeriesR051
RCS
2012
ROHM
1
100Ω
MCR03Series1000
RLPF
1608
ROHM
1
300Ω
MCR03Series3000
RPC , RVCC
1608
ROHM
1
10kΩ
MCR03Series1002
RUVLO2
1608
ROHM
1
20kΩ
MCR03Series2002
ROVP2
1608
ROHM
1
51kΩ
MCR03Series5102
RCT , RBCT
1608
ROHM
2
68kΩ
MCR03Series6802
RSET
1608
ROHM
1
91kΩ
MCR03Series9102
RUVLO1
1608
ROHM
1
560kΩ
MCR03Series5603
ROVP1
1608
ROHM
1
-
RSS090P03FU6TB
Q1
-
ROHM
1
47uH
TPC8213-H
C12-K7.5L EJ
Q2
L1
-
TOSHIBA
Mitsumi
1
1
-
RB160L-60TE25
D1
-
ROHM
1
The values above are fixed, and have been verified for operation at VCC=24V, LED12-series 8-parallel and
ILED=150mA.
Therefore, the optimal values can vary depending on usage conditions, so fixed values should be determined with
careful consideration.
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© 2009 ROHM Co., Ltd. All rights reserved.
15/19
2009.04 - Rev.A
Technical Note
BD9202EFS
●In/Output Equivalent Circuit 1
1.LED1 , 3.LED2 , 20.LED3 ,
22.LED4 , 23.LED5 , 25.LED6 ,
42.LED7 , 44.LED8
4.CP1 , 5.CP2
6.FAIL1 , 7.FAIL2
VREG
50
LED1~8
100k
OVP
100
3k
7V
5k
9.CPUDI ,12.CPUCLK , 13.CPUCS
CPUVDD
CPUVDD
10.CPUDO
CPUVDD
15.VREG
CPUVDD
CL7V
CPUDO
150k
VREG
765k
252k
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© 2009 ROHM Co., Ltd. All rights reserved.
16/19
2009.04 - Rev.A
Technical Note
BD9202EFS
●In/Output Equivalent Circuit 2
16.VREF
VREG
17.ISET
CL7V
18.VSET
CL7V
CL7V
VREF
ISET
VSET
500
500
800k
26.TOUT1 , 35.CT_SYNC_OUT ,
36.BCT_SYNC_OUT
19.TEST
VREG
CL7V
TEST
27.BRT , 28. RT
VREG
CL7V
RT
30k
167
20k
29.CS
30.OVP, 34.UVLO
CL7V
CL7V
OVP
CS
31.SWOUT
VREG
VREG
1k
SWOUT
100
100k
5k
5k
5P
33.LOADSW
37.CT_SYNC_IN , 38.BCT_SYNC_IN
39.COMP
VREG
CL7V
VREG
VREG
LOADSW
10k
COMP
2k
40.TOUT2
41.EN
CL7V
VREG
VCC
CL7V
EN
2k
TOUT2
50
172k
135k
10k
7V
100k
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© 2009 ROHM Co., Ltd. All rights reserved.
17/19
2009.04 - Rev.A
Technical Note
BD9202EFS
●Usage Notes
1.) Absolute Maximum Ratings
Although the quality of this product has been tightly controlled, deterioration or even destruction may occur if the absolute maximum ratings,
such as for applied pressure and operational temperature range, are exceeded.
mode destruction conditions.
Furthermore, we are unable to assume short or open
If special modes, which exceed the absolute maximum ratings, are expected, physical safely precautions
such as fuses should be considered.
2.) Reverse Connection of Power Supply Connector
The IC can destruct from reverse connection of the power supply connector.
Precautions, such as inserting a diode between the external
power supply and IC power terminal, should be taken as protection against reverse connection destruction.
3.) Power Supply Line
Because there is a return of current regenerated by back EMF of the external coil, the capacity value should be determined after confirming
that there are no problems with characteristics such as capacity loss at low temperatures with electrolysis condensers, for example by
placing a condenser between the power supply and GND as a route for the regenerated current.
4.) GND Potential
The potential of the GND pin should be at the minimum potential during all operation status
5.) Heat Design
Heat design should consider power dissipation (Pd) during actual use and margins should be set with plenty of room.
6.) Short-circuiting Between Terminals and Incorrect Mounting
When attaching to the printed substrate, pay special attention to the direction and proper placement of the IC.
If the IC is attached
incorrectly, it may be destroyed.
Destruction can also occur when there is a short, which can be caused by foreign objects entering between outputs or an output and the
power GND.
7.) Operation in Strong Magnetic Fields
Exercise caution when operating in strong magnet fields, as errors can occur.
8.) ASO
When using this IC, it should be configured so that the output Tr should not exceed absolute maximum ratings and ASO. With CMOS ICs
and ICs that have multiple power sources, there is a chance of rush current flowing momentarily, so exercise caution with power supply
coupling capacity, power supply and width of GND pattern wiring and its layout.
9.) Heat Interruption Circuit
This IC has a built-in Temperature Protection Circuit (TSD circuit). The temperature protection circuit (TSD circuit) is only to cut off the IC
from thermal runaway, and has not been designed to protect or guarantee the IC. Therefore, the user should not plan to activate this
circuit with continued operation in mind.
10.) Inspection of Set Substrates
If a condenser is connected to a pin with low impedance when inspecting the set substrate, stress may be placed on the IC, so there
should be a discharge after each process. Furthermore, when connecting a jig for the inspection process, the power must first be turned
OFF before connection and inspection, and turned OFF again before removal.
11.) IC Terminal Input
This IC is a monolithic IC, and between each element there is a P+ isolation and P substrate for element separation.
There is a P-N junction formed between this P-layer and each element’s N-layer, which makes up various parasitic elements.
For example, when resistance and transistor are connected with a terminal as in figure 15:
〇When GND>(terminal A) at the resistance, or GND>(terminal B) at the transistor (NPN), the P-N junction operates as a parasitic diode.
〇Also, when GND>(terminal B) at the transistor, a parasitic NPN transistor operates by the N-layer of other elements close to the
aforementioned parasitic diode.
With the IC’s configuration, the production of parasitic elements by the relationships of the electrical potentials is inevitable. The operation
of the parasitic elements can also interfere with the circuit operation, leading to malfunction and even destruction. Therefore, uses that
cause the parasitic elements to operate, such as applying voltage to the input terminal that is lower than the GND (P-substrate), should be
avoided.
Resistance
Transistor (NPN)
B
~
~
(Terminal A)
(Terminal B) C
E
GND
P
P
N
P board
P
P+
N
N
(Terminal A)
N
+
Parasitic Element
P+
N
N
~
~
P
+
Parasitic Element
N
P board
GND
GND
Parasitic Element
Fig.32 Simple Structure of Bipolar IC
12.)
Earth Wiring Pattern
Where there are both a small signal GND and a large current GND, it is recommended that large current GND pattern and
small signal GND pattern are separated, and that there is an earth at the set’s control point so that the pattern wiring’s
resistance and voltage change from the large current doesn’t change the small signal GND’s voltage. Ensure that the
GND wiring patterns for external parts do not fluctuate.
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© 2009 ROHM Co., Ltd. All rights reserved.
18/19
2009.04 - Rev.A
Technical Note
BD9202EFS
Selecting a Model Name When Ordering
B
D
9
ROHM model name
2
0
2
E
Part number
F
−
S
E
2
Taping type
E2 = Reel-wound embossed taping
Package type
EFS = HTSSOP
HTSSOP-A44
<Dimension>
<Tape and Reel information>
18.5±0.1
(MAX 18.85 include BURR)
(6.0)
0.5±0.15
1.0±0.2
(5.0)
1
1PIN MARK
22
1500pcs
E2
(The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand)
1234
1234
1234
1234
1234
1234
1234
0.08 S
0.37 +0.05
-0.04
Quantity
Direction
of feed
0.17 +0.05
-0.03
S
0.8
Embossed carrier tape
1234
1.0MAX
0.85±0.05
0.08±0.05
0.85
4 +6
-4
23
9.5±0.2
7.5±0.1
44
Tape
0.08 M
Reel
(Unit:mm)
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© 2009 ROHM Co., Ltd. All rights reserved.
1pin
Direction of feed
※When you order , please order in times the amount of package quantity.
19/19
2009.04 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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R0039A